公开(公告)号：US20180374768A1

公开(公告)日：2018-12-27

申请号：US16009753

申请日：2018-06-15

Applicant: NuFlare Technology, Inc.

Inventor： Kazuhiro CHIBA ,  Yoshikuni GOSHIMA ,  Shinsuke NABEYA ,  Shiro OKADA ,  Kentaro MORI

IPC: H01L23/16 ,  H01L23/00 ,  H01L23/14 ,  H01L23/15 ,  H01J37/147

Abstract: A semiconductor device according to an embodiment includes a semiconductor chip including a region having through holes; a substrate having a first opening larger than the region, the substrate containing a resin or a ceramic; a spacer provided between the semiconductor chip and the substrate, the spacer having a second opening larger than the region; a first bond provided between the semiconductor chip and the spacer; and a second bond provided between the spacer and the substrate.

公开(公告)号：US20250095948A1

公开(公告)日：2025-03-20

申请号：US18885828

申请日：2024-09-16

Applicant: NuFlare Technology, Inc.

Inventor： Yutaka ONOZUKA ,  Kazuyuki HIGASHI ,  Tomohiro SAITO ,  Yoshikuni GOSHIMA ,  Yoshiaki SHINOHARA

IPC: H01J37/04

Abstract: An electronic component of the embodiment includes: a first substrate including first through holes, a first substrate plane, and a second substrate plane; electrode pairs provided in the first through hole and including a first electrode a second electrode, an insulating film, at least a part of the insulating film being provided between an inner side surface of each of the first through holes and an outer side surface of the first electrode; wherein a surface of the insulating film exposed from the first and second electrode in the vicinity of the first and third end is located outside of a first and a third surface, the first surface is an inner side surface of the second portion, and the third surface is an inner side surface of the fifth portion.

公开(公告)号：US20240055218A1

公开(公告)日：2024-02-15

申请号：US18259674

申请日：2021-12-09

Applicant: NuFlare Technology, Inc. ,  NuFlare Technology America, Inc.

Inventor： Yasuo SENGOKU ,  Yoshikuni GOSHIMA ,  John William KAY ,  Chising LAI

IPC: H01J37/147 ,  H01J37/30 ,  H01J37/04 ,  H01J37/317

CPC classification number: H01J37/147 ,  H01J37/3007 ,  H01J37/045 ,  H01J37/3174

Abstract: A charged particle beam writing apparatus according to one aspect of the present invention includes an electrode configured to deflect a charged particle beam, an amplifier configured to apply a deflection potential to the electrode, a diagnostic circuit configured to diagnose the amplifier, a switching circuit arranged between an output of the amplifier and the electrode, and configured to switch the output of the amplifier between the electrode and the diagnostic circuit, an electron optical system configured to irradiate a target object with the charged particle beam deflected by being applied with the deflection potential by the amplifier, a column configured to include therein the electrode and the electron optical system, a first coaxial cable configured to connect an output side of the amplifier with the switching circuit, a second coaxial cable configured to connect the electrode with the switching circuit, a third coaxial cable configured to connect the output side of the amplifier with the diagnostic circuit, and a resistance configured to connect, parallelly to the switching circuit, an inner conductor of the first coaxial cable with an inner conductor of the second coaxial cable.

公开(公告)号：US20230402253A1

公开(公告)日：2023-12-14

申请号：US18328026

申请日：2023-06-02

Applicant: NuFlare Technology, Inc.

Inventor： Hirofumi MORITA ,  Yoshikuni GOSHIMA

IPC: H01J37/317 ,  H01J37/04

CPC classification number: H01J37/3177 ,  H01J37/045 ,  H01J2237/0437 ,  H01J2237/0453 ,  H01J2237/24592 ,  H01J2237/24578 ,  H01J2237/24528

Abstract: In one embodiment, a multi charged particle beam evaluation method is for evaluating trajectories of a plurality of individual beams in a multi charged particle beam which has passed through a plurality of openings provided in an aperture array substrate. The method includes measuring positions of the plurality of individual beams at each of a plurality of heights, in an optical axis direction, of an imaging plane of the multi charged particle beam, or a measurement plane on which a mark for beam position measurement is formed, the plurality of heights being different from each other, and extracting a singular beam in which a beam trajectory has changed among the plurality of individual beams based on a position difference, the position difference being a difference between beam positions of the plurality of individual beams measured at each of the plurality of heights.

公开(公告)号：US20220270850A1

公开(公告)日：2022-08-25

申请号：US17581079

申请日：2022-01-21

Applicant: NuFlare Technology, Inc.

Inventor： Kei OBARA ,  Kazuyuki HIGASHI ,  Miyoko SHIMADA ,  Yoshiaki SHIMOOKA ,  Hitomi YAMAGUCHI ,  Yoshikuni GOSHIMA ,  Hirofumi MORITA ,  Hiroshi MATSUMOTO

IPC: H01J37/317 ,  H01J37/04

Abstract: A semiconductor device according to an embodiment includes: a substrate including a plurality of through holes provided at predetermined intervals along a first direction in a substrate surface and along a second direction intersecting the first direction in the substrate surface; an insulating layer provided on the substrate, the insulating layer being penetrated by the through holes; a plurality of first electrodes provided on the insulating layer, the first electrodes being adjacent to the respective through holes in the first direction; a plurality of second electrodes provided on the insulating layer, the second electrodes being adjacent to the respective through holes in the first direction, the second electrodes being provided to face the first electrodes, the second electrodes being held at a predetermined potential; and a wiring layer provided on the insulating layer, the wiring layer electrically connecting the adjacent second electrodes.

公开(公告)号：US20210296074A1

公开(公告)日：2021-09-23

申请号：US17169782

申请日：2021-02-08

Applicant: NuFlare Technology, Inc.

Inventor： Hiroshi YAMASHITA ,  Yoshikuni GOSHIMA ,  Hirofumi MORITA ,  Hiroshi MATSUMOTO

IPC: H01J37/04 ,  H01J37/147 ,  H01J37/20

Abstract: In one embodiment, a multi-beam blanking device includes a semiconductor substrate, an insulating film that is disposed on the semiconductor substrate, an antistatic film that is disposed on the insulating film, a plurality of cells each of which is related to a through-hole that penetrate the semiconductor substrate and the insulating film and each of which includes a blanking electrode and a ground electrode that are disposed on the insulating film, and a ground wiring line that is disposed in the insulating film. The antistatic film and the ground wiring line are connected to each other at a joint that extends through the insulating film on the ground wiring line.

公开(公告)号：US20190139739A1

公开(公告)日：2019-05-09

申请号：US16179731

申请日：2018-11-02

Applicant: NuFlare Technology, Inc. ,  NuFlare Technology America, Inc.

Inventor： Yoshikuni GOSHIMA ,  Victor KATSAP ,  Rodney KENDALL

IPC: H01J37/304 ,  G03F7/20 ,  H01J37/244 ,  H01J37/317

Abstract: An individual beam detector for multiple beams includes a thin film in which a passage hole smaller than a pitch between beams of multiple beams and larger than the diameter of a beam is formed and through which the multiple beams can penetrate, a support base to support the thin film in which an opening is formed under the region including the passage hole, and the width size of the opening is formed to have a temperature of the periphery of the passage hole higher than an evaporation temperature of impurities adhering to the periphery in the case that the thin film is irradiated with the multiple beams, and a sensor arranged, at the position away from the thin film by a distance based on which a detection target beam having passed the passage hole can be detected by the sensor as a detection value with contrast discernible.