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1.发明申请METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS 审中-公开制造互连结构和低温互连组件恢复过程的方法公开(公告)号：US20080313894A1
公开(公告)日：2008-12-25
申请号：US11766315
申请日：2007-06-21
IPC分类号： H05K3/34
CPC分类号： H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/221 , H01L2224/73267 , H01L2224/83132 , H01L2224/92144 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H05K1/185 , H05K3/305 , H05K3/4644 , Y10T29/4913 , Y10T29/49144 , Y10T29/49169 , H01L2224/82 , H01L2924/00
摘要： A method is provided for making an interconnect structure. The method includes applying a low-temperature removable layer and adhesive layer to an electronic device or to a base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.
摘要翻译： 提供了一种制造互连结构的方法。 该方法包括将低温可移除层和粘合剂层施加到电子器件或基底绝缘层; 以及使用所述粘合剂层将所述电子器件固定到所述基底绝缘层。
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2.发明申请METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS 审中-公开制造互连结构和互连组件恢复过程的方法公开(公告)号：US20080318413A1
公开(公告)日：2008-12-25
申请号：US11766302
申请日：2007-06-21
申请人： Raymond Albert Fillion , David Richard Esler , Jeffrey Scott Erlbaum , Ryan Christopher Mills , Charles Gerard Woychik
发明人： Raymond Albert Fillion , David Richard Esler , Jeffrey Scott Erlbaum , Ryan Christopher Mills , Charles Gerard Woychik
IPC分类号： H01L21/4763
CPC分类号： H01L24/19 , H01L21/563 , H01L23/3128 , H01L23/5389 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/20 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L24/97 , H01L24/98 , H01L2224/0401 , H01L2224/04105 , H01L2224/05082 , H01L2224/051 , H01L2224/05155 , H01L2224/05166 , H01L2224/056 , H01L2224/05644 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/20 , H01L2224/2101 , H01L2224/221 , H01L2224/2919 , H01L2224/32221 , H01L2224/73204 , H01L2224/73267 , H01L2224/81815 , H01L2224/8185 , H01L2224/83132 , H01L2224/8385 , H01L2224/92135 , H01L2224/92144 , H01L2224/95 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2224/19 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/0105 , H01L2924/014
摘要： A method is provided for making an interconnect structure. The method includes applying a removable layer to an electronic device or to a base insulative layer; applying an adhesive layer to the electronic device or to the base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.
摘要翻译： 提供了一种制造互连结构的方法。 该方法包括将可移除层应用于电子设备或基底绝缘层; 将粘合剂层施加到电子装置或基底绝缘层上; 以及使用所述粘合剂层将所述电子器件固定到所述基底绝缘层。
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公开(公告)号：US20080318055A1
公开(公告)日：2008-12-25
申请号：US11766356
申请日：2007-06-21
申请人： Raymond Albert Fillion , David Richard Esler , Jeffrey Scott Erlbaum , Ryan Christopher Mills , Charles Gerard Woychik
发明人： Raymond Albert Fillion , David Richard Esler , Jeffrey Scott Erlbaum , Ryan Christopher Mills , Charles Gerard Woychik
CPC分类号： H01L24/19 , H01L23/3128 , H01L23/36 , H01L23/5389 , H01L24/20 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/20 , H01L2224/221 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83132 , H01L2224/83191 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K1/0203 , H05K1/185 , H05K3/305 , H05K3/4644 , H05K2201/1056 , H05K2201/10674 , H05K2201/10984 , H05K2201/2018 , H05K2203/1469 , H05K2203/176 , Y02P70/613 , Y10T428/31507 , H01L2224/24227 , H01L2924/014 , H01L2924/00
摘要： An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface, and the electronic device being secured to the base insulative layer; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer is capable of releasing the base insulative layer from the electronic device. The removal may be done without damage to a predetermined part of the electronic component.
摘要翻译： 电子部件包括具有第一表面和第二表面的基底绝缘层; 具有第一表面和第二表面的电子设备，并且所述电子设备固定到所述基底绝缘层; 设置在电子设备的第一表面和基底绝缘层的第二表面之间的粘合剂层; 以及设置在电子设备的第一表面和基底绝缘层的第二表面之间的可移除层。 基底绝缘层通过可移除层固定到电子设备。 可拆卸层能够从电子设备释放基底绝缘层。 可以在不损坏电子部件的预定部分的情况下进行移除。
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公开(公告)号：US20080318054A1
公开(公告)日：2008-12-25
申请号：US11766340
申请日：2007-06-21
CPC分类号： H01L24/20 , H01L21/563 , H01L23/3128 , H01L23/36 , H01L23/5389 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L24/97 , H01L24/98 , H01L2224/0401 , H01L2224/04105 , H01L2224/05082 , H01L2224/051 , H01L2224/05155 , H01L2224/05166 , H01L2224/056 , H01L2224/05644 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/20 , H01L2224/2101 , H01L2224/221 , H01L2224/2919 , H01L2224/32221 , H01L2224/32225 , H01L2224/73204 , H01L2224/73267 , H01L2224/81815 , H01L2224/8185 , H01L2224/83005 , H01L2224/83132 , H01L2224/83191 , H01L2224/8385 , H01L2224/92135 , H01L2224/92144 , H01L2224/95 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , Y10T428/31507 , H01L2924/014 , H01L2224/19 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0105
摘要： An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface, and the electronic device being secured to the base insulative layer; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer releases the base insulative layer from the electronic device at a sufficiently low temperature.
摘要翻译： 电子部件包括具有第一表面和第二表面的基底绝缘层; 具有第一表面和第二表面的电子设备，并且所述电子设备固定到所述基底绝缘层; 设置在电子设备的第一表面和基底绝缘层的第二表面之间的粘合剂层; 以及设置在电子设备的第一表面和基底绝缘层的第二表面之间的可移除层。 基底绝缘层通过可移除层固定到电子设备。 可去除层在足够低的温度下从电子器件释放基极绝缘层。
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公开(公告)号：US20080121845A1
公开(公告)日：2008-05-29
申请号：US11503523
申请日：2006-08-11
CPC分类号： C08G65/18
摘要： An underfill composition including a polymer precursor is provided. The polymer precursor includes 4 or more pendant oxetane functional groups. The underfill composition includes greater than about 20 weight percent of the polymeric precursor. Associated article and method are also provided.
摘要翻译： 提供了包含聚合物前体的底部填充组合物。 聚合物前体包括4个或更多个侧链氧杂环丁烷官能团。 底部填充剂组合物包含大于约20重量％的聚合物前体。 还提供了相关的文章和方法。
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公开(公告)号：US06833482B1
公开(公告)日：2004-12-21
申请号：US10681492
申请日：2003-10-07
IPC分类号： C07L3912
摘要： Disclosed is a method for preparing a bis(hydroxy-aromatic) compound which comprises the steps of: contacting at least one halo-substituted hydroxy-aromatic compound in a solvent mixture comprising water and at least one organic solvent in the presence of at least one base, at least one catalyst comprising palladium and hydrogen gas at a pressure in a range of between atmospheric pressure and 350 Kilopascals.
摘要翻译： 公开了一种制备双（羟基 - 芳族）化合物的方法，其包括以下步骤：使至少一种卤素取代的羟基 - 芳族化合物在包含水和至少一种有机溶剂的溶剂混合物中，在至少一种 碱，至少一种催化剂，其包含在大气压和350千帕斯卡之间范围内的压力下的钯和氢气。
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7.发明授权Method for preparing hydroquinones and dihydroxybiphenyl compounds from mixtures of bromophenols and benzoquinones 有权从溴酚和苯醌的混合物制备氢醌和二羟基联苯化合物的方法公开(公告)号：US06815565B2
公开(公告)日：2004-11-09
申请号：US10704002
申请日：2003-11-07
IPC分类号： C07C3924
摘要： A method is described for the simultaneous preparation of p-bromophenols and p-benzoquinones, intermediates useful in the preparation of hydroquinones and 4,4′-dihydroxybiphenyls, respectively. Hydroquinones and 4,4′-dihydroxybiphenyls are useful monomers for the preparation of a variety of polymers. The method also comprises reducing the p-benzoquinone to its corresponding hydroquinone in the presence of the p-bromophenol. Limiting the amount of HBr present in the reaction mixture was shown to control the amount of benzoquinone produced. The method also allows for the recycling of many of the reagents used, thereby reducing the cost of producing each monomer.
摘要翻译： 描述了同时制备对溴苯酚和对苯醌的方法，分别用于制备氢醌和4,4'-二羟基联苯的中间体。 氢醌和4,4'-二羟基联苯是用于制备各种聚合物的有用单体。 该方法还包括在对溴苯酚的存在下将对苯醌还原成其对应的氢醌。 显示出限制反应混合物中存在的HBr的量来控制所产生的苯醌的量。 该方法还允许循环使用许多试剂，从而降低生产每种单体的成本。
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公开(公告)号：US20080039560A1
公开(公告)日：2008-02-14
申请号：US11503497
申请日：2006-08-11
申请人： Ryan Christopher Mills , Slawomir Rubinsztajn , David Richard Esler , David Adrew Simon , Kenneth Steven Wheelock
发明人： Ryan Christopher Mills , Slawomir Rubinsztajn , David Richard Esler , David Adrew Simon , Kenneth Steven Wheelock
摘要： A syneretic composition is provided. The syneretic composition includes a first curable material comprising an alcohol and an anhydride, and a second curable material. At a first temperature (T1) the first curable material cures to form a polymeric matrix, and the second curable material has a degree of conversion that is less than 50 percent. The second curable material is liquid and capable of exuding from the polymeric matrix at a syneresis temperature (Tsyn). A method and an article are provided also.
摘要翻译： 提供了一种综合组合物。 该共同组合物包括包含醇和酸酐的第一可固化材料和第二可固化材料。 在第一温度（T 1→1）下，第一可固化材料固化形成聚合物基质，第二可固化材料的转化度小于50％。 第二可固化材料是液体的并且能够以脱水收缩温度（T> syn syn）从聚合物基质中渗出。 还提供了一种方法和物品。
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公开(公告)号：US07053251B2
公开(公告)日：2006-05-30
申请号：US10650566
申请日：2003-08-28
IPC分类号： C07L39/24
摘要： A method for brominating hydroxyaromatic compounds to form products, such as p-bromophenol, is disclosed. The method uses elemental bromine as the brominating agent and comprises contacting a hydroxyaromatic compound with bromine and oxygen in the presence of metal catalyst. Suitable catalysts include elemental copper, copper compounds, and compounds of Group IV–VIII transition metals.
摘要翻译： 公开了用于溴化羟基芳族化合物以形成产物的方法，例如对溴苯酚。 该方法使用元素溴作为溴化剂，并且包括在金属催化剂存在下使羟基芳族化合物与溴和氧接触。 合适的催化剂包括元素铜，铜化合物和IV-VIII族过渡金属的化合物。
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公开(公告)号：US20080039608A1
公开(公告)日：2008-02-14
申请号：US11503498
申请日：2006-08-11
IPC分类号： C08G77/04
CPC分类号： C08L83/06 , C07D407/14 , C08G65/18
摘要： An underfill composition including a polymer precursor is provided. The polymer precursor includes an inorganic backbone and one or more pendant oxetane functional groups. Associated article and method are also provided.
摘要翻译： 提供了包含聚合物前体的底部填充组合物。 聚合物前体包括无机主链和一个或多个侧链氧杂环丁烷官能团。 还提供了相关的文章和方法。
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