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公开(公告)号：US20100314156A1
公开(公告)日：2010-12-16
申请号：US12740578
申请日：2008-10-15
申请人： Mitsuo Takada , Satoshi Teshima , Takeshi Kuwahara
发明人： Mitsuo Takada , Satoshi Teshima , Takeshi Kuwahara
IPC分类号： H01B5/00
CPC分类号： H01L24/85 , C22C5/02 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/78301 , H01L2224/7855 , H01L2224/85045 , H01L2224/85048 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01105 , H01L2924/01203 , H01L2924/01204 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/01039 , H01L2924/00014 , H01L2924/01202 , H01L2924/00 , H01L2924/013 , H01L2924/00013 , H01L2924/00015 , H01L2924/01049 , H01L2924/01006
摘要： [Issues to be Solved] To provide Au alloy wire for ball bonding, which is superior in wire strength, and also is superior in formability of molten ball and roundness of compressed ball. Moreover it is superior at stitch bondability, and is available for high density wiring of semiconductor devices.[Solution Means] An Au alloy wire for ball bonding comprising: 15-50 wt ppm Mg, 10-30 wt ppm Ca, 5-20 wt ppm Eu, 5-20 wt ppm Y, 5-20 wt ppm La and residual Au is 99.998 wt % purity or higher, moreover, purity of more than 99.98 wt % Au. The mass of additive Ca is less than the value of total amount of additive Eu and additive La, and the mass of additive Y is less than the value of the total amount of additive Ca and additive Eu, and the mass of Mg is 20-40 wt ppm.
摘要翻译： [待解决的问题]提供线强度优异的用于球接的Au合金丝，并且还具有优良的熔融球的成形性和压缩球的圆度。 此外，它在缝合粘合性方面是优越的，并且可用于半导体器件的高密度布线。 [解决方案]一种用于球接合的Au合金线，包括：15-50重量ppm的Mg，10-30重量ppm的Ca，5-20重量ppm的Eu，5-20重量ppm的Y，5-20重量ppm的La和残余的Au 的纯度为99.998重量％以上，此外，纯度高于99.98重量％的Au。 添加剂Ca的质量小于添加剂Eu和添加剂La的总量的值，添加剂Y的质量小于添加剂Ca和添加剂Eu的总量的值，Mg的质量为20〜 40重量ppm。
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公开(公告)号：US20100226816A1
公开(公告)日：2010-09-09
申请号：US12224212
申请日：2008-06-23
申请人： Mitsuo Takada , Satoshi Teshima , Takeshi Kuwahara
发明人： Mitsuo Takada , Satoshi Teshima , Takeshi Kuwahara
IPC分类号： C22C5/02
CPC分类号： H01L24/85 , B23K35/3013 , B23K2101/36 , C22C5/02 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/05644 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/01105 , H01L2924/01204 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20106 , H01L2924/20752 , Y10T428/12 , H01L2924/01012 , H01L2924/01063 , H01L2924/0105 , H01L2924/0102 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/00015 , H01L2924/01205 , H01L2924/01048 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
摘要： There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).
摘要翻译： 提供了一种用于球接的金合金线。 金合金由10〜50质量ppm的镁（Mg）构成。 5〜20质量ppm的铕（Eu）; 2〜9质量ppm的钙（Ca）; 剩余部分为纯度为99.998质量％以下的金（Au）。 在用于球接合的金合金丝中，钙（Ca）的添加量最多为铕（Eu）的一半。
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公开(公告)号：US08147750B2
公开(公告)日：2012-04-03
申请号：US12224212
申请日：2008-06-23
申请人： Mitsuo Takada , Satoshi Teshima , Takeshi Kuwahara
发明人： Mitsuo Takada , Satoshi Teshima , Takeshi Kuwahara
CPC分类号： H01L24/85 , B23K35/3013 , B23K2101/36 , C22C5/02 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/05644 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/01105 , H01L2924/01204 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20106 , H01L2924/20752 , Y10T428/12 , H01L2924/01012 , H01L2924/01063 , H01L2924/0105 , H01L2924/0102 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/00015 , H01L2924/01205 , H01L2924/01048 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
摘要： There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).
摘要翻译： 提供了一种用于球接的金合金线。 金合金由10〜50质量ppm的镁（Mg）构成。 5〜20质量ppm的铕（Eu）; 2〜9质量ppm的钙（Ca）; 剩余部分为纯度为99.998质量％以下的金（Au）。 在用于球接合的金合金丝中，钙（Ca）的添加量最多为铕（Eu）的一半。
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公开(公告)号：US08440137B2
公开(公告)日：2013-05-14
申请号：US11791329
申请日：2005-11-22
申请人： Satoshi Teshima , Michitaka Mikami
发明人： Satoshi Teshima , Michitaka Mikami
CPC分类号： C22C5/02 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/4845 , H01L2224/48624 , H01L2224/85207 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01064 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01205 , H01L2924/10253 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , Y10T428/12431 , H01L2924/01004 , H01L2924/01204 , H01L2924/01039 , H01L2924/20105 , H01L2924/20106 , H01L2924/2011 , H01L2924/20111 , H01L2924/013 , H01L2924/01062 , H01L2924/01048 , H01L2924/01049 , H01L2924/00013 , H01L2924/00 , H01L2924/01006
摘要： An Au bonding wire for semiconductor device, comprising a wire-shaped Au alloy material consisting of: 3-15 mass ppm of Be, 3-40 mass ppm of Ca, 3-20 mass ppm of La, 3-20 mass ppm of at least one functional element selected from the group of Ce, Eu, Mg, and Si, and the remainder of Au, wherein the diameter of said Au alloy bonding wire is less than 23 microns, wherein said bonding wire has improved roundness of compressed bonded ball and improved fracture stress.
摘要翻译： 一种用于半导体器件的Au接合线，包括线状Au合金材料，其由以下组成：3-15质量ppm的Be，3-40质量ppm的Ca，3-20质量ppm的La，3-20质量ppm的 选自Ce，Eu，Mg和Si中的至少一种功能元素，余量为Au，其中所述Au合金接合线的直径小于23微米，其中所述接合线具有改善的压缩粘结球的圆度 并提高骨折应力。
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公开(公告)号：US20080050267A1
公开(公告)日：2008-02-28
申请号：US11664058
申请日：2005-09-28
申请人： Hiroshi Murai , Jun Chiba , Satoshi Teshima
发明人： Hiroshi Murai , Jun Chiba , Satoshi Teshima
IPC分类号： C22C5/02
CPC分类号： C22C5/02 , B23K35/3013 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2224/48639 , H01L2224/85439 , H01L2924/00011 , H01L2924/01105 , H01L2924/01202 , H01L2924/01203 , H01L2924/01205 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1576 , H01L2924/181 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/01046 , H01L2924/01014 , H01L2924/01063 , H01L2924/01004 , H01L2924/01058 , H01L2924/01064 , H01L2924/01012 , H01L2924/01039 , H01L2924/01057 , H01L2924/01078 , H01L2924/01201 , H01L2924/00014 , H01L2924/0102 , H01L2924/01066 , H01L2924/0103 , H01L2924/0105 , H01L2924/013 , H01L2924/00013 , H01L2924/00 , H01L2924/01028 , H01L2924/01404 , H01L2924/01006
摘要： Provided is a thin Au alloy bonding wire having desired strength, good bondability and stability over time, and improved circularity of a squashed ball and sphericity of a melted ball. The Au alloy bonding wire contains, in an Au alloy matrix containing 0.05 to 2 mass % in total of at least one selected from Pd and Pt of high purity in Au of high purity, as trace elements, 10 to 100 ppm by mass of Mg, 5 to 100 ppm by mass of Ce, and 5 to 100 ppm by mass of each of at least one selected from Be, Y, Gd, La, Eu and Si, the total content of Be, Y, Gd, La, Eu and Si being 5 to 100 ppm by mass, or as trace elements, Mg, Be, and at least one selected from Y, La, Eu and Si, or as trace elements, 10 to 100 ppm by mass of Mg, 5 to 30 ppm by mass of Si, 5 to 30 ppm by mass of Be, and 5 to 30 ppm by mass of at least one selected from Ca, Ce and Sn.
摘要翻译： 提供具有期望强度，良好的粘合性和随时间稳定性的薄Au合金接合线，并且改善压扁球的圆形度和熔融球的球形度。 Au合金接合线含有0.05〜2质量％的Au系合金基体，作为微量元素，含有0.05〜2质量％的选自高纯度的Au中的高纯度的Pd和Pt中的至少1种，10〜100质量ppm的Mg ，Ce：5〜100质量ppm，Be，Y，Gd，La，Eu和Si中的至少一种中的至少一种为5〜100质量ppm，Be，Y，Gd，La，Eu的总含量 Si为5〜100质量ppm，作为微量元素，Mg，Be，选自Y，La，Eu，Si中的至少一种，微量元素为10〜100质量ppm，Mg为5〜30 Si为质量ppm，Be为5〜30质量ppm，选自Ca，Ce，Sn中的至少1种为5〜30质量ppm。
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公开(公告)号：US20110305940A1
公开(公告)日：2011-12-15
申请号：US13213122
申请日：2011-08-19
申请人： Yasushi USAMI , Tomoyuki Nemoto , Jun Takagi , Satoshi Teshima
发明人： Yasushi USAMI , Tomoyuki Nemoto , Jun Takagi , Satoshi Teshima
CPC分类号： B29C44/04 , B29C44/3453 , B29C44/5627 , B29C55/005 , B29C55/023 , B29C67/20 , B29K2105/04 , B32B5/20 , B32B5/32 , B32B27/08 , B32B27/20 , B32B27/32 , B32B38/0032 , B32B2038/0028 , B32B2305/30 , B32B2323/10 , B32B2457/10 , C08J9/0061 , C08J9/122 , C08J2203/08 , C08J2323/10 , C08J2323/12 , C08J2423/00 , H01M2/1653 , H01M2/166 , H01M2/1686 , H01M10/052 , Y02P20/544 , Y10T428/24355 , Y10T428/24998
摘要： A process for producing a porous laminate having many micropores interconnected in the thickness direction, which comprises: a step in which a laminate is produced which comprises at least three layers comprising an interlayer made of a thermoplastic resin having a hard segment and a soft segment and two nonporous outer layers made of a filler-containing resin and located as outer layers respectively on both sides of the interlayer; a step in which the laminate obtained is impregnated with a supercritical or subcritical fluid and this state is relieved to vaporize the fluid and thereby make the interlayer porous; and a step in which the two nonporous outer layers located respectively on both sides are made porous by stretching.
摘要翻译： 一种制造多孔层压体的方法，所述多孔层压体具有在厚度方向上互连的多个微孔，其包括：制造层压体的步骤，其中包括至少三层，包括由具有硬链段和软链段的热塑性树脂制成的中间层， 两个由含填料树脂制成的无孔外层分别位于中间层两侧的外层; 所获得的层压体用超临界或亚临界流体浸渍，并且缓解该状态使气体蒸发，从而使夹层多孔化; 分别位于两侧的两个无孔外层通过拉伸而制成多孔的步骤。
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公开(公告)号：US09103001B2
公开(公告)日：2015-08-11
申请号：US13496327
申请日：2011-11-01
申请人： Jun Chiba , Satoshi Teshima , Tasuku Kobayashi , Yuki Antoku
发明人： Jun Chiba , Satoshi Teshima , Tasuku Kobayashi , Yuki Antoku
CPC分类号： C22C5/06 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/431 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48463 , H01L2224/48507 , H01L2224/48599 , H01L2224/48624 , H01L2224/48824 , H01L2224/85075 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/00014 , H01L2924/01007 , H01L2924/01046 , H01L2924/01039 , H01L2924/01064 , H01L2924/0106 , H01L2924/01062 , H01L2924/01004 , H01L2924/01083 , H01L2924/00 , H01L2924/00015 , H01L2924/01204 , H01L2924/013 , H01L2924/20759 , H01L2924/2076 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/2075 , H01L2924/20754 , H01L2924/01205 , H01L2924/01022 , H01L2924/01077 , H01L2924/00013
摘要： An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999% or higher, 2-5 mass % of palladium having a purity of 99.99% or higher, and remaining mass % of silver (Ag) having a purity of 99.999% or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.
摘要翻译： 一种用于半导体器件的Ag-Au-Pd三元合金接合线，其由纯度为99.999％以上的纯度为4-10质量％，纯度为99.99％以上的钯为2-5质量％，剩余质量 ％纯度为99.999％以上的银（Ag） 该线材含有15-70质量ppm的氧化性非贵金属元素，并且在连续拉伸模具之前进行热退火，并且在连续拉伸模具之后进行热回火，并且该线材可用于球形粘合 氮气; 在Ag-Au-Pd三元合金线和铝焊盘之间的界面产生的Ag 2 Al和富Pd层抑制了Ag2Al金属间化合物层和电线之间的腐蚀发展。
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公开(公告)号：US20120263624A1
公开(公告)日：2012-10-18
申请号：US13496327
申请日：2011-11-01
申请人： Jun Chiba , Satoshi Teshima , Tasuku Kobayashi , Yuki Antoku
发明人： Jun Chiba , Satoshi Teshima , Tasuku Kobayashi , Yuki Antoku
IPC分类号： C22C5/06
CPC分类号： C22C5/06 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/431 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48463 , H01L2224/48507 , H01L2224/48599 , H01L2224/48624 , H01L2224/48824 , H01L2224/85075 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/00014 , H01L2924/01007 , H01L2924/01046 , H01L2924/01039 , H01L2924/01064 , H01L2924/0106 , H01L2924/01062 , H01L2924/01004 , H01L2924/01083 , H01L2924/00 , H01L2924/00015 , H01L2924/01204 , H01L2924/013 , H01L2924/20759 , H01L2924/2076 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/2075 , H01L2924/20754 , H01L2924/01205 , H01L2924/01022 , H01L2924/01077 , H01L2924/00013
摘要： An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999 mass % or higher, 2-5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.
摘要翻译： 由纯度为99.999质量％以上的4-10质量％的金，纯度为99.99质量％以上的钯的2-5质量％的半导体装置用Ag-Au-Pd三元合金接合线，以及 纯度为99.999质量％以上的银（Ag）的剩余质量％ 该线材含有15-70质量ppm的氧化性非贵金属元素，并且在连续拉伸模具之前进行热退火，并且在连续拉伸模具之后进行热回火，并且该线材可用于球形粘合 氮气; 在Ag-Au-Pd三元合金线和铝焊盘之间的界面产生的Ag 2 Al和富Pd层抑制了Ag2Al金属间化合物层和电线之间的腐蚀发展。
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公开(公告)号：US20070298276A1
公开(公告)日：2007-12-27
申请号：US11791329
申请日：2005-11-22
申请人： Satoshi Teshima , Michitaka Mikami
发明人： Satoshi Teshima , Michitaka Mikami
CPC分类号： C22C5/02 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/4845 , H01L2224/48624 , H01L2224/85207 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01064 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01205 , H01L2924/10253 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , Y10T428/12431 , H01L2924/01004 , H01L2924/01204 , H01L2924/01039 , H01L2924/20105 , H01L2924/20106 , H01L2924/2011 , H01L2924/20111 , H01L2924/013 , H01L2924/01062 , H01L2924/01048 , H01L2924/01049 , H01L2924/00013 , H01L2924/00 , H01L2924/01006
摘要： Issues to be Solved Au bonding wire for semiconductor device should be provided in circumstances such as reducing the diameter of bonding wire to less than 23 μm, squashed ball with superior roundness should be formed and with strong tensile strength endurable against wire flow. Means as Solution Au bonding wire for semiconductor device, consisting of Au matrix and functional additives, containing: said Au matrix alloy including 3-15 mass ppm of Be, 3-40 mass ppm of Ca, and 3-20 mass ppm of La and roundness of squashed ball said Au alloy is 0.95-1.05.
摘要翻译： 要解决的问题半导体器件的焊接接线应在将接合线的直径减小到小于23μm的情况下提供，应形成具有优异圆度的压扁球，并具有抗拉线强度。 作为解决方案的解决方案用于半导体器件的Au接合线由Au基体和功能添加剂组成，包含：所述Au基体合金包含3-15质量ppm的Be，3-40质量ppm的Ca和3-20质量ppm的La和 压扁球的圆度表示Au合金为0.95-1.05。
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公开(公告)号：US08486555B2
公开(公告)日：2013-07-16
申请号：US12067231
申请日：2006-09-21
申请人： Yasushi Usami , Tomoyuki Nemoto , Jun Takagi , Satoshi Teshima
发明人： Yasushi Usami , Tomoyuki Nemoto , Jun Takagi , Satoshi Teshima
CPC分类号： H01M2/1653 , B29C44/06 , B29C44/3453 , B29C44/348 , B32B3/26 , B32B5/14 , B32B5/18 , B32B5/20 , B32B5/32 , B32B25/08 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/205 , B32B27/22 , B32B27/302 , B32B27/304 , B32B27/306 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/365 , B32B38/0032 , B32B2250/40 , B32B2264/102 , B32B2264/104 , B32B2266/0228 , B32B2266/025 , B32B2266/0257 , B32B2266/0264 , B32B2266/0292 , B32B2270/00 , B32B2274/00 , B32B2307/102 , B32B2307/304 , B32B2307/306 , B32B2307/538 , B32B2307/72 , B32B2307/724 , B32B2307/734 , B32B2410/00 , B32B2419/06 , B32B2437/00 , B32B2439/70 , B32B2457/10 , B32B2535/00 , B32B2551/00 , B32B2555/00 , B32B2555/02 , B32B2607/02 , C08J9/122 , C08J2201/032 , C08J2203/08 , C08J2205/05 , C08J2323/12 , Y02P20/544 , Y10T428/24504
摘要： A process for producing a porous laminate having many micropores interconnected in the thickness direction, which comprises: a step in which a laminate is produced which comprises at least three layers comprising an interlayer made of a thermoplastic resin having a hard segment and a soft segment and two nonporous outer layers made of a filler-containing resin and located as outer layers respectively on both sides of the interlayer; a step in which the laminate obtained is impregnated with a supercritical or subcritical fluid and this state is relieved to vaporize the fluid and thereby make the interlayer porous; and a step in which the two nonporous outer layers located respectively on both sides are made porous by stretching.
摘要翻译： 一种制造多孔层压体的方法，所述多孔层压体具有在厚度方向上互连的多个微孔，其包括：制造层压体的步骤，其中包括至少三层，包括由具有硬链段和软链段的热塑性树脂制成的中间层， 两个由含填料树脂制成的无孔外层分别位于中间层两侧的外层; 所获得的层压体用超临界或亚临界流体浸渍，并且缓解该状态使气体蒸发，从而使夹层多孔化; 分别位于两侧的两个无孔外层通过拉伸而制成多孔的步骤。
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