发明申请
- 专利标题： METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS
- 专利标题（中）： 制造互连结构和低温互连组件恢复过程的方法
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申请号： US11766315申请日： 2007-06-21
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公开(公告)号： US20080313894A1公开(公告)日： 2008-12-25
- 发明人: Raymond Albert Fillion , Ryan Christopher Mills
- 申请人： Raymond Albert Fillion , Ryan Christopher Mills
- 申请人地址： US NY Schenectady
- 专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人地址： US NY Schenectady
- 主分类号： H05K3/34
- IPC分类号： H05K3/34
摘要：
A method is provided for making an interconnect structure. The method includes applying a low-temperature removable layer and adhesive layer to an electronic device or to a base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.
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