知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

107 records (took 0.018 seconds)

    LASER ANNEALING DEVICE
    8.
    发明申请
    LASER ANNEALING DEVICE 审中-公开

    公开(公告)号：US20170144251A1

    公开(公告)日：2017-05-25

    申请号：US15323544

    申请日：2015-07-03

    Applicant: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.

    Inventor： Chunfeng SONG ,  Pengli ZHANG ,  Hailiang LU

    IPC: B23K26/064 ,  B23K26/70 ,  H01L21/268 ,  B23K26/00

    CPC classification number: B23K26/064 ,  B23K26/0006 ,  B23K26/0608 ,  B23K26/352 ,  B23K26/704 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/268

    Abstract: A laser annealing apparatus for annealing a silicon wafer placed on a wafer stage is disclosed which includes: a laser light source for generating a light beam; a first optical unit, configured to convert the light beam generated by the laser light source into a polarized light beam of a first type; and a second optical unit, including a light guiding element and a first reflecting element. The light guiding element is configured to make the polarized light beam of the first type incident on and reflected by a surface of the silicon wafer for a first time along a first optical path, and the light beam reflected from the surface of the silicon wafer is further reflected by the first reflecting element and is thereby incident on the surface of the silicon wafer for a second time along a second optical path symmetrical to the first optical path and reflected by the surface to the light guiding element.

    VIA-HOLE DRILLING IN A PRINTED CIRCUIT BOARD USING A CARBON MONOXIDE LASER
    10.
    发明申请
    VIA-HOLE DRILLING IN A PRINTED CIRCUIT BOARD USING A CARBON MONOXIDE LASER 有权
    使用一氧化碳激光器的印刷电路板中的透孔钻孔

    公开(公告)号：US20150083698A1

    公开(公告)日：2015-03-26

    申请号：US14033246

    申请日：2013-09-20

    Applicant: Coherent, Inc.

    Inventor： Gongxue HUA ,  Eric R. MUELLER

    IPC: H05K3/00 ,  B23K26/06 ,  B23K26/38

    CPC classification number: H05K3/0026 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0652 ,  B23K26/382 ,  B23K26/40 ,  B23K26/704 ,  B23K2101/42 ,  B23K2103/50

    Abstract: Apparatus for drilling a via-hole in a printed circuit board (PCB) includes a carbon monoxide laser deliver laser radiation pulses. The pulses have a relatively broad wavelength-range, and slow rising and falling edges. The rising and falling edges of the pulses are clipped using and acousto-optic modulator. A dispersion-compensator compensates for dispersion in the clipped pulses introduced by the AOM. Achromatic focusing optics focus the dispersion-compensated, clipped pulses on the PCB for the via-hole drilling.

    Abstract translation: 用于在印刷电路板（PCB）中钻孔通孔的装置包括一氧化碳激光器提供激光辐射脉冲。 脉冲具有相对较宽的波长范围，并且缓慢的上升和下降沿。 使用声光调制器来限制脉冲的上升沿和下降沿。 色散补偿器补偿由AOM引入的限幅脉冲中的色散。 消色差聚焦光学器件将色散补偿的限幅脉冲聚焦在PCB上用于通孔钻孔。

Patent Agency Ranking