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公开(公告)号:US20240316848A1
公开(公告)日:2024-09-26
申请号:US18578109
申请日:2022-06-10
Applicant: THE JAPAN STEEL WORKS, LTD.
Inventor: Souma MITANI
CPC classification number: B29C45/4005 , B29C45/64
Abstract: A mold clamping device includes: a fixed platen; a movable platen; a rotary platen provided on one platen of the fixed platen and the movable platen, to which a mold is attachable; and an extrusion device provided on the one platen and configured to extrude a molded article from the mold. The rotary platen is disposed at a side of a surface of the one platen facing the other platen to face the one platen and is rotatable via a bearing structure. The extrusion device is disposed on a surface of the one platen opposite to the surface facing the other platen. The bearing structure is configured to bear the rotary platen at a position away from a rotation center in a radial direction. The extrusion device has an ejector rod that protrudes radially inward than the bearing structure.
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公开(公告)号:US20240308160A1
公开(公告)日:2024-09-19
申请号:US18562055
申请日:2022-04-26
Applicant: Green Energy Robotics Ltd
Inventor: Jack MUNRO , Harri LEWIS , David Lee-Jones
IPC: B29C73/02 , B29C45/14 , B29C45/26 , B29C45/64 , B29C45/66 , B29C73/28 , B29K83/00 , B29L31/08 , F03D80/50
CPC classification number: B29C73/025 , B29C45/14336 , B29C45/2602 , B29C45/641 , B29C45/66 , B29C73/28 , F03D80/502 , B29K2083/00 , B29L2031/085 , F05B2230/21 , F05B2230/80
Abstract: A mould tool is disclosed, for use in repairing the eroded leading edge of a wind turbine blade. The mould tool comprises a flexible sheet and a framework which is flexible in one direction, for conforming to the curved edge of the blade, but rigid in the other direction. The mould tool may include tapered side walls. Preferably, a method or repair involves use of a mould tool with tapered side walls, and use of a similar mould tool which lacks the tapered side walls. To repair a section of the edge of a turbine blade, first stripes of resin are injected, spaced apart along the length of the section, using the mould with side walls. The gaps between the stripes are then filled using the mould without side walls.
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公开(公告)号:US20240208123A1
公开(公告)日:2024-06-27
申请号:US17848234
申请日:2022-06-23
Applicant: Meta Platforms Technologies, LLC
Inventor: Christopher Jack BROWN , Kurt JENKINS
CPC classification number: B29C45/64 , B29C45/26 , B29C45/73 , B29L2011/0016
Abstract: A mold assembly includes a first mold, a second mold, and a lock mounted on one of the first mold or the second mold and releasably coupled with the other of the first mold or the second mold for maintaining a position of the other of the first mold or the second mold relative to the one of the first mold or the second mold while the lock is in a closed position. Also disclosed are a molding apparatus and a method for molding.
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公开(公告)号:US20240198569A1
公开(公告)日:2024-06-20
申请号:US18540270
申请日:2023-12-14
Applicant: The Japan Steel Works, Ltd.
Inventor: Keigo SUSA , Motomu FURUMOTO
CPC classification number: B29C45/641 , B29C45/1756 , B29C45/20 , B29C45/2602 , B29C45/401 , B29C45/7626 , B29C45/7653 , B29C2045/645 , B29C2945/76113 , B29C2945/76157 , B29C2945/76505 , B29C2945/76598
Abstract: An injection molding machine has a clamp that generates electromagnetic force and that secures a moving plate or a fixed plate using attractive force that is produced by the electromagnetic force; and a controller that controls separation force that acts on the moving plate or the fixed plate such that the separation force is less than the attractive force.
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公开(公告)号:US11992982B2
公开(公告)日:2024-05-28
申请号:US17602285
申请日:2020-02-27
Applicant: TOWA Corporation
Inventor: Yoshito Okunishi , Fuyuhiko Ogawa , Hideyuki Sakai
IPC: B29C45/02 , B29C33/12 , B29C45/14 , B29C45/36 , B29C45/40 , B29C45/56 , B29C45/64 , B29C45/80 , B29C45/37 , B29C45/66
CPC classification number: B29C45/02 , B29C33/12 , B29C45/021 , B29C45/14065 , B29C45/36 , B29C45/4005 , B29C45/56 , B29C45/64 , B29C45/80 , B29C45/14639 , B29C2045/14663 , B29C45/376 , B29C2045/569 , B29C2045/664
Abstract: Provided is a resin molding apparatus that can suppress a molding problem caused by a variation in a thickness of an object to be molded or suppress a variation in a thickness of a resin molded part, and can perform a mold releasing operation. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that a height position of one mold cavity block is set using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a mold releasing operation can be performed using the one mold wedge mechanism and the one mold cavity block driving mechanism.
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公开(公告)号:US20240051199A1
公开(公告)日:2024-02-15
申请号:US18270479
申请日:2021-11-15
Applicant: TOWA CORPORATION
Inventor: Fuyuhiko OGAWA , Yoshito OKUNISHI
CPC classification number: B29C45/02 , B29C45/64 , B29C45/34 , B29C45/7613 , B29C45/7653 , B29C45/77 , B29C45/80 , B29C2945/76498 , B29C2945/76678 , B29C2945/76869 , B29C2945/76545 , B29C2945/76598 , B29C2945/76568 , B29C2945/76702 , B29C2945/76742
Abstract: The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by means of a plunger; and a controller that uses the relationship between the position of the plunger and a resin filling rate for the cavity calculated on the basis of the volume of a chip arranged on the substrate and the volume of the resin material when performing filling rate correspondence control for controlling operation relating to resin molding triggered as a result of the plunger arriving at a position corresponding to a predetermined resin filling rate.
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公开(公告)号:US20220371239A1
公开(公告)日:2022-11-24
申请号:US17750502
申请日:2022-05-23
Applicant: Seiko Epson Corporation
Inventor: Hidenobu MARUYAMA
Abstract: An injection molding unit includes a main unit and an optional unit, the main unit accommodating a first injection molding machine that molds an integrated product by injecting a first molding material into a cavity which is defined by a lower die and an upper die and in which an insert member is disposed. The optional unit includes at least one of a member molding unit that accommodates a second injection molding machine that molds the insert member by injecting a second molding material or a press molding machine that molds the insert member in press molding, and a robot unit that accommodates a robot that performs placement operation of placing the insert member in the cavity or transport operation of transporting the integrated product molded by the first injection molding machine. The main unit is so configured that the optional unit is attachable thereto and detachable therefrom.
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公开(公告)号:US20220234263A1
公开(公告)日:2022-07-28
申请号:US17580701
申请日:2022-01-21
Applicant: Seiko Epson Corporation
Inventor: Tatsuya TSUBOI
Abstract: The injection molding apparatus includes a fixed mold, a movable mold facing the fixed mold, a mold clamping unit that moves the movable mold with respect to the fixed mold, and an injection unit that injects a molten material into a cavity defined by the fixed mold and the movable mold. At least one of the fixed mold and the movable mold is formed with a flow path communicating with the cavity, and a working fluid that pressurizes and pushes out a molded article in the cavity flows through the flow path.
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公开(公告)号:US20220016817A1
公开(公告)日:2022-01-20
申请号:US17379034
申请日:2021-07-19
Applicant: DME COMPANY LLC
Inventor: Peng CHENG
Abstract: A mold latch having a latch bar and a traveler with two linear followers that can co-act with the latch bar to enable a mold plate, to which the traveler is attached, to translate together in a direction with another mold plate, to which latch bar is attached.
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公开(公告)号:US11225007B2
公开(公告)日:2022-01-18
申请号:US16165558
申请日:2018-10-19
Applicant: ENGEL AUSTRIA GmbH
Inventor: Friedrich Johann Kilian , Friedrich Pernkopf , Stephan Eppich
Abstract: A method for moving a movable mold mounting plate of a molding machine, wherein the movable mold mounting plate is movable relative to a stationary mold mounting plate and the mold mounting plates are kinematically connected to each other, wherein molding tool parts arranged on the mold mounting plates are brought into abutment to each other in a closed state and wherein the movable mold mounting plate is moved by a drive mechanism and/or the stationary mold mounting plate is moved by an injection device such that, when reaching a predeterminable distance of the mold mounting plates relative to each other, a parameter representing a tilting movement of the mold mounting plates relative to each other is less than or equal to a presettable value.
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