公开(公告)号：US20130233593A1

公开(公告)日：2013-09-12

申请号：US13774451

申请日：2013-02-22

Applicant: Jun-Der LEE ,  WIRE TECHNOLOGY CO., LTD.

Inventor： Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

IPC: H01B1/02 ,  H01B13/30

CPC classification number: H01B1/02 ,  H01B13/30 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/85206 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01046 ,  H01L2924/00015 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract translation: 本发明提供了一种用于电子封装的复合线，该复合线包括合金芯构件和在该合金芯构件的表面上形成的镀层。 合金芯材是银 - 钯合金。 镀层是纯金，纯钯或金钯合金的至少一层薄膜。 本发明还提供一种制造复合线材的方法。 该方法包括以下步骤：（a）提供线材，（b）通过包括冷加工和退火的多种工艺从线材形成具有预定直径的线材，以及（c）在表面上形成镀层 步骤（b）之前的线材，或者在步骤（b）之后通过电镀，溅射或真空蒸发在电线表面上形成镀层。

公开(公告)号：US20140124920A1

公开(公告)日：2014-05-08

申请号：US13762132

申请日：2013-02-07

Applicant: WIRE TECHNOLOGY CO., LTD.

Inventor： Tung-Han CHUANG ,  Hsing-Hua TSAI ,  Jun-Der LEE

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014

Abstract: A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.

Abstract translation: 提供了一种螺柱凸块结构及其制造方法。 所述柱状凸块结构包括基板和设置在所述基板上的第一银合金凸块凸块，其中所述第一银合金凸块具有Ag：Au：Pd = 60-99.98：0.01-30：0.01-10的重量百分比 。

公开(公告)号：US20140209215A1

公开(公告)日：2014-07-31

申请号：US14157413

申请日：2014-01-16

Applicant: Tung-Han CHUANG ,  Jun-Der LEE ,  Hsing-Hua TSAI

Inventor： Tung-Han CHUANG ,  Jun-Der LEE ,  Hsing-Hua TSAI

IPC: H01L23/00

CPC classification number: H01L24/43 ,  H01L24/45 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45157 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033

Abstract: A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a polycrystalline structure of a face-centered cubic lattice and consists of a plurality of equi-axial grains. The quantity of grains having annealing twins is 10 percent or more of the total quantity of the grains of the copper-based alloy wire.

Abstract translation: 提供由选自铜 - 金合金，铜 - 钯合金和铜 - 金 - 钯合金的材料制成的铜基合金线。 合金丝具有面心立方晶格的多晶结构，由多个等轴晶粒构成。 具有退火双晶的晶粒的数量是铜基合金线的晶粒总量的10％以上。

公开(公告)号：US20180076167A1

公开(公告)日：2018-03-15

申请号：US15588557

申请日：2017-05-05

Applicant: Wire Technology Co., LTD.

Inventor： Chien-Hsun CHUANG ,  Hsing-Hua TSAI ,  Shang-Chih WANG

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L21/48 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45139 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85447 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/206 ,  H01L2924/00

Abstract: A metallic ribbon for power module packaging is described. The metallic ribbon has a rectangular, oval or oblong cross section. The composition of the metallic ribbon is silver-palladium alloy containing 0.2 to 6 wt % Pd. The metallic ribbon has a thickness of 10 μm to 500 μm. The width of the metallic ribbon is 2 to 100 times its thickness. The metallic ribbon includes a plurality of grains. The average grain size of the grains observed in the transverse cross section is 2 μm to 10 μm. The metallic ribbon has a plurality of twin grains observed in the transverse cross section, and the number of twin grains observed in the transverse cross section accounts for at least 5% of the total number of grains observed in the transverse cross section.

公开(公告)号：US20130171470A1

公开(公告)日：2013-07-04

申请号：US13495800

申请日：2012-06-13

Applicant: Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

Inventor： Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

IPC: B32B15/01 ,  C22C5/06 ,  C22F1/14 ,  B32B15/02

CPC classification number: B32B15/018 ,  C22C5/06 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/0132 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/45669 ,  H01L2224/45647 ,  H01L2924/01204 ,  H01L2224/48 ,  H01L2924/00013 ,  H01L2224/4321 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2924/01045 ,  H01L2924/01004 ,  H01L2924/01005

Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Abstract translation: 提供由选自银 - 金合金，银 - 钯合金和银 - 钯 - 钯合金之一的材料制成的合金丝。 合金线具有面心立方晶格的多晶结构，并且包括多个晶粒。 合金线的中心部分包​​括细长晶粒或等轴晶粒，合金线的其他部分由等轴晶粒组成。 一定数量的具有退火双晶的晶粒是合金丝的晶粒总量的20％以上。