公开(公告)号：US20170103823A1

公开(公告)日：2017-04-13

申请号：US14991850

申请日：2016-01-08

Applicant: Wire Technology Co., LTD.

Inventor： Chien-Hsun Chuang ,  Hsing-Hua Tsai

IPC: H01B1/02 ,  H01B13/16 ,  C25D9/08 ,  H01B13/00 ,  C22F1/14 ,  C22F1/02

CPC classification number: H01B1/02 ,  C22F1/02 ,  C22F1/14 ,  C25D7/0607 ,  C25D9/08 ,  H01B1/04 ,  H01B13/0006 ,  H01B13/16 ,  H01L2224/45139 ,  H01L2224/45565 ,  H01L2224/45693 ,  H01L2924/01046

Abstract: A graphene coated silver alloy wire is provided. The composite wire includes a core wire and one to three layers of graphene covering surfaces of the core wire. The core wire is made of a silver-based alloy including 2 to 6 weight percent of palladium. The core wire may be optionally added with 0.01 to 10 weight percent of gold. The invention also includes a manufacturing method immersing the core wire into a solution including graphene oxide and applying bias to the core wire for manufacturing the graphene coated silver alloy wire.

公开(公告)号：US09490147B2

公开(公告)日：2016-11-08

申请号：US13762132

申请日：2013-02-07

Applicant: Wire Technology Co., LTD.

Inventor： Tung-Han Chuang ,  Hsing-Hua Tsai ,  Jun-Der Lee

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014

Abstract: A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.

Abstract translation: 提供了一种螺柱凸块结构及其制造方法。 所述柱状凸块结构包括基板和设置在所述基板上的第一银合金凸块凸块，其中所述第一银合金凸块具有Ag：Au：Pd = 60-99.98：0.01-30：0.01-10的重量百分比 。

公开(公告)号：US20180076167A1

公开(公告)日：2018-03-15

申请号：US15588557

申请日：2017-05-05

Applicant: Wire Technology Co., LTD.

Inventor： Chien-Hsun CHUANG ,  Hsing-Hua TSAI ,  Shang-Chih WANG

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L21/48 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45139 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85447 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/206 ,  H01L2924/00

Abstract: A metallic ribbon for power module packaging is described. The metallic ribbon has a rectangular, oval or oblong cross section. The composition of the metallic ribbon is silver-palladium alloy containing 0.2 to 6 wt % Pd. The metallic ribbon has a thickness of 10 μm to 500 μm. The width of the metallic ribbon is 2 to 100 times its thickness. The metallic ribbon includes a plurality of grains. The average grain size of the grains observed in the transverse cross section is 2 μm to 10 μm. The metallic ribbon has a plurality of twin grains observed in the transverse cross section, and the number of twin grains observed in the transverse cross section accounts for at least 5% of the total number of grains observed in the transverse cross section.

公开(公告)号：US20150194409A1

公开(公告)日：2015-07-09

申请号：US14256233

申请日：2014-04-18

Applicant: WIRE TECHNOLOGY CO., LTD.

Inventor： Tung-Han Chuang ,  Hsing-Hua Tsai ,  Jun-Der Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/73204 ,  H01L2224/8109 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8181 ,  H01L2224/8381 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/3651 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/07802 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/11462 ,  H01L2224/13144 ,  H01L2924/1204

Abstract: A stud bump structure, a package structure thereof and method of manufacturing the package structure are provided. The stud bump structure include a first chip; and a silver alloy stud bump disposed on the substrate, wherein the on-chip silver alloy stud bump includes Pd of 0.01˜10 wt %, while the balance is Ag. The package structure further includes a substrate having an on-substrate bond pad electrically connected to the on-chip silver alloy stud bump by flip chip bonding.

Abstract translation: 提供了一种螺柱凸块结构，其封装结构和制造封装结构的方法。 螺柱凸块结构包括第一芯片; 和设置在基板上的银合金凸块凸块，其中片上银合金凸块凸块包括0.01〜10重量％的Pd，余量为Ag。 封装结构还包括具有通过倒装芯片接合电连接到片上银合金柱形凸块的衬底上焊盘的衬底。

公开(公告)号：US20130233593A1

公开(公告)日：2013-09-12

申请号：US13774451

申请日：2013-02-22

Applicant: Jun-Der LEE ,  WIRE TECHNOLOGY CO., LTD.

Inventor： Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

IPC: H01B1/02 ,  H01B13/30

CPC classification number: H01B1/02 ,  H01B13/30 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/85206 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01046 ,  H01L2924/00015 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract translation: 本发明提供了一种用于电子封装的复合线，该复合线包括合金芯构件和在该合金芯构件的表面上形成的镀层。 合金芯材是银 - 钯合金。 镀层是纯金，纯钯或金钯合金的至少一层薄膜。 本发明还提供一种制造复合线材的方法。 该方法包括以下步骤：（a）提供线材，（b）通过包括冷加工和退火的多种工艺从线材形成具有预定直径的线材，以及（c）在表面上形成镀层 步骤（b）之前的线材，或者在步骤（b）之后通过电镀，溅射或真空蒸发在电线表面上形成镀层。

公开(公告)号：US09425168B2

公开(公告)日：2016-08-23

申请号：US14256233

申请日：2014-04-18

Applicant: WIRE TECHNOLOGY CO., LTD.

Inventor： Tung-Han Chuang ,  Hsing-Hua Tsai ,  Jun-Der Lee

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/73204 ,  H01L2224/8109 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8181 ,  H01L2224/8381 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/3651 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/07802 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/11462 ,  H01L2224/13144 ,  H01L2924/1204

Abstract: A stud bump structure, a package structure thereof and method of manufacturing the package structure are provided. The stud bump structure include a first chip; and a silver alloy stud bump disposed on the substrate, wherein the on-chip silver alloy stud bump includes Pd of 0.01˜10 wt %, while the balance is Ag. The package structure further includes a substrate having an on-substrate bond pad electrically connected to the on-chip silver alloy stud bump by flip chip bonding.

Abstract translation: 提供了一种螺柱凸块结构，其封装结构和制造封装结构的方法。 螺柱凸块结构包括第一芯片; 和设置在基板上的银合金凸块凸块，其中片上银合金凸块凸块包括0.01〜10重量％的Pd，余量为Ag。 封装结构还包括具有通过倒装芯片接合电连接到片上银合金柱形凸块的衬底上焊盘的衬底。

公开(公告)号：US20140124920A1

公开(公告)日：2014-05-08

申请号：US13762132

申请日：2013-02-07

Applicant: WIRE TECHNOLOGY CO., LTD.

Inventor： Tung-Han CHUANG ,  Hsing-Hua TSAI ,  Jun-Der LEE

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014

Abstract: A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump disposed on the substrate, wherein the first silver alloy stud bump has a weight percentage ratio of Ag:Au:Pd=60-99.98:0.01-30:0.01-10.

Abstract translation: 提供了一种螺柱凸块结构及其制造方法。 所述柱状凸块结构包括基板和设置在所述基板上的第一银合金凸块凸块，其中所述第一银合金凸块具有Ag：Au：Pd = 60-99.98：0.01-30：0.01-10的重量百分比 。

公开(公告)号：US20130233594A1

公开(公告)日：2013-09-12

申请号：US13774511

申请日：2013-02-22

Applicant: Jun-Der Lee ,  WIRE TECHNOLOGY CO., LTD.

Inventor： Jun-Der LEE ,  Hsing-Hua Tsai ,  Tung-Han Chuang

IPC: H01L23/00 ,  H01B13/30

CPC classification number: H01L24/45 ,  H01B1/02 ,  H01B13/30 ,  H01L24/43 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48507 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/85203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/01046 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/00 ,  H01L2924/01079 ,  H01L2924/00015 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2224/48 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-gold-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract translation: 本发明提供了一种用于电子封装的复合线，该复合线包括合金芯构件和在该合金芯构件的表面上形成的镀层。 合金芯材是银 - 金 - 钯合金。 镀层是纯金，纯钯或金钯合金的至少一层薄膜。 本发明还提供一种制造复合线材的方法。 该方法包括以下步骤：（a）提供线材，（b）通过包括冷加工和退火的多种工艺从线材形成具有预定直径的线材，以及（c）在表面上形成镀层 步骤（b）之前的线材，或者在步骤（b）之后通过电镀，溅射或真空蒸发在电线表面上形成镀层。