Abstract:
A semiconductor device according to the present invention includes on the main surface of a p substrate a storing circuit region and peripheral circuit regions. An n well surrounds a p well including the storing circuit region and a p well including the peripheral circuit regions. As a result, a capacitance element is formed in the semiconductor substrate. It is possible to miniaturize the semiconductor device, and to improve reliability of connection between elements.
Abstract:
A plurality of semiconductor integrated circuits and a plurality of TEG circuits are aligned and provided on a substrate. In the TEG circuit, a built-in test circuit is provided in a region which faces a semiconductor integrated circuit across a dicing line region. The built-in test circuit and the semiconductor integrated circuit are connected by an interconnection which is provided on the dicing line region. The interconnection is cut for isolation into chips.
Abstract:
I/O lines in an I/O gate-sense amplifier portion are arranged in the order of IOA, /IOB, IOB, and /IOA. As a result, the potentials of adjacent I/O lines are necessarily different at the time of writing/reading the same data to/from a plurality of memory cells during a multi-bit test. Therefore, a short-circuit fault caused between adjacent I/O lines can be detected at the same time.
Abstract:
In a memory cell array, data lines are formed into a hierarchical arrangement of sub data lines provided for every block and a main data line common to each block, and a sub data line selected by a column address among sub data lines belonging a block which are simultaneously selected by a row address is connected to a bit line. Accordingly, the sub data line length is reduced, which reduces floating capacitance, reading and writing operations can be conducted at a high speed, and sub data lines can be selectively operated. In addition, power required for charging the sub data lines can be reduced, and entire power consumption by the semiconductor memory device can be reduced as well.
Abstract:
In a general read out operation, data read out from a memory cell array is amplified by a preamplifier group. The amplified data is provided to a selector unit. The selector unit responds to a bit organization select signal to select data according to a predetermined bit configuration. The selected data is provided to a data bus. In a test mode, the selector unit responds to a test mode signal to provide a test result to a data bus corresponding to a predetermined bit organization. Therefore, only the required data bus is used according to the bit organization and the test mode.
Abstract:
A semiconductor device which has a sense amplifier and is supplied with an external power supply voltage includes a drive signal line connected to the sense amplifier, a step up circuit generating a first voltage from the external power supply voltage, the first voltage being higher than the external power supply voltage, and a step down circuit lowering the external power supply voltage into a second voltage. For enabling the sense amplifier to perform sensing operation in a normal mode involving external access, the first voltage is applied to the drive signal line in an initial stage of the sensing operation, and thereafter the second voltage is applied to the drive signal line. In a refresh mode not involving external access, the step up circuit is shut down, and the second voltage is applied to the drive signal line from the initial stage of the sensing operation.
Abstract:
In a semiconductor device including a row-based control circuit applied with a current reduction circuit having a standby state and an active state, a refresh control circuit generates a refresh request signal every predetermined time interval on a self-refresh mode and time-sequentially generates an internal active signal at N times in connection with the refresh request signal once. The row-based control circuit time-sequentially refreshes information of memory cells on the based of the internal active signal at the N times. The refresh control circuit inactivates the row-based control circuit by making the current reduction circuit the standby state.
Abstract:
An internal voltage generating circuit generates and supplies a boosted voltage higher than an internal power supply voltage, as an operating power supply voltage, to a sense amplifier in a read circuit for reading data of a memory cell. A bit line precharge current supplied via an internal data line is produced from the internal power supply voltage. It is possible to provide a nonvolatile semiconductor memory device, which can perform a precise sense operation and an accurate reading of data even under a low power supply voltage condition.
Abstract:
In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of −9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.
Abstract:
An internal voltage generating circuit generates and supplies a boosted voltage higher than an internal power supply voltage, as an operating power supply voltage, to a sense amplifier in a read circuit for reading data of a memory cell. A bit line precharge current supplied via an internal data line is produced from the internal power supply voltage. It is possible to provide a nonvolatile semiconductor memory device, which can perform a precise sense operation and an accurate reading of data even under a low power supply voltage condition.