Abstract:
Apparatus might include an array of memory cells comprising a plurality of strings of series-connected memory cells and a controller for access of the array of memory cells, wherein the controller is configured to cause the apparatus to perform a sense operation on a selected memory cell of a string of series-connected memory cells, and to discharge access lines connected to the string of series-connected memory cells in a defined manner following the sense operation.
Abstract:
A transistor comprises a channel region having a frontside and a backside. A gate is adjacent the frontside of the channel region with a gate insulator being between the gate and the channel region. Insulating material having net negative charge is adjacent the backside of the channel region. The insulating material comprises at least one of AlxFy, HfAlxFy, AlOxNy, and HfAlxOyNz, where “x”, “y”, and “z” are each greater than zero. Other embodiments and aspects are disclosed.
Abstract:
Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes a memory cell string having first, second, third, fourth, and fifth memory cells; access lines including first, second, third, fourth, and fifth access lines coupled to the first, second, third, fourth, and fifth memory cells, respectively, and a module. The first memory cell is between the second and third memory cells. The second memory cell is between the first and fourth memory cells. The third memory cell is between the first and fifth memory cells. The module is to couple the first access line to a ground node at a first time of a memory operation, couple the second and third access lines to the ground node at a second time of the operation after the first time, and couple the fourth and fifth access lines to the ground node at a third time of the operation after the second time.
Abstract:
Embodiments disclosed herein may relate to forming a contact region for an interconnect between a selector transistor and a word-line electrode in a memory device.
Abstract:
Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes a memory cell string having first, second, third, fourth, and fifth memory cells; access lines including first, second, third, fourth, and fifth access lines coupled to the first, second, third, fourth, and fifth memory cells, respectively, and a module. The first memory cell is between the second and third memory cells. The second memory cell is between the first and fourth memory cells. The third memory cell is between the first and fifth memory cells. The module is to couple the first access line to a ground node at a first time of a memory operation, couple the second and third access lines to the ground node at a second time of the operation after the first time, and couple the fourth and fifth access lines to the ground node at a third time of the operation after the second time.
Abstract:
A transistor comprises a channel region having a frontside and a backside. The channel region comprises a frontside channel material at the frontside and a backside channel material at the backside. A gate is adjacent the frontside of the channel region, with a gate insulator being between the gate and the channel region. The frontside channel material has total n-type dopant therein of greater than 1×1018 atoms/cm3 to no greater than 1×1020 atoms/cm3. The backside channel material has total n-type dopant therein of 0 atoms/cm3 to 1×1018 atoms/cm3. Other embodiments and aspects are disclosed.
Abstract:
Memories might include an array of memory cells comprising a plurality of strings of series-connected memory cells and a controller for access of the array of memory cells, wherein the controller is configured to perform a sense operation on a particular memory cell of a string of series-connected memory cells, discharge the access line for a second memory cell of the string of series-connected memory cells to a first voltage level and discharge the access line for the particular memory cell to a second voltage level higher than the first voltage level after completion of the sense operation, and discharge the access line for a third memory cell of the string of series-connected memory cells to a third voltage level lower than the second voltage level and higher than the first voltage level after initiating the discharge of the access line for the particular memory cell.
Abstract:
Methods of operating a memory, and memory configured to perform similar methods, might include applying a positive first voltage level to a first node selectively connected to a string of series-connected memory cells while applying a negative second voltage level to a control gate of a transistor connected between the first node and the string of series-connected memory cells, and increasing the voltage level applied to the first node to a third voltage level while increasing the voltage level applied to the control gate of the transistor to a fourth voltage level lower than the third voltage level and higher than the first voltage level.
Abstract:
Memories might include an array of memory cells comprising a plurality of strings of series-connected memory cells and a controller for access of the array of memory cells, wherein the controller is configured to perform a sense operation on a particular memory cell of a string of series-connected memory cells, discharge the access line for a second memory cell of the string of series-connected memory cells to a first voltage level and discharge the access line for the particular memory cell to a second voltage level higher than the first voltage level after completion of the sense operation, and discharge the access line for a third memory cell of the string of series-connected memory cells to a third voltage level lower than the second voltage level and higher than the first voltage level after initiating the discharge of the access line for the particular memory cell.
Abstract:
A memory access operation is initiated to read a set of target memory cells of a target wordline of the memory device. During the memory access operation, a read voltage level is caused to be applied to the target wordline. During the memory access operation, a first pass through voltage level is caused to be applied to a first wordline adjacent to the target wordline. During the memory access operation, a second pass through voltage is caused to be applied to a second wordline adjacent to the target wordline, wherein the first pass through voltage level is less than the second pass through voltage level.