Abstract:
A semiconductor device according to the present invention includes on the main surface of a p substrate a storing circuit region and peripheral circuit regions. An n well surrounds a p well including the storing circuit region and a p well including the peripheral circuit regions. As a result, a capacitance element is formed in the semiconductor substrate. It is possible to miniaturize the semiconductor device, and to improve reliability of connection between elements.
Abstract:
A plurality of semiconductor integrated circuits and a plurality of TEG circuits are aligned and provided on a substrate. In the TEG circuit, a built-in test circuit is provided in a region which faces a semiconductor integrated circuit across a dicing line region. The built-in test circuit and the semiconductor integrated circuit are connected by an interconnection which is provided on the dicing line region. The interconnection is cut for isolation into chips.
Abstract:
I/O lines in an I/O gate-sense amplifier portion are arranged in the order of IOA, /IOB, IOB, and /IOA. As a result, the potentials of adjacent I/O lines are necessarily different at the time of writing/reading the same data to/from a plurality of memory cells during a multi-bit test. Therefore, a short-circuit fault caused between adjacent I/O lines can be detected at the same time.
Abstract:
In a memory cell array, data lines are formed into a hierarchical arrangement of sub data lines provided for every block and a main data line common to each block, and a sub data line selected by a column address among sub data lines belonging a block which are simultaneously selected by a row address is connected to a bit line. Accordingly, the sub data line length is reduced, which reduces floating capacitance, reading and writing operations can be conducted at a high speed, and sub data lines can be selectively operated. In addition, power required for charging the sub data lines can be reduced, and entire power consumption by the semiconductor memory device can be reduced as well.
Abstract:
A semiconductor device having amplifying circuits provided near corresponding bonding pads receiving external signals, and positioned between the bonding pads and internal circuits to which such external signals are to be applied. The device includes a control signal generating circuit for the amplifying circuits which is not provided in conventional semiconductor devices. In response to external control signals, the control signal generating circuit generates internal control signals for controlling electric paths between a power supply and ground in the amplifying circuits. During the standby period of the semiconductor device, the paths between the power supply and ground are cut regardless of the potential of the corresponding bonding pads, preventing flow of a through current.
Abstract:
A plurality of sub chips are formed on a chip. An input/output buffer region is arranged around the plurality of sub chips. Each sub chip includes a sub chip control circuit region and a plurality of memory cell array blocks. Each memory cell array block includes a memory cell array region, a row decoder and control circuit region, a sense amplifier region and an input/output latch region.
Abstract:
A semiconductor memory device includes a memory array. The bit line pairs of the odd number order in the memory array belong to a first group, and the bit line pairs of the even number order belong to a second group. A first amplifier is connected to each bit line pair. Corresponding to the first group, write buses read buses and a read/test circuit are provided. Corresponding to the second group, write buses read buses and a read/test circuit are provided. A column decoder selects a plurality of bit line pairs simultaneously at the time of testing. At the time of testing, each of the read/test circuits compares data read out from the plurality of bit line pairs belonging to the corresponding group with a given expected data for providing the comparison result.
Abstract:
A semiconductor memory device includes a plurality of memory blocks, i main row or column select lines extending over the plurality of memory blocks, and a decoder for selecting one of the main row or column select lines in accordance with an applied address signal. The decoder includes i outputs. Each of the memory blocks includes a plurality of memory cells arranged in rows and columns and at least (i+1) sub row or column select lines each for selecting one row or one column of memory cells. A shift redundancy circuit is provided for each of the memory blocks, for connecting the main row or column select line and the sub row or column select line. The shift redundancy circuit includes a switch circuit for connecting one main row or column select line to one of the plurality of adjacent sub row or column select lines, and a circuit for setting a connection path of the switch circuit. The shift redundancy circuit connects successively adjacent sub row or column select lines to main row or column select lines in one to one correspondence except a defective sub row or column select line associated with a defective bit.
Abstract:
Column repairing circuits 7a, 7b for repairing a DRAM in which there are defective memory cells in two columns are disclosed. The connection state of switching elements or circuits 51-5n, 61-6n, 71-7 (n+1), 81-8 (n+1) is determined as illustrated by appropriately disconnecting fuses in fuse links provided respectively in circuits 7a, 7b. Accordingly, column selecting lines Y2a and Y (n+1) b in memory array blocks 891a, 891b are not activated. The two repairing circuits 7a, 7b are provided spaced apart from each other on a semiconductor substrate, so that excessive concentration of fuse elements and switching elements or circuits is prevented.
Abstract:
Disclosed is a semiconductor memory device including a normal memory array and preliminary memory array enabling a mutual data transfer. Word lines in the normal memory array and those in the preliminary memory array are controlled by separate row decoders and separate word drivers. Bit lines and sense amplifiers are provided commonly to the normal memory array and the preliminary memory array. When test data is written in a predetermined pattern into the normal memory array, data corresponding to the predetermined pattern is written in advance for each memory cell in the preliminary memory array. Then, after the row decoder and word driver for the preliminary memory array are enabled so that the word lines in the preliminary memory array are activated, the row decoder and word driver for the normal memory array are enabled so that the word lines in the preliminary memory array are activated. Thus, data signals read from memory cells of one row in the normal memory array are simultaneously amplified by the sense amplifiers via the bit lines and then transferred via the bit lines to memory cells of one row in the preliminary memory array. In this result, the test data are written at one time into the memory cells of one row in the normal memory array.