摘要:
Provided are a molding method for efficiently and accurately performing molding of a layered component made of a thermosetting resin by a simple mechanism, and molded articles. For this purpose, primary molding for molding a plurality of divided bodies and secondary molding for joining the plurality of divided bodies with one another are performed sequentially.
摘要:
A multi-material mold and a method of constructing a multi-material mold for injection molding using additive manufacturing comprises defining a structure of the mold; and defining at least two sub-regions, associating the sub-regions with respective specific materials and printing the sub-regions with the specific material. The sub-regions may include an internal sub-region that allows dissipation of heat accumulating during use of the mold, where the specific material is heat conductive; an embedded heat sink sub-region for conducting heat away from the internal sub-region allowing dissipation, where the specific material is relatively non-conductive mold material embedded with lines or layers of relatively heat-conductive material; a sub-region resistant to abrasion, where the specific material is an abrasion-resistant polymer; a sub-region resistant to breaking under process conditions, where the specific material is a high toughness and high Tg polymer or a digital material and a sub-region of flexible material for sealing and releasing.
摘要:
A plastic component is provided that leads to an initial friction reduction with a friction partner. At least part of the surface of the plastic component, which interacts with a surface of a friction partner, is provided with a plurality of structures. The structures are composed of at least one structure type. Between two adjacent structure types, a distance is formed in the range of 10 microns to 1 mm. A width of the structure types is in the range of 10 microns to 100 microns. A height or depth of the structure types is in the range from 1 micron to 100 microns.
摘要:
A molding method for a synthetic resin molding reduces a disturbed flow of molten resin at a side edge of a molding body during injection molding, and allows the design surface of the molding body to have aesthetic appearance. The synthetic resin molding includes a bend arranged on a side edge of the molding body and bending toward its back surface, and a flange protruding laterally from the bend and including a notch. The molding method includes arranging a gate at a position corresponding to an end of one side of the flange in a longitudinal direction and performing injection molding using a colored resin material containing a luster agent kneaded in the material, and forming a thin portion of the bend in a longitudinal direction of the bend to form a groove on a back surface of the bend.
摘要:
A molding method for a synthetic resin molding that includes a molding body, a bent portion, and a flange. The bent portion and the flange are continuous in a longitudinal direction of the side edge. The flange includes a wide portion and a narrow portion. The molding method for the synthetic resin molding includes arranging a gate at a position corresponding to an end of one side of the flange in a longitudinal direction, setting a relationship S1≦S2, where S1 is a cross-sectional area of the wide portion of the flange, and S2 is a cross-sectional area of the narrow portion of the flange adjacent to and downstream from the wide portion in a flow of molten resin, and performing injection molding using a colored resin material containing a luster agent kneaded in the material.
摘要:
A one-surface groove for wiring is formed in a front surface 2a, opposite-surface grooves for wiring are formed in a back surface 2b by protruding core members, and communication parts for allowing the one-surface groove and the opposite-surface grooves to communicate with each other are formed to shape a board section 2 made of a non-conductive resin. After the core members are retracted, a conduction-side resin, which will become conductive, is shaped in the one-surface groove, the opposite-surface grooves, and the communication parts to form front-side wiring 3, communication wirings 4, and back-side wirings 5, whereby a wiring circuit component is provided.
摘要:
A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.
摘要:
Collection of biological fluids. At least some of the example embodiments are methods including: placing a lower mold component, the lower mold component structurally defines a negative image of an insertion end of a polymeric sleeve; stacking into mating relationship a first disk member, the first disk member structural defines a negative image of an anterior volume vented to atmosphere on the insertion end of the polymeric sleeve; coupling a rod member to the disk member, an exterior surface of the rod member defines a negative image of a main passageway through the polymeric sleeve; closing an outer mold assembly around the rod member, an interior surface of the outer mold assembly structurally defines a negative image of an outer surface of the polymeric sleeve; and injecting a polymeric compound in a liquid state into the outer mold assembly.
摘要:
A bearing member includes a concave section receiving a spherical body therein, and swing grooves into which end sections of a rotating force transmission pin are inserted. The swing groove at least includes a parallel part an axis and a curved part, an undercut section is not provided in the concave section when the concave section is viewed from an opened side of the concave section in a direction of the axis of the bearing member, and a clearance between the two swing grooves in a direction which is orthogonal to the direction of the axis on the opened side of the concave section is shorter than a distance between both ends of the rotating force transmission pin in the direction which is orthogonal to the axis of the bearing member even when the shaft member is mounted on the bearing member in a posture inclined at the most.
摘要:
A variable-position mold system with a plurality of injection systems operable to deliver molten material at a substantially constant pressure of between about 6.89 megapascals (1,000 psi) and about 103.42 megapascals (15,000 psi) to a set of mold cavities of at least one multi-cavity injection mold insert when in fluid communication therewith. The multi-cavity injection mold inserts have a thermal conductivity of greater than 30 BTU/HR FT ° F., and have little or no cooling channels therein.