公开(公告)号：US20250095948A1

公开(公告)日：2025-03-20

申请号：US18885828

申请日：2024-09-16

Applicant: NuFlare Technology, Inc.

Inventor： Yutaka ONOZUKA ,  Kazuyuki HIGASHI ,  Tomohiro SAITO ,  Yoshikuni GOSHIMA ,  Yoshiaki SHINOHARA

IPC: H01J37/04

Abstract: An electronic component of the embodiment includes: a first substrate including first through holes, a first substrate plane, and a second substrate plane; electrode pairs provided in the first through hole and including a first electrode a second electrode, an insulating film, at least a part of the insulating film being provided between an inner side surface of each of the first through holes and an outer side surface of the first electrode; wherein a surface of the insulating film exposed from the first and second electrode in the vicinity of the first and third end is located outside of a first and a third surface, the first surface is an inner side surface of the second portion, and the third surface is an inner side surface of the fifth portion.

公开(公告)号：US20250095951A1

公开(公告)日：2025-03-20

申请号：US18595532

申请日：2024-03-05

Applicant: KABUSHIKI KAISHA TOSHIBA ,  NuFlare Technology, Inc.

Inventor： Kazuyuki HIGASHI ,  Kazumichi TSUMURA ,  Tomohiro SAITO ,  Takashi YODA ,  Munehiro OGASAWARA ,  Kenji HIRAKAWA ,  Masayuki IWASE

IPC: H01J37/147 ,  H01J37/04 ,  H01J37/317 ,  H01L23/00 ,  H01L23/58

Abstract: An electronic component according to an embodiment includes: a first substrate including first through holes, a first substrate surface and a second substrate surface; first electrodes provided on each of the first through holes, and including a first end and a second end; second electrodes provided on each of the first through holes, facing each of the first electrodes, and including a third end facing the first end and a fourth end facing the second end; third electrodes connected to the first end and extending toward the third end; fourth electrodes connected to the second end and extending toward the fourth end; fifth electrodes connected to the third end, provided separately from each of the third electrodes and extending toward the first end; sixth electrodes connected to the fourth end, provided separately from each of the fourth electrodes and extending toward the second end.

公开(公告)号：US20220270850A1

公开(公告)日：2022-08-25

申请号：US17581079

申请日：2022-01-21

Applicant: NuFlare Technology, Inc.

Inventor： Kei OBARA ,  Kazuyuki HIGASHI ,  Miyoko SHIMADA ,  Yoshiaki SHIMOOKA ,  Hitomi YAMAGUCHI ,  Yoshikuni GOSHIMA ,  Hirofumi MORITA ,  Hiroshi MATSUMOTO

IPC: H01J37/317 ,  H01J37/04

Abstract: A semiconductor device according to an embodiment includes: a substrate including a plurality of through holes provided at predetermined intervals along a first direction in a substrate surface and along a second direction intersecting the first direction in the substrate surface; an insulating layer provided on the substrate, the insulating layer being penetrated by the through holes; a plurality of first electrodes provided on the insulating layer, the first electrodes being adjacent to the respective through holes in the first direction; a plurality of second electrodes provided on the insulating layer, the second electrodes being adjacent to the respective through holes in the first direction, the second electrodes being provided to face the first electrodes, the second electrodes being held at a predetermined potential; and a wiring layer provided on the insulating layer, the wiring layer electrically connecting the adjacent second electrodes.