公开(公告)号：US20180374768A1

公开(公告)日：2018-12-27

申请号：US16009753

申请日：2018-06-15

Applicant: NuFlare Technology, Inc.

Inventor： Kazuhiro CHIBA ,  Yoshikuni GOSHIMA ,  Shinsuke NABEYA ,  Shiro OKADA ,  Kentaro MORI

IPC: H01L23/16 ,  H01L23/00 ,  H01L23/14 ,  H01L23/15 ,  H01J37/147

Abstract: A semiconductor device according to an embodiment includes a semiconductor chip including a region having through holes; a substrate having a first opening larger than the region, the substrate containing a resin or a ceramic; a spacer provided between the semiconductor chip and the substrate, the spacer having a second opening larger than the region; a first bond provided between the semiconductor chip and the spacer; and a second bond provided between the spacer and the substrate.