公开(公告)号：US09994741B2

公开(公告)日：2018-06-12

申请号：US14967353

申请日：2015-12-13

申请人： James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

发明人： James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

IPC分类号： C08K3/04 ,  C09J9/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  C09J11/04 ,  C09J11/06 ,  C09J179/08 ,  C09J179/04 ,  C09J183/04 ,  B82Y30/00 ,  B82Y40/00 ,  C08K7/24 ,  C08K5/5425 ,  C08K5/5465 ,  C08K5/548 ,  C08K5/544

CPC分类号： C09J9/00 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/041 ,  C08K5/5425 ,  C08K5/544 ,  C08K5/5465 ,  C08K5/548 ,  C08K7/24 ,  C08K2201/01 ,  C09J11/04 ,  C09J11/06 ,  C09J179/04 ,  C09J179/08 ,  C09J183/04 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/11831 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/1369 ,  H01L2224/16147 ,  H01L2224/27444 ,  H01L2224/27452 ,  H01L2224/27612 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/83895 ,  H01L2224/9202 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06544 ,  Y10S977/742 ,  Y10S977/833 ,  Y10S977/843 ,  H01L2924/01006 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

摘要： The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

公开(公告)号：US20170166784A1

公开(公告)日：2017-06-15

申请号：US14967353

申请日：2015-12-13

申请人： James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

发明人： James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

IPC分类号： C09J9/00 ,  H01L25/00 ,  H01L23/00 ,  C09J183/04 ,  C09J11/06 ,  C09J179/08 ,  C09J179/04 ,  H01L25/065 ,  C09J11/04

CPC分类号： C09J9/00 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/041 ,  C08K5/5425 ,  C08K5/544 ,  C08K5/5465 ,  C08K5/548 ,  C08K7/24 ,  C08K2201/01 ,  C09J11/04 ,  C09J11/06 ,  C09J179/04 ,  C09J179/08 ,  C09J183/04 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/11831 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/1369 ,  H01L2224/16147 ,  H01L2224/27444 ,  H01L2224/27452 ,  H01L2224/27612 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/83895 ,  H01L2224/9202 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06544 ,  Y10S977/742 ,  Y10S977/833 ,  Y10S977/843 ,  H01L2924/01006 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

摘要： The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.