公开(公告)号：US20240316848A1

公开(公告)日：2024-09-26

申请号：US18578109

申请日：2022-06-10

申请人： THE JAPAN STEEL WORKS, LTD.

发明人： Souma MITANI

IPC分类号： B29C45/40 ,  B29C45/64

CPC分类号： B29C45/4005 ,  B29C45/64

摘要： A mold clamping device includes: a fixed platen; a movable platen; a rotary platen provided on one platen of the fixed platen and the movable platen, to which a mold is attachable; and an extrusion device provided on the one platen and configured to extrude a molded article from the mold. The rotary platen is disposed at a side of a surface of the one platen facing the other platen to face the one platen and is rotatable via a bearing structure. The extrusion device is disposed on a surface of the one platen opposite to the surface facing the other platen. The bearing structure is configured to bear the rotary platen at a position away from a rotation center in a radial direction. The extrusion device has an ejector rod that protrudes radially inward than the bearing structure.

公开(公告)号：US20240208123A1

公开(公告)日：2024-06-27

申请号：US17848234

申请日：2022-06-23

申请人： Meta Platforms Technologies, LLC

发明人： Christopher Jack BROWN ,  Kurt JENKINS

IPC分类号： B29C45/64 ,  B29C45/26 ,  B29C45/73

CPC分类号： B29C45/64 ,  B29C45/26 ,  B29C45/73 ,  B29L2011/0016

摘要： A mold assembly includes a first mold, a second mold, and a lock mounted on one of the first mold or the second mold and releasably coupled with the other of the first mold or the second mold for maintaining a position of the other of the first mold or the second mold relative to the one of the first mold or the second mold while the lock is in a closed position. Also disclosed are a molding apparatus and a method for molding.

公开(公告)号：US11992982B2

公开(公告)日：2024-05-28

申请号：US17602285

申请日：2020-02-27

申请人： TOWA Corporation

发明人： Yoshito Okunishi ,  Fuyuhiko Ogawa ,  Hideyuki Sakai

IPC分类号： B29C45/02 ,  B29C33/12 ,  B29C45/14 ,  B29C45/36 ,  B29C45/40 ,  B29C45/56 ,  B29C45/64 ,  B29C45/80 ,  B29C45/37 ,  B29C45/66

CPC分类号： B29C45/02 ,  B29C33/12 ,  B29C45/021 ,  B29C45/14065 ,  B29C45/36 ,  B29C45/4005 ,  B29C45/56 ,  B29C45/64 ,  B29C45/80 ,  B29C45/14639 ,  B29C2045/14663 ,  B29C45/376 ,  B29C2045/569 ,  B29C2045/664

摘要： Provided is a resin molding apparatus that can suppress a molding problem caused by a variation in a thickness of an object to be molded or suppress a variation in a thickness of a resin molded part, and can perform a mold releasing operation. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that a height position of one mold cavity block is set using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a mold releasing operation can be performed using the one mold wedge mechanism and the one mold cavity block driving mechanism.

公开(公告)号：US20240051199A1

公开(公告)日：2024-02-15

申请号：US18270479

申请日：2021-11-15

申请人： TOWA CORPORATION

发明人： Fuyuhiko OGAWA ,  Yoshito OKUNISHI

IPC分类号： B29C45/02 ,  B29C45/64 ,  B29C45/34 ,  B29C45/76 ,  B29C45/77 ,  B29C45/80

CPC分类号： B29C45/02 ,  B29C45/64 ,  B29C45/34 ,  B29C45/7613 ,  B29C45/7653 ,  B29C45/77 ,  B29C45/80 ,  B29C2945/76498 ,  B29C2945/76678 ,  B29C2945/76869 ,  B29C2945/76545 ,  B29C2945/76598 ,  B29C2945/76568 ,  B29C2945/76702 ,  B29C2945/76742

摘要： The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by means of a plunger; and a controller that uses the relationship between the position of the plunger and a resin filling rate for the cavity calculated on the basis of the volume of a chip arranged on the substrate and the volume of the resin material when performing filling rate correspondence control for controlling operation relating to resin molding triggered as a result of the plunger arriving at a position corresponding to a predetermined resin filling rate.

公开(公告)号：US10016917B2

公开(公告)日：2018-07-10

申请号：US14337716

申请日：2014-07-22

申请人： Tyco Electronics (Shanghai) Co Ltd.

发明人： Dandan Zhang ,  Lvhai Hu ,  Fengchun Xie

IPC分类号： B29C45/14 ,  B29C45/64 ,  B29C45/72 ,  B29D99/00 ,  B29K101/12 ,  B29K105/00 ,  B29L31/26

CPC分类号： B29C45/14 ,  B29C45/64 ,  B29C45/7207 ,  B29D99/0053 ,  B29K2101/12 ,  B29K2105/0061 ,  B29L2031/265

摘要： A method of injecting a sealing gel into a predetermined structure for a work piece is provided. The method includes the following steps: providing a molding tool with an insertion structure shaped with respect to compliment the predetermined structure, enclosing a local region of a recess of the work piece with the molding tool, injecting a fluid sealing gel into the molding tool, and dismantling the molding tool after the sealing gel has cooled to a solid state.

公开(公告)号：US09895835B2

公开(公告)日：2018-02-20

申请号：US14777632

申请日：2014-03-20

申请人： NOK CORPORATION

发明人： Shotaro Koga ,  Tetsuya Urakawa ,  Takeshi Masaka ,  Yoshihiro Kurano ,  Shigeru Watanabe ,  Toshihiro Shimazoe

IPC分类号： B29C45/27 ,  B29C45/14 ,  B29C45/17 ,  B29C45/28 ,  B29C33/34 ,  B29C45/04 ,  H01M8/0284 ,  H01M8/0286 ,  B29C33/38 ,  B29C45/00 ,  B29C45/32 ,  B29C45/64 ,  B29L31/26 ,  B29C45/06 ,  B29L31/34 ,  H01M8/0273 ,  B29K21/00

CPC分类号： B29C45/2756 ,  B29C33/34 ,  B29C33/38 ,  B29C45/0001 ,  B29C45/0025 ,  B29C45/0416 ,  B29C45/06 ,  B29C45/14336 ,  B29C45/1759 ,  B29C45/28 ,  B29C45/32 ,  B29C45/64 ,  B29C2045/067 ,  B29K2021/00 ,  B29K2905/00 ,  B29L2031/265 ,  B29L2031/3468 ,  H01M8/0273 ,  H01M8/0284 ,  H01M8/0286

摘要： In order to achieve lower costs in a molding apparatus using a mold by reducing mold cleaning steps following releasing of the product from the mold and shortening the molding cycle, the apparatus is equipped with a plurality of fixed molds and movable molds which are heated to the temperature necessary to harden a molding material and come together by means of clamping to form a cavity, and a non-heated cold runner which supplies the molding material from an injection device to the interior of the cavity via a gate opened in the movable mold, the fixed molds and movable molds being movable between an injection stage where the injection device and cold runner (32) are present and an opening stage near the injection stage.

公开(公告)号：US20170326764A1

公开(公告)日：2017-11-16

申请号：US15520314

申请日：2015-08-24

申请人： Toshiba Kikai Kabushiki Kaisha

发明人： Nobuyuki ASANUMA

IPC分类号： B29C45/14 ,  B29C45/64 ,  B29C45/72 ,  B29K501/12

CPC分类号： B29C45/1418 ,  B29C45/14008 ,  B29C45/14336 ,  B29C45/14786 ,  B29C45/64 ,  B29C45/7207 ,  B29C2045/14286 ,  B29C2045/14295 ,  B29K2501/12

摘要： An insert member (100) heated by a heating device (13) is conveyed, by means of a conveyance device (12), into a mold (51). Next, shaping is performed on the insert member (100) inside the mold (51), with the mold (51) being open by a minute distance. A molding material (91) is injected into the mold (51) and pressed while closing the mold (51) which has been open by the minute distance to thereby mold a molded article (80) including the insert member (100).

公开(公告)号：US09802351B2

公开(公告)日：2017-10-31

申请号：US14945038

申请日：2015-11-18

申请人： Husky Injection Molding Systems Ltd.

发明人： Christophe Halter ,  Pierre Glaesener ,  François Styga

IPC分类号： B29C45/76 ,  B29C45/80 ,  B29D1/00 ,  B29C45/17 ,  B29C45/40 ,  B29C45/42 ,  B29C45/64 ,  B29C45/26 ,  B29C45/04 ,  B29C45/66 ,  B29C45/36 ,  B29L31/00

CPC分类号： B29C45/7626 ,  B29C45/04 ,  B29C45/1761 ,  B29C45/1769 ,  B29C45/2618 ,  B29C45/40 ,  B29C45/4005 ,  B29C45/4225 ,  B29C45/64 ,  B29C45/66 ,  B29C45/76 ,  B29C45/80 ,  B29C2045/1785 ,  B29C2045/363 ,  B29C2045/4068 ,  B29C2045/4078 ,  B29C2945/76387 ,  B29C2945/76418 ,  B29C2945/76732 ,  B29D1/00 ,  B29L2031/748 ,  Y10S425/809

摘要： An in-mold shutter (140) for embedding in an injection mold (100, 200, 300) is described herein. The in-mold shutter (140, 240, 340, 440, 540) includes a shutter actuator (148, 548) that is configured to selectively engage a first mold shoe (130) of the injection mold (100, 200, 300) with a platen of a mold clamping assembly (996) to hold the first mold shoe (130) in an extended position (E), along a mold-stroke axis (X), during a step of molding a first molded article (102A) in the injection mold (100, 200, 300). Also described herein is a molded article transfer device (150, 250) for use with the injection mold (100, 200, 300). The molded article transfer device (150, 250) includes a shuttle (154) that is slidably arranged, in use, within the injection mold (100, 200, 300). The shuttle (154) defines a first aperture (156A), at least in part, that alternately accommodates: (i) a first mold stack (106A, 206A, 306A) arranged therein; and (ii) a first molded article (102A) received therein with opening of the first mold stack (106A, 206A, 306A).

公开(公告)号：US20170217064A1

公开(公告)日：2017-08-03

申请号：US15417685

申请日：2017-01-27

申请人： FANUC Corporation

发明人： Zhenxing LI ,  Koichi NISHIMURA ,  Satoshi YANO ,  Keisuke SUGAHARA

IPC分类号： B29C45/17 ,  B29C45/64 ,  B29C45/03 ,  F16M11/16 ,  F16M11/04

CPC分类号： B29C45/1742 ,  B29C45/03 ,  B29C45/07 ,  B29C45/17 ,  B29C45/64 ,  F16M11/041 ,  F16M11/043 ,  F16M11/16

摘要： A mounting stand for an injection molding machine has a base member and an erecting member, to which an injection apparatus is attached, vertically arranged on the base member, and is movable with respect to a support supporting the base member. The mounting stand includes a base member protruding portion provided upward from the base member around a portion at which the base member comes into contact with the erecting member, and an anchored portion at which a side surface of the base member protruding portion is anchored to a side surface of the erecting member.

公开(公告)号：US20170165889A1

公开(公告)日：2017-06-15

申请号：US15378874

申请日：2016-12-14

申请人： IMFLUX INC.

发明人： Brian Matthew Burns ,  Gene Michael Altonen

IPC分类号： B29C45/77 ,  B29C45/64 ,  B29C31/04 ,  B29C45/82 ,  B29C45/18

CPC分类号： B29C45/77 ,  B29C31/04 ,  B29C45/18 ,  B29C45/64 ,  B29C45/76 ,  B29C45/82 ,  B29C2945/76006 ,  B29C2945/7604 ,  B29C2945/76193 ,  B29C2945/76214 ,  B29C2945/7626 ,  B29C2945/76367 ,  B29C2945/76381 ,  B29C2945/76568 ,  B29C2945/76665 ,  B29C2945/76859 ,  B29C2945/76936 ,  B29C2945/76969 ,  B29C2945/76993 ,  B29K2101/12

摘要： A remote controller can be provided on any apparatus that employs feedback control from a native controller to add functionality to the apparatus where the native controller is not capable of providing such functionality independently.