公开(公告)号：US20080313894A1

公开(公告)日：2008-12-25

申请号：US11766315

申请日：2007-06-21

申请人： Raymond Albert Fillion ,  Ryan Christopher Mills

发明人： Raymond Albert Fillion ,  Ryan Christopher Mills

IPC分类号： H05K3/34

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/221 ,  H01L2224/73267 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4644 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169 ,  H01L2224/82 ,  H01L2924/00

摘要： A method is provided for making an interconnect structure. The method includes applying a low-temperature removable layer and adhesive layer to an electronic device or to a base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.

摘要翻译： 提供了一种制造互连结构的方法。 该方法包括将低温可移除层和粘合剂层施加到电子器件或基底绝缘层; 以及使用所述粘合剂层将所述电子器件固定到所述基底绝缘层。

公开(公告)号：US20080318413A1

公开(公告)日：2008-12-25

申请号：US11766302

申请日：2007-06-21

申请人： Raymond Albert Fillion ,  David Richard Esler ,  Jeffrey Scott Erlbaum ,  Ryan Christopher Mills ,  Charles Gerard Woychik

发明人： Raymond Albert Fillion ,  David Richard Esler ,  Jeffrey Scott Erlbaum ,  Ryan Christopher Mills ,  Charles Gerard Woychik

IPC分类号： H01L21/4763

CPC分类号： H01L24/19 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L24/97 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/051 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/20 ,  H01L2224/2101 ,  H01L2224/221 ,  H01L2224/2919 ,  H01L2224/32221 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/83132 ,  H01L2224/8385 ,  H01L2224/92135 ,  H01L2224/92144 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2224/19 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/014

摘要： A method is provided for making an interconnect structure. The method includes applying a removable layer to an electronic device or to a base insulative layer; applying an adhesive layer to the electronic device or to the base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.

摘要翻译： 提供了一种制造互连结构的方法。 该方法包括将可移除层应用于电子设备或基底绝缘层; 将粘合剂层施加到电子装置或基底绝缘层上; 以及使用所述粘合剂层将所述电子器件固定到所述基底绝缘层。

公开(公告)号：US20080318055A1

公开(公告)日：2008-12-25

申请号：US11766356

申请日：2007-06-21

申请人： Raymond Albert Fillion ,  David Richard Esler ,  Jeffrey Scott Erlbaum ,  Ryan Christopher Mills ,  Charles Gerard Woychik

发明人： Raymond Albert Fillion ,  David Richard Esler ,  Jeffrey Scott Erlbaum ,  Ryan Christopher Mills ,  Charles Gerard Woychik

IPC分类号： B32B27/36 ,  B32B9/04 ,  H01L23/58

CPC分类号： H01L24/19 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/20 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/20 ,  H01L2224/221 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4644 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2201/2018 ,  H05K2203/1469 ,  H05K2203/176 ,  Y02P70/613 ,  Y10T428/31507 ,  H01L2224/24227 ,  H01L2924/014 ,  H01L2924/00

摘要： An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface, and the electronic device being secured to the base insulative layer; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer is capable of releasing the base insulative layer from the electronic device. The removal may be done without damage to a predetermined part of the electronic component.

摘要翻译： 电子部件包括具有第一表面和第二表面的基底绝缘层; 具有第一表面和第二表面的电子设备，并且所述电子设备固定到所述基底绝缘层; 设置在电子设备的第一表面和基底绝缘层的第二表面之间的粘合剂层; 以及设置在电子设备的第一表面和基底绝缘层的第二表面之间的可移除层。 基底绝缘层通过可移除层固定到电子设备。 可拆卸层能够从电子设备释放基底绝缘层。 可以在不损坏电子部件的预定部分的情况下进行移除。

公开(公告)号：US20080318054A1

公开(公告)日：2008-12-25

申请号：US11766340

申请日：2007-06-21

申请人： Raymond Albert Fillion ,  Ryan Christopher Mills

发明人： Raymond Albert Fillion ,  Ryan Christopher Mills

IPC分类号： B32B27/36 ,  B32B9/04 ,  H01L23/58

CPC分类号： H01L24/20 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L24/97 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/051 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/20 ,  H01L2224/2101 ,  H01L2224/221 ,  H01L2224/2919 ,  H01L2224/32221 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92135 ,  H01L2224/92144 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T428/31507 ,  H01L2924/014 ,  H01L2224/19 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/0105

摘要： An electronic component includes a base insulative layer having a first surface and a second surface; an electronic device having a first surface and a second surface, and the electronic device being secured to the base insulative layer; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer. The base insulative layer secures to the electronic device through the removable layer. The removable layer releases the base insulative layer from the electronic device at a sufficiently low temperature.

摘要翻译： 电子部件包括具有第一表面和第二表面的基底绝缘层; 具有第一表面和第二表面的电子设备，并且所述电子设备固定到所述基底绝缘层; 设置在电子设备的第一表面和基底绝缘层的第二表面之间的粘合剂层; 以及设置在电子设备的第一表面和基底绝缘层的第二表面之间的可移除层。 基底绝缘层通过可移除层固定到电子设备。 可去除层在足够低的温度下从电子器件释放基极绝缘层。

公开(公告)号：US11749909B2

公开(公告)日：2023-09-05

申请号：US18079288

申请日：2022-12-12

申请人： Raymond Albert Fillion

发明人： Raymond Albert Fillion

IPC分类号： G01S15/04 ,  H01Q3/46 ,  H01Q21/22 ,  H01Q15/02 ,  G01S7/03 ,  H01Q3/26 ,  H01Q1/32

CPC分类号： H01Q21/22 ,  G01S7/032 ,  H01Q3/2676 ,  H01Q15/02 ,  H01Q1/3233

摘要： A phased array antenna system comprising a plurality of isotropic radiating elements and/or omnidirectional receiving elements addressing close in fields and a plurality of non-isotropic radiating elements and/or non-omnidirectional receiving elements addressing remote fields with the combined elements used to extend the maximum range of the antenna system without increasing the number of element nor the output power of the antenna. The non-isotropic radiating elements and/or the non-omnidirectional receiving elements can be formed by adding focusing structures such as lenses or reflective structures in the radiating path of isotropic radiating elements and/or omnidirectional receiving elements. Antennas with combined isotropic radiating and non-isotropic radiating elements can be utilized for electromagnetic phased array radar, communication and imaging systems and for acoustic phased array sonar or ultrasound systems.

公开(公告)号：US11411324B2

公开(公告)日：2022-08-09

申请号：US17434744

申请日：2020-05-18

申请人： Raymond Albert Fillion

发明人： Raymond Albert Fillion

IPC分类号： G01S15/04 ,  H01Q3/46 ,  H01Q21/22 ,  G01S7/03 ,  H01Q3/26 ,  H01Q15/02 ,  H01Q1/32

摘要： A phased array antenna system comprising: a first plurality of array elements, each array element in the first plurality comprising a radiating element having a generally isotropic radiating pattern and/or a receiving element having a generally omnidirectional field of view; and a second plurality of array elements, each array element in the second plurality comprising a radiating element having a non-isotropic radiating pattern and/or a receiving element having a non-omnidirectional field of view; wherein: the generally isotropic radiating pattern comprises a field of at least 120° in azimuth and 90° in elevation; the generally omnidirectional field of view comprises a field of at least 120° in azimuth and 90° in elevation; the non-isotropic radiating pattern comprises a field of less than half of the field of the generally isotropic radiating pattern in azimuth and/or elevation; and the non-omnidirectional field of view comprises a field of less than half of the field of the omnidirectional field of view.

公开(公告)号：US08049338B2

公开(公告)日：2011-11-01

申请号：US11279011

申请日：2006-04-07

申请人： Eladio Clemente Delgado ,  Richard Alfred Beaupre ,  Stephen Daley Arthur ,  Ernest Wayne Balch ,  Kevin Matthew Durocher ,  Paul Alan McConnelee ,  Raymond Albert Fillion

发明人： Eladio Clemente Delgado ,  Richard Alfred Beaupre ,  Stephen Daley Arthur ,  Ernest Wayne Balch ,  Kevin Matthew Durocher ,  Paul Alan McConnelee ,  Raymond Albert Fillion

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/50 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/2413 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/2919 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/00 ,  H01L2924/01014

摘要： A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.

摘要翻译： 功率半导体模块包括：互连层，其包括在电介质层上图案化的电导体，所述电导体包括具有足以承载电力电流的厚度的功率耦合部分和具有比功率耦合的厚度更薄的厚度的控制耦合部分 一部分; 以及物理耦合到所述互连层并且电耦合到所述电导体的功率耦合部分的半导体功率器件。

公开(公告)号：US06507113B1

公开(公告)日：2003-01-14

申请号：US09443410

申请日：1999-11-19

申请人： Raymond Albert Fillion ,  Robert John Wojnarowski ,  Ronald Frank Kolc

发明人： Raymond Albert Fillion ,  Robert John Wojnarowski ,  Ronald Frank Kolc

IPC分类号： H01L2348

CPC分类号： H01L23/49838 ,  H01L23/49811 ,  H01L24/02 ,  H01L2224/02125 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0367 ,  H05K2201/09663 ,  H01L2924/00012 ,  H01L2924/00

摘要： One type of electronic interface structure includes a base; at least one elastomeric island supported by the base; and patterned metallization overlying the at least one elastomeric island and including at least one floating pad at least partially overlying the at least one elastomeric island. Another type of electronic interface structure includes a base; a first dielectric layer overlying the base and having at least one first dielectric layer opening therein; a second dielectric layer overlying the first dielectric layer; and patterned metallization overlying the second dielectric layer and including at least one floating pad at least partially overlying the at least one opening.

摘要翻译： 电子接口结构的一种类型包括基座; 由基座支撑的至少一个弹性岛; 以及覆盖所述至少一个弹性体岛并且包括至少部分地覆盖所述至少一个弹性体岛的至少一个浮动垫的图案化金属化。 另一种类型的电子接口结构包括基座; 覆盖所述基底并且在其中开有至少一个第一介电层的第一介电层; 覆盖所述第一介电层的第二电介质层; 以及覆盖在所述第二介电层上并且包括至少部分地覆盖所述至少一个开口的至少一个浮动焊盘的图案化金属化。

公开(公告)号：US20190317210A1

公开(公告)日：2019-10-17

申请号：US16429165

申请日：2019-06-03

申请人： Raymond Albert Fillion

发明人： Raymond Albert Fillion

IPC分类号： G01S15/04 ,  H01Q3/46 ,  H01Q25/00 ,  G10K11/34 ,  G01S13/86 ,  G01S13/04 ,  G01S7/521

摘要： An acoustic phased array antenna system comprising a plurality of omnidirectional receiving elements for addressing close-in fields and a plurality of non-omnidirectional receiving elements for addressing remote fields with the combined elements used to extend the maximum range of the antenna system. The non-omnidirectional receiving elements can be formed by adding focusing structures such as cylindrical or oval lenses in the receiving path of omnidirectional receiving elements. Antennas with a plurality of isotropic radiating and a plurality of non-isotropic radiating elements can be utilized for sonar and ultrasound systems. An acoustic phased array antenna system comprising a first plurality of receiving elements with a first field of view and a second plurality of receiving elements with a second field of view that is at least 50% narrower. An acoustic phased array with a plurality of isotropic radiators and a plurality of non-isotropic radiators to extend the range of the system.

公开(公告)号：US08466007B2

公开(公告)日：2013-06-18

申请号：US13236748

申请日：2011-09-20

申请人： Eladio Clemente Delgado ,  Richard Alfred Beaupre ,  Stephen Daley Arthur ,  Ernest Wayne Balch ,  Kevin Matthew Durocher ,  Paul Alan McConnelee ,  Raymond Albert Fillion

发明人： Eladio Clemente Delgado ,  Richard Alfred Beaupre ,  Stephen Daley Arthur ,  Ernest Wayne Balch ,  Kevin Matthew Durocher ,  Paul Alan McConnelee ,  Raymond Albert Fillion

IPC分类号： H01L21/50

CPC分类号： H01L25/50 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/2413 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/2919 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/00 ,  H01L2924/01014

摘要： A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.

摘要翻译： 功率半导体模块包括：互连层，其包括在电介质层上图案化的电导体，所述电导体包括具有足以承载电力电流的厚度的功率耦合部分和具有比功率耦合的厚度更薄的厚度的控制耦合部分 一部分; 以及物理耦合到所述互连层并且电耦合到所述电导体的功率耦合部分的半导体功率器件。