-
公开(公告)号：US07919714B2
公开(公告)日：2011-04-05
申请号：US11746260
申请日：2007-05-09
Applicant: Arun Virupaksha Gowda , Kevin Matthew Durocher , James Wilson Rose , Paul Jeffrey Gillespie , Richard Alfred Beaupre , David Richard Esler
Inventor： Arun Virupaksha Gowda , Kevin Matthew Durocher , James Wilson Rose , Paul Jeffrey Gillespie , Richard Alfred Beaupre , David Richard Esler
IPC: H05K1/00
CPC classification number: B23K3/06 , B23K35/286 , B23K35/308 , B23K35/325 , B23K35/3606 , B23K35/38 , H05K3/0061 , H05K3/244 , H05K3/3452 , H05K2201/2081
Abstract: An assembly including a solder wettable surface is provided. The assembly also includes a metal mask configured to restrict solder from flowing outside the solder wettable surface.
Abstract translation: 提供了一种包括焊料润湿表面的组件。 组件还包括配置为限制焊料流过焊料可润湿表面的金属掩模。
-
公开(公告)号：US20100077830A1
公开(公告)日：2010-04-01
申请号：US12241499
申请日：2008-09-30
Applicant: Emad Andarawis Andarawis , Wayne Charles Hasz , David So Keung Chan , David Mulford Shaddock , John Harry Down , Samhita Dasgupta , David Richard Esler , Zhiyuan Ren , Mahadevan Balasubramaniam , Ibrahim Issoufou Kouada
Inventor： Emad Andarawis Andarawis , Wayne Charles Hasz , David So Keung Chan , David Mulford Shaddock , John Harry Down , Samhita Dasgupta , David Richard Esler , Zhiyuan Ren , Mahadevan Balasubramaniam , Ibrahim Issoufou Kouada
IPC: G01B21/16
CPC classification number: G01B21/042
Abstract: Self-calibration of a multiple channel clearance sensor system, which in one embodiment includes at least one sensor for measuring at least one clearance parameter signal between a stationary object and a rotating object of a rotating machine. The sensor output is processed as a clearance parameter by an offset correction section configured to determine an offset error in the clearance parameter signal which is used by a level shifter. The level shifter is also switchably coupled to the clearance parameter signal wherein the output of the level shifter, which may be amplified and digitally converted, is processed by a signal level analyzer to determine a channel gain signal.
Abstract translation: 多通道间隙传感器系统的自校准，其在一个实施例中包括用于测量静止物体和旋转机器的旋转物体之间的至少一个间隙参数信号的至少一个传感器。 传感器输出通过偏移校正部分被处理为间隙参数，偏移校正部分被配置为确定由电平移位器使用的间隙参数信号中的偏移误差。 电平移位器还可切换地耦合到间隙参数信号，其中可以被放大和数字转换的电平移位器的输出由信号电平分析器处理以确定信道增益信号。
-
3.发明申请METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS 审中-公开制造互连结构和互连组件恢复过程的方法公开(公告)号：US20080318413A1
公开(公告)日：2008-12-25
申请号：US11766302
申请日：2007-06-21
Applicant: Raymond Albert Fillion , David Richard Esler , Jeffrey Scott Erlbaum , Ryan Christopher Mills , Charles Gerard Woychik
Inventor： Raymond Albert Fillion , David Richard Esler , Jeffrey Scott Erlbaum , Ryan Christopher Mills , Charles Gerard Woychik
IPC: H01L21/4763
CPC classification number: H01L24/19 , H01L21/563 , H01L23/3128 , H01L23/5389 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/20 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L24/97 , H01L24/98 , H01L2224/0401 , H01L2224/04105 , H01L2224/05082 , H01L2224/051 , H01L2224/05155 , H01L2224/05166 , H01L2224/056 , H01L2224/05644 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/20 , H01L2224/2101 , H01L2224/221 , H01L2224/2919 , H01L2224/32221 , H01L2224/73204 , H01L2224/73267 , H01L2224/81815 , H01L2224/8185 , H01L2224/83132 , H01L2224/8385 , H01L2224/92135 , H01L2224/92144 , H01L2224/95 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2224/19 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/0105 , H01L2924/014
Abstract: A method is provided for making an interconnect structure. The method includes applying a removable layer to an electronic device or to a base insulative layer; applying an adhesive layer to the electronic device or to the base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.
Abstract translation: 提供了一种制造互连结构的方法。 该方法包括将可移除层应用于电子设备或基底绝缘层; 将粘合剂层施加到电子装置或基底绝缘层上; 以及使用所述粘合剂层将所述电子器件固定到所述基底绝缘层。
-
公开(公告)号：US07451651B2
公开(公告)日：2008-11-18
申请号：US11636822
申请日：2006-12-11
Applicant: Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
Inventor： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
IPC: G01N29/00
CPC classification number: G01D11/245 , B06B1/0292 , B06B1/0629 , G01N29/2437 , G01N2291/106 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/16145 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/01322 , Y10T29/49004 , Y10T29/49007 , H01L2924/00 , H01L2224/05099
Abstract: A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
-
公开(公告)号：US20080232745A1
公开(公告)日：2008-09-25
申请号：US11687931
申请日：2007-03-19
Applicant: Aaron Jay Knobloch , David Mulford Shaddock , David Richard Esler , Marco Francesco Aimi , Douglas S. Byrd , David Robert O'Connor , Stacey Joy Kennerly
Inventor： Aaron Jay Knobloch , David Mulford Shaddock , David Richard Esler , Marco Francesco Aimi , Douglas S. Byrd , David Robert O'Connor , Stacey Joy Kennerly
CPC classification number: G02B6/3624 , B23K26/21 , B23K2101/04 , B23K2101/36 , G02B6/3833 , Y10T156/10
Abstract: A method for assembling a Fabry-Perot interferometer includes depositing a first metal layer on an end portion of a ferrule, depositing a second metal layer on a back portion of a die, placing the first metal layer and the second metal layer in contact with each other with respective first and second orifices aligned with respect to each other, and bonding the ferrule to the die by thermo compression. The resulting interferometer includes a glass die with a cavity, a silicon diaphragm disposed over the opening of the cavity and bonded to the glass die, a ferrule bonded to the glass die by thermo compression with the first and second orifices being aligned to each other, and an optical fiber inserted through the other end of the ferrule in direct contact to a back portion of the die and aligned with the first orifice.
Abstract translation: 用于组装法布里 - 珀罗干涉仪的方法包括在套圈的端部上沉积第一金属层，在模具的后部上沉积第二金属层，将第一金属层和第二金属层与每个金属层接触 另一个，相应的第一和第二孔相对于彼此对准，并且通过热压接将套圈接合到管芯。 所得到的干涉仪包括具有空腔的玻璃模具，设置在空腔的开口上并结合到玻璃模具的硅膜片，通过第一和第二孔彼此对准的热压而与玻璃模具接合的套圈， 以及插入穿过套管的另一端的光纤直接接触模具的后部并与第一孔对准。
-
Patent Agency Ranking
公开(公告)号：US07313965B2
公开(公告)日：2008-01-01
申请号：US11509397
申请日：2006-08-25
Applicant: Vinayak Tilak , Jie Jiang , David Mulford Shaddock , Stacey Joy Kennerly , David Richard Esler , Aaron Jay Knobloch
Inventor： Vinayak Tilak , Jie Jiang , David Mulford Shaddock , Stacey Joy Kennerly , David Richard Esler , Aaron Jay Knobloch
IPC: G01L9/00
CPC classification number: G01H9/00 , G01L1/044 , G01L1/148 , G01L1/16 , G01L9/0052 , G01L9/0073 , G01L9/0075 , G01L9/008 , G01L9/085 , G01L19/0681
Abstract: A high-temperature pressure sensor that includes a dielectric layer. The pressure sensor also includes a substrate capable of withstanding temperatures greater than 450° C. without entering a phase change, at least one semiconducting material deposited on the sapphire substrate, and a silicon dioxide layer deposited over the semiconducting material. One aspect of the pressure sensor includes a second semiconducting material.
Abstract translation: 一种包括电介质层的高温压力传感器。 压力传感器还包括能够耐受大于450℃的温度而不进入相变的衬底，沉积在蓝宝石衬底上的至少一种半导体材料和沉积在半导体材料上的二氧化硅层。 压力传感器的一个方面包括第二半导体材料。
-
7.发明授权公开(公告)号：US08536878B2
公开(公告)日：2013-09-17
申请号：US13206740
申请日：2011-08-10
Applicant: Emad Andarawis Andarawis , Wayne Charles Hasz , David So Keung Chan , David Mulford Shaddock , John Harry Down , Samhita Dasgupta , David Walter Parry , David Richard Esler , Zhiyuan Ren , Mahadevan Balasubramaniam , Cheryl Herron
Inventor： Emad Andarawis Andarawis , Wayne Charles Hasz , David So Keung Chan , David Mulford Shaddock , John Harry Down , Samhita Dasgupta , David Walter Parry , David Richard Esler , Zhiyuan Ren , Mahadevan Balasubramaniam , William Lee Herron
CPC classification number: G01B7/14 , F01D11/14 , F01D21/003 , F01D21/04
Abstract: A sensor system for measuring a clearance parameter between a stationary component and a rotating component of a rotating machine is provided. The system includes a clearance sensor to output a clearance measurement signal. A sensor memory is attached to the sensor for storing a first sensor information. A second sensor information is stored in a electronics interface memory. The first and the second sensor information are read and the clearance sensor is matched with a respective plurality of calibration data by an electronic interface based on the first and the second sensor information.
Abstract translation: 提供了用于测量旋转机器的固定部件和旋转部件之间的间隙参数的传感器系统。 该系统包括用于输出间隙测量信号的间隙传感器。 传感器存储器附接到传感器以存储第一传感器信息。 第二传感器信息存储在电子接口存储器中。 通过基于第一和第二传感器信息的电子接口读取第一和第二传感器信息，并且间隙传感器与相应的多个校准数据匹配。
-
8.发明申请公开(公告)号：US20120274258A1
公开(公告)日：2012-11-01
申请号：US13097641
申请日：2011-04-29
Applicant: Emad Andarawis Andarawis , Ertugrul Berkcan , Brock Matthew Lape , David Richard Esler
IPC: H02K11/00
Abstract: A condition monitoring method for an electrical machine is provided. The method includes providing at least one first sensor element embedded in or disposed on at least one substrate element located in a stator core for obtaining a first set of data. The method also includes providing at least one second sensor element for obtaining a second set of data from the electrical machine. Further, the method includes generating signals indicative of changes in characteristics of the first sensor element based on the second set of data. Finally, the method includes refining the first set of data by combining the first set of data with the generated signals.
Abstract translation: 提供了一种用于电机的状况监测方法。 该方法包括提供嵌入或设置在位于定子芯中的至少一个衬底元件上的至少一个第一传感器元件，以获得第一组数据。 该方法还包括提供至少一个第二传感器元件，用于从电机获得第二组数据。 此外，该方法包括基于第二组数据产生指示第一传感器元件的特性变化的信号。 最后，该方法包括通过将第一组数据与生成的信号组合来对第一组数据进行精细化。
-
公开(公告)号：US08272246B2
公开(公告)日：2012-09-25
申请号：US12241499
申请日：2008-09-30
Applicant: Emad Andarawis Andarawis , Wayne Charles Hasz , David So Keung Chan , David Mulford Shaddock , John Harry Down , Samhita Dasgupta , David Richard Esler , Zhiyuan Ren , Mahadevan Balasubramaniam , Ibrahim Issoufou Kouada
Inventor： Emad Andarawis Andarawis , Wayne Charles Hasz , David So Keung Chan , David Mulford Shaddock , John Harry Down , Samhita Dasgupta , David Richard Esler , Zhiyuan Ren , Mahadevan Balasubramaniam , Ibrahim Issoufou Kouada
IPC: G01B21/00
CPC classification number: G01B21/042
Abstract: Self-calibration of a multiple channel clearance sensor system, which in one embodiment includes at least one sensor for measuring at least one clearance parameter signal between a stationary object and a rotating object of a rotating machine. The sensor output is processed as a clearance parameter by an offset correction section configured to determine an offset error in the clearance parameter signal which is used by a level shifter. The level shifter is also switchably coupled to the clearance parameter signal wherein the output of the level shifter, which may be amplified and digitally converted, is processed by a signal level analyzer to determine a channel gain signal.
Abstract translation: 多通道间隙传感器系统的自校准，其在一个实施例中包括用于测量静止物体和旋转机器的旋转物体之间的至少一个间隙参数信号的至少一个传感器。 传感器输出通过偏移校正部分被处理为间隙参数，偏移校正部分被配置为确定由电平移位器使用的间隙参数信号中的偏移误差。 电平移位器还可切换地耦合到间隙参数信号，其中可以被放大和数字转换的电平移位器的输出由信号电平分析器处理以确定信道增益信号。
-
10.发明申请公开(公告)号：US20110295538A1
公开(公告)日：2011-12-01
申请号：US13206740
申请日：2011-08-10
Applicant: Emad Andarawis Andarawis , Wayne Charles Hasz , David So Keung Chan , David Mulford Shaddock , John Harry Down , Samhita Dasgupta , David Walter Parry , David Richard Esler , Zhiyuan Ren , Mahadevan Balasubramaniam , William Lee Herron , Cheryl Herron
Inventor： Emad Andarawis Andarawis , Wayne Charles Hasz , David So Keung Chan , David Mulford Shaddock , John Harry Down , Samhita Dasgupta , David Walter Parry , David Richard Esler , Zhiyuan Ren , Mahadevan Balasubramaniam , William Lee Herron , Cheryl Herron
IPC: G06F19/00
CPC classification number: G01B7/14 , F01D11/14 , F01D21/003 , F01D21/04
Abstract: A sensor system for measuring a clearance parameter between a stationary component and a rotating component of a rotating machine is provided. The system includes a clearance sensor to output a clearance measurement signal. A sensor memory is attached to the sensor for storing a first sensor information. A second sensor information is stored in a electronics interface memory. The first and the second sensor information are read and the clearance sensor is matched with a respective plurality of calibration data by an electronic interface based on the first and the second sensor information.
Abstract translation: 提供了用于测量旋转机器的固定部件和旋转部件之间的间隙参数的传感器系统。 该系统包括用于输出间隙测量信号的间隙传感器。 传感器存储器附接到传感器以存储第一传感器信息。 第二传感器信息存储在电子接口存储器中。 通过基于第一和第二传感器信息的电子接口读取第一和第二传感器信息，并且间隙传感器与相应的多个校准数据匹配。
-
-
-
-
-
-
-
-
-
Search Results
25
records
(took 0.016 seconds)
