公开(公告)号：US20180374768A1

公开(公告)日：2018-12-27

申请号：US16009753

申请日：2018-06-15

Applicant: NuFlare Technology, Inc.

Inventor： Kazuhiro CHIBA ,  Yoshikuni GOSHIMA ,  Shinsuke NABEYA ,  Shiro OKADA ,  Kentaro MORI

IPC: H01L23/16 ,  H01L23/00 ,  H01L23/14 ,  H01L23/15 ,  H01J37/147

Abstract: A semiconductor device according to an embodiment includes a semiconductor chip including a region having through holes; a substrate having a first opening larger than the region, the substrate containing a resin or a ceramic; a spacer provided between the semiconductor chip and the substrate, the spacer having a second opening larger than the region; a first bond provided between the semiconductor chip and the spacer; and a second bond provided between the spacer and the substrate.

公开(公告)号：US20160155600A1

公开(公告)日：2016-06-02

申请号：US14953959

申请日：2015-11-30

Applicant: NuFlare Technology, Inc. ,  NTT Advanced Technology Corporation

Inventor： Kazuhiro CHIBA ,  Hiroshi Matsumoto ,  Munehiro Ogasawara ,  Ryoichi Yoshikawa ,  Hirofumi Morita ,  Hirokazu Yamada ,  Teruaki Safu ,  Toshifumi Konishi ,  Takaaki Matsushima ,  Kazuhisa Kudo ,  Masaki Yano ,  Katsuyuki Machida

IPC: H01J37/04

CPC classification number: H01J37/045 ,  H01J2237/043 ,  H01J2237/0432 ,  H01J2237/0437 ,  H01J2237/303 ,  H01J2237/3175 ,  H01J2237/31774

Abstract: A method for fabricating a blanking aperture array device for multi-beams includes forming, using a substrate over which a first insulating film, a first metal film, a second insulating film, and a second metal film are laminated in order, electrodes and pads on the second metal film, removing a part of the second metal film, removing the second insulating film using, as a mask, the electrodes, the pads, and a remaining part of the second metal film, and forming openings each being between a pair of electrodes, wherein, a part of the second metal film is etched such that some part of it remains in regions each connecting one of the electrodes and one of the pads, and a region in which entire openings are formed except the openings themselves is configured by the electrodes, pads, and first and second metal films such that the insulating film is not exposed.

Abstract translation: 一种用于制造用于多光束的消隐孔阵列器件的方法包括使用基板依次形成第一绝缘膜，第一金属膜，第二绝缘膜和第二金属膜，基板上依次层叠电极和焊盘 第二金属膜，去除第二金属膜的一部分，使用作为掩模的电极，焊盘和第二金属膜的剩余部分去除第二绝缘膜，并且形成开口，每个开口分别位于一对 电极，其中，第二金属膜的一部分被蚀刻，使得其中的一部分保留在每个连接电极中的一个和一个焊盘的区域中，并且除了开口本身之外还形成有开口本身的整个开口的区域 电极，焊盘以及第一和第二金属膜，使得绝缘膜不被暴露。

公开(公告)号：US20160099129A1

公开(公告)日：2016-04-07

申请号：US14857095

申请日：2015-09-17

Applicant: NuFlare Technology, Inc.

Inventor： Hiroshi YAMASHITA ,  Hiroshi MATSUMOTO ,  Kazuhiro CHIBA

IPC: H01J37/317

CPC classification number: H01J37/3174 ,  H01J37/045 ,  H01J37/3177 ,  H01J2237/0435 ,  H01J2237/31774

Abstract: In one embodiment, a blanking aperture array includes a substrate including an upper surface on which an insulating film is provided, a plurality of blanking aperture portions provided in the substrate, each of the plurality of blanking aperture portions including one of penetration holes, through which a predetermined beam passes, and one of blanking electrodes and one of ground electrodes which are provided on the insulating film, and the blanking electrodes and the ground electrodes configured to perform blanking deflection of the predetermined beam, and a high-resistivity film provided so as to cover the insulating film and at least part of the ground electrodes, the high-resistivity film having an electric resistance that is higher than an electric resistance of the ground electrodes and lower than an electric resistance of the insulating film.

Abstract translation: 在一个实施例中，消隐孔阵列包括：衬底，其包括设置绝缘膜的上表面;设置在衬底中的多个消隐孔部，多个消隐孔部分中的每一个包括一个穿透孔， 预定的光束通过，并且设置在绝缘膜上的消隐电极和接地电极之一以及被配置为执行预定光束的消隐偏转的消隐电极和接地电极以及设置为如下的高电阻膜 覆盖绝缘膜和至少一部分接地电极，高电阻膜具有高于接地电极的电阻并低于绝缘膜的电阻的电阻。

公开(公告)号：US20240013999A1

公开(公告)日：2024-01-11

申请号：US18331502

申请日：2023-06-08

Applicant: NuFlare Technology, Inc.

Inventor： Toshiki KIMURA ,  Hirofumi MORITA ,  Takanao TOUYA ,  Hayato KIMURA ,  Kazuhiro CHIBA

IPC: H01J37/04 ,  H01J37/147 ,  H01J37/304

CPC classification number: H01J37/045 ,  H01J37/147 ,  H01J37/304 ,  H01J2237/0437

Abstract: According to one embodiment of the present invention, a mounting substrate is installed on a multi charged particle beam irradiation apparatus, and a blanking aperture array chip provided with blanking electrodes to perform blanking deflection on beams in a multi charged particle beam is mounted on the mounting substrate. The mounting substrate includes an opening through which the multi charged particle beam passes, a plurality of control circuits that supply a control signal to the blanking electrodes for each of a plurality of areas into which the blanking aperture array chip is divided, and grounds, each of which is provided for a corresponding one of the plurality of control circuits and configured to supply a ground electrical potential to the corresponding control circuit. The grounds corresponding to the control circuits are electrically separated from each other.

公开(公告)号：US20160064179A1

公开(公告)日：2016-03-03

申请号：US14838907

申请日：2015-08-28

Applicant: NuFlare Technology, Inc.

Inventor： Hiroshi YAMASHITA ,  Ryoichi YOSHIKAWA ,  Kazuhiro CHIBA ,  Hiroshi MATSUMOTO

IPC: H01J37/04

CPC classification number: H01J37/045 ,  H01J37/1471 ,  H01J37/20 ,  H01J37/3026 ,  H01J37/3177 ,  H01J2237/043 ,  H01J2237/0435 ,  H01J2237/20292 ,  H01J2237/30483 ,  H01J2237/3175

Abstract: A blanking device for multi-beams includes arrayed plural separate blanking systems, each performing blanking control switching a corresponding beam of multi charged particle beams between a beam ON state and a beam OFF state and each including a first electrode, a first potential applying mechanism applying two different potentials selectively to the first electrode for the blanking control, and a second electrode performing blanking deflection of the corresponding beam, the second electrode being grounded and paired with the first electrode, and a potential change mechanism changing a potential of the second electrode from a ground potential to another potential, wherein when a potential of the first electrode included in one of the separate blanking systems is fixed to the ground potential, the potential change mechanism changes the potential of the second electrode corresponding to the first electrode fixed to the ground potential, from the ground potential to the another potential.

Abstract translation: 用于多光束的消隐装置包括排列的多个单独的消隐系统，每个消隐控制系统执行消隐控制，以在光束接通状态和光束关闭状态之间切换相应的多带电粒子束束，并且每个包括第一电极，第一电位施加机构 选择性地与用于消隐控制的第一电极相对应的两个不同的电位，以及执行相应光束的消隐偏转的第二电极，第二电极与第一电极接地并配对;以及电位改变机构，改变第二电极的电位 将地电位转换为另一电势，其中当包括在一个分离的消隐系统中的第一电极的电位固定到接地电位时，电位改变机构改变对应于固定到地面的第一电极的第二电极的电位 潜力，从地面潜力到另一个潜力 。