公开(公告)号：US20130233594A1

公开(公告)日：2013-09-12

申请号：US13774511

申请日：2013-02-22

Applicant: Jun-Der Lee ,  WIRE TECHNOLOGY CO., LTD.

Inventor： Jun-Der LEE ,  Hsing-Hua Tsai ,  Tung-Han Chuang

IPC: H01L23/00 ,  H01B13/30

CPC classification number: H01L24/45 ,  H01B1/02 ,  H01B13/30 ,  H01L24/43 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48507 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/85203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/01046 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/00 ,  H01L2924/01079 ,  H01L2924/00015 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2224/48 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-gold-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract translation: 本发明提供了一种用于电子封装的复合线，该复合线包括合金芯构件和在该合金芯构件的表面上形成的镀层。 合金芯材是银 - 金 - 钯合金。 镀层是纯金，纯钯或金钯合金的至少一层薄膜。 本发明还提供一种制造复合线材的方法。 该方法包括以下步骤：（a）提供线材，（b）通过包括冷加工和退火的多种工艺从线材形成具有预定直径的线材，以及（c）在表面上形成镀层 步骤（b）之前的线材，或者在步骤（b）之后通过电镀，溅射或真空蒸发在电线表面上形成镀层。

公开(公告)号：US20130233593A1

公开(公告)日：2013-09-12

申请号：US13774451

申请日：2013-02-22

Applicant: Jun-Der LEE ,  WIRE TECHNOLOGY CO., LTD.

Inventor： Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

IPC: H01B1/02 ,  H01B13/30

CPC classification number: H01B1/02 ,  H01B13/30 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/85206 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01046 ,  H01L2924/00015 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract translation: 本发明提供了一种用于电子封装的复合线，该复合线包括合金芯构件和在该合金芯构件的表面上形成的镀层。 合金芯材是银 - 钯合金。 镀层是纯金，纯钯或金钯合金的至少一层薄膜。 本发明还提供一种制造复合线材的方法。 该方法包括以下步骤：（a）提供线材，（b）通过包括冷加工和退火的多种工艺从线材形成具有预定直径的线材，以及（c）在表面上形成镀层 步骤（b）之前的线材，或者在步骤（b）之后通过电镀，溅射或真空蒸发在电线表面上形成镀层。

公开(公告)号：US20140124920A1

公开(公告)日：2014-05-08

申请号：US13762132

申请日：2013-02-07

Applicant: WIRE TECHNOLOGY CO., LTD.

Inventor： Tung-Han CHUANG ,  Hsing-Hua TSAI ,  Jun-Der LEE

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014

Abstract: A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.

Abstract translation: 提供了一种螺柱凸块结构及其制造方法。 所述柱状凸块结构包括基板和设置在所述基板上的第一银合金凸块凸块，其中所述第一银合金凸块具有Ag：Au：Pd = 60-99.98：0.01-30：0.01-10的重量百分比 。

公开(公告)号：US20140209215A1

公开(公告)日：2014-07-31

申请号：US14157413

申请日：2014-01-16

Applicant: Tung-Han CHUANG ,  Jun-Der LEE ,  Hsing-Hua TSAI

Inventor： Tung-Han CHUANG ,  Jun-Der LEE ,  Hsing-Hua TSAI

IPC: H01L23/00

CPC classification number: H01L24/43 ,  H01L24/45 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45157 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033

Abstract: A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a polycrystalline structure of a face-centered cubic lattice and consists of a plurality of equi-axial grains. The quantity of grains having annealing twins is 10 percent or more of the total quantity of the grains of the copper-based alloy wire.

Abstract translation: 提供由选自铜 - 金合金，铜 - 钯合金和铜 - 金 - 钯合金的材料制成的铜基合金线。 合金丝具有面心立方晶格的多晶结构，由多个等轴晶粒构成。 具有退火双晶的晶粒的数量是铜基合金线的晶粒总量的10％以上。

公开(公告)号：US20100319872A1

公开(公告)日：2010-12-23

申请号：US12869854

申请日：2010-08-27

Applicant: Jun-Der LEE

Inventor： Jun-Der LEE

IPC: B22D25/02 ,  B22D27/00

CPC classification number: C22C5/06 ,  B21C1/003 ,  B21C37/047 ,  B23K35/0261 ,  B23K35/24 ,  B23K35/3006 ,  C22C1/02 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A manufacturing method for a composite alloy bonding wire is provided. A primary material of Au and Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Au-Ag-Pd alloy solution. The obtained Au-Ag-Pd alloy solution is drawn to obtain a Au-Ag-Pd alloy wire. The Au-Ag-Pd alloy wire is then drawn to obtain a Au-Ag-Pd alloy bonding wire with a predetermined diameter.

Abstract translation: 提供一种复合合金接合线的制造方法。 Au和Ag的主要材料在真空熔化炉中熔融，然后将Pd的二次金属材料加入到真空熔化炉中，并与主要材料共熔，得到Au-Ag-Pd合金溶液。 将得到的Au-Ag-Pd合金溶液拉伸，得到Au-Ag-Pd合金线。 然后将Au-Ag-Pd合金线拉伸以获得具有预定直径的Au-Ag-Pd合金接合线。

公开(公告)号：US20100239455A1

公开(公告)日：2010-09-23

申请号：US12408952

申请日：2009-03-23

Applicant: Jun-Der LEE

Inventor： Jun-Der LEE

IPC: C22C5/06 ,  B21C1/00

CPC classification number: B21C1/003 ,  B21C37/047 ,  B23K35/3006 ,  C22C5/06 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/437 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/01046 ,  H01L2924/013 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2224/4321 ,  H01L2924/00015 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01005

Abstract: A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain a Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain a Ag—Pd alloy bonding wire with a predetermined diameter.

Abstract translation: 一种复合合金接合线的制造方法及其制造方法。 Ag的主要材料在真空熔化炉中熔融，然后将Pd的二次金属材料加入到真空熔化炉中，并与主要材料共熔，得到Ag-Pd合金溶液。 将得到的Ag-Pd合金溶液拉伸，得到Ag-Pd合金丝。 然后将Ag-Pd合金线拉伸以获得具有预定直径的Ag-Pd合金接合线。

公开(公告)号：US20090191424A1

公开(公告)日：2009-07-30

申请号：US12020835

申请日：2008-01-28

Applicant: Jun-Der LEE

Inventor： Jun-Der LEE

IPC: B32B15/01 ,  B21D31/00

CPC classification number: B21C1/003 ,  B21C37/047 ,  B21F19/00 ,  C25D5/34 ,  C25D5/50 ,  C25D7/0607 ,  Y10T428/12889

Abstract: A manufacturing method for a composite metal wire used as semiconductor packaging wire and products thereof. Au, Ag and Cu materials are melted in a vacuum melting furnace, and then trace metal elements are added into the vacuum melting furnace and melted together with Au, Ag and Cu materials to obtain a composite material. The obtained composite material is drawn by a fist thick drawing machine, a second thick drawing machine and a first thin drawing machine to obtain a composite metal wire with a predetermined diameter. An Au layer is electroplated to the surface of the composite metal wire. The composite metal wire with Au layer is then drawn by a thin drawing machine, a very thin drawing machine and an ultra thin drawing machine to obtain an ultra thin composite metal wire with a predetermined diameter. Finally, the surface of the composite metal wire is washed and the composite metal wire is heat treated to ensure a final product with desirable physical properties, e.g. breaking load and elongation.

Abstract translation: 用作半导体封装线的复合金属线的制造方法及其制造方法。 Au，Ag和Cu材料在真空熔化炉中熔化，然后将微量金属元素加入到真空熔化炉中，与Au，Ag和Cu材料一起熔融，得到复合材料。 所得到的复合材料由第一厚拉伸机，第二厚拉伸机和第一薄拉伸机拉伸，得到具有预定直径的复合金属丝。 将Au层电镀到复合金属线的表面。 然后，通过薄拉伸机，非常薄的拉丝机和超薄拉丝机将具有Au层的复合金属线拉制以获得具有预定直径的超薄复合金属丝。 最后，复合金属丝的表面被洗涤并且复合金属丝被热处理以确保具有所需物理性能的最终产品，例如， 断裂载荷和伸长率。

公开(公告)号：US20130160902A1

公开(公告)日：2013-06-27

申请号：US13607116

申请日：2012-09-07

Applicant: Jun-Der LEE

Inventor： Jun-Der LEE

IPC: B23K35/40

CPC classification number: B21C1/003 ,  B21C37/047 ,  B22D11/00 ,  B22D21/027 ,  B23K35/0261 ,  B23K35/22 ,  B23K35/24 ,  B23K35/3006 ,  B23K35/40 ,  C22C1/02 ,  C22C5/06 ,  C22F1/00 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/4381 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/745 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3656 ,  H01L2224/45144 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/01013 ,  H01L2924/00013 ,  H01L2924/20101 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A manufacturing method for a composite alloy bonding wire and products thereof are provided. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.

Abstract translation: 提供了复合合金接合线的制造方法及其制造方法。 Ag的主要材料在真空熔化炉中熔化，然后将Pd的二次金属材料加入到真空熔化炉中，并与主要材料共熔，得到Ag-Pd合金溶液。 将得到的Ag-Pd合金溶液拉伸以获得Ag-Pd合金线。 然后将Ag-Pd合金线拉伸以获得具有预定直径的Ag-Pd合金接合线。

公开(公告)号：US20120093681A1

公开(公告)日：2012-04-19

申请号：US13334047

申请日：2011-12-21

Applicant: Jun-Der LEE

Inventor： Jun-Der LEE

IPC: C22C5/06 ,  B22D25/02

CPC classification number: B21C1/003 ,  B21C37/047 ,  B23K35/0261 ,  B23K35/22 ,  B23K35/24 ,  B23K35/3006 ,  C22C1/02 ,  C22C5/06 ,  C22F1/00 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48507 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2924/00015

Abstract: A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.

Abstract translation: 一种复合合金接合线的制造方法及其制造方法。 Ag的主要材料在真空熔化炉中熔化，然后将Pd的二次金属材料加入到真空熔化炉中，并与主要材料共熔，得到Ag-Pd合金溶液。 将得到的Ag-Pd合金溶液拉伸以获得Ag-Pd合金线。 然后将Ag-Pd合金线拉伸以获得具有预定直径的Ag-Pd合金接合线。

公开(公告)号：US20100239456A1

公开(公告)日：2010-09-23

申请号：US12408987

申请日：2009-03-23

Applicant: Jun-Der LEE

Inventor： Jun-Der LEE

IPC: C22C5/06 ,  B21C1/02

CPC classification number: C22C5/06 ,  B21C1/003 ,  B21C37/047 ,  B23K35/0261 ,  B23K35/24 ,  B23K35/3006 ,  C22C1/02 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Au and Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Au—Ag—Pd alloy solution. The obtained Au—Ag—Pd alloy solution is drawn to obtain a Au—Ag—Pd alloy wire. The Au—Ag—Pd alloy wire is then drawn to obtain a Au—Ag—Pd alloy bonding wire with a predetermined diameter.

Abstract translation: 一种复合合金接合线的制造方法及其制造方法。 Au和Ag的主要材料在真空熔化炉中熔融，然后将Pd的二次金属材料加入到真空熔化炉中，并与主要材料共熔，得到Au-Ag-Pd合金溶液。 将得到的Au-Ag-Pd合金溶液拉伸，得到Au-Ag-Pd合金线。 然后将Au-Ag-Pd合金线拉伸以获得具有预定直径的Au-Ag-Pd合金接合线。