公开(公告)号：US20180358467A1

公开(公告)日：2018-12-13

申请号：US16108610

申请日：2018-08-22

Applicant: Intel Corporation

Inventor： Seiyon KIM ,  Rafael RIOS ,  Fahmida FERDOUSI ,  Kelin J. KUHN

IPC: H01L29/78 ,  H01L29/786 ,  B82Y10/00 ,  H01L29/775 ,  H01L29/66 ,  H01L29/423 ,  H01L29/16 ,  H01L29/10 ,  H01L29/06 ,  H01L21/306 ,  H01L21/02 ,  B82Y40/00

Abstract: Non-planar semiconductor devices having hybrid geometry-based active regions are described. For example, a semiconductor device includes a hybrid channel region including a nanowire portion disposed above an omega-FET portion disposed above a fin-FET portion. A gate stack is disposed on exposed surfaces of the hybrid channel region. The gate stack includes a gate dielectric layer and a gate electrode disposed on the gate dielectric layer. Source and drain regions are disposed on either side of the hybrid channel region.

公开(公告)号：US20180204842A1

公开(公告)日：2018-07-19

申请号：US15574092

申请日：2015-06-23

Applicant: Intel Corporation

Inventor： Elijah V. KARPOV ,  Jack T. KAVALIEROS ,  Robert S. CHAU ,  Niloy MUKHERJEE ,  Rafael RIOS ,  Prashant MAJHI ,  Van H. LE ,  Ravi PILLARISETTY ,  Uday SHAH ,  Gilbert DEWEY ,  Marko RADOSAVLJEVIC

IPC: H01L27/108 ,  H01L27/24 ,  H01L27/11551 ,  H01L27/1156 ,  H01L29/786 ,  H01L45/00 ,  G11C13/00

CPC classification number: H01L27/108 ,  G11C13/0007 ,  H01L27/11551 ,  H01L27/1156 ,  H01L27/1214 ,  H01L27/2436 ,  H01L27/2472 ,  H01L27/2481 ,  H01L29/7869 ,  H01L45/04 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/145 ,  H01L45/146 ,  H01L45/148 ,  H01L45/1625 ,  H01L45/1633

Abstract: A thin film transistor is deposited over a portion of a metal layer over a substrate. A memory element is coupled to the thin film transistor to provide a first memory cell. A second memory cell is over the first memory. A logic block is coupled to at least the first memory cell.

公开(公告)号：US20200152738A1

公开(公告)日：2020-05-14

申请号：US16740132

申请日：2020-01-10

Applicant: Intel Corporation

Inventor： Seiyon KIM ,  Kelin J. KUHN ,  Tahir GHANI ,  Anand S. MURTHY ,  Mark ARMSTRONG ,  Rafael RIOS ,  Abhijit Jayant PETHE ,  Willy RACHMADY

IPC: H01L29/06 ,  H01L29/66 ,  H01L29/08 ,  H01L21/3115 ,  H01L21/3105 ,  H01L21/306 ,  H01L29/78 ,  H01L29/423 ,  H01L29/786

Abstract: A nanowire device having a plurality of internal spacers and a method for forming said internal spacers are disclosed. In an embodiment, a semiconductor device comprises a nanowire stack disposed above a substrate, the nanowire stack having a plurality of vertically-stacked nanowires, a gate structure wrapped around each of the plurality of nanowires, defining a channel region of the device, the gate structure having gate sidewalls, a pair of source/drain regions on opposite sides of the channel region; and an internal spacer on a portion of the gate sidewall between two adjacent nanowires, internal to the nanowire stack. In an embodiment, the internal spacers are formed by depositing spacer material in dimples etched adjacent to the channel region. In an embodiment, the dimples are etched through the channel region. In another embodiment, the dimples are etched through the source/drain region.

公开(公告)号：US20190051725A1

公开(公告)日：2019-02-14

申请号：US16153456

申请日：2018-10-05

Applicant: Intel Corporation

Inventor： Seiyon KIM ,  Kelin J. KUHN ,  Tahir GHANI ,  Anand S. MURTHY ,  Mark ARMSTRONG ,  Rafael RIOS ,  Abhijit Jayant PETHE ,  Willy RACHMADY

IPC: H01L29/06 ,  H01L29/423

Abstract: A nanowire device having a plurality of internal spacers and a method for forming said internal spacers are disclosed. In an embodiment, a semiconductor device comprises a nanowire stack disposed above a substrate, the nanowire stack having a plurality of vertically-stacked nanowires, a gate structure wrapped around each of the plurality of nanowires, defining a channel region of the device, the gate structure having gate sidewalls, a pair of source/drain regions on opposite sides of the channel region; and an internal spacer on a portion of the gate sidewall between two adjacent nanowires, internal to the nanowire stack. In an embodiment, the internal spacers are formed by depositing spacer material in dimples etched adjacent to the channel region. In an embodiment, the dimples are etched through the channel region. In another embodiment, the dimples are etched through the source/drain region.

公开(公告)号：US20170358658A1

公开(公告)日：2017-12-14

申请号：US15506205

申请日：2014-09-26

Applicant: INTEL CORPORATION

Inventor： Rafael RIOS ,  Kelin J. KUHN ,  Seiyon KIM ,  Justin R. Weber

IPC: H01L29/66 ,  H01L29/06 ,  H01L29/423

CPC classification number: H01L29/66439 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/0669 ,  H01L29/0673 ,  H01L29/122 ,  H01L29/16 ,  H01L29/20 ,  H01L29/24 ,  H01L29/42356 ,  H01L29/42364 ,  H01L29/4238 ,  H01L29/42384 ,  H01L29/42392 ,  H01L29/4908 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/775 ,  H01L29/778 ,  H01L29/78636 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L49/00

Abstract: Embodiments of the invention include metal oxide metal field effect transistors (MOMFETs) and methods of making such devices. In embodiments, the MOMFET device includes a source and a drain with a channel disposed between the source and the drain. According to an embodiment, the channel has at least one confined dimension that produces a quantum confinement effect in the channel. In an embodiment, the MOMFET device also includes a gate electrode that is separated from the channel by a gate dielectric. According to embodiments, the band-gap energy of the channel may be modulated by changing the size of the channel, the material used for the channel, and/or the surface termination applied to the channel. Embodiments also include forming an type device and a P-type device by controlling the work-function of the source and drain relative to the conduction band and valance band energies of the channel.

公开(公告)号：US20170162676A1

公开(公告)日：2017-06-08

申请号：US15434981

申请日：2017-02-16

Applicant: Intel Corporation

Inventor： Annalisa CAPPELLANI ,  Stephen M. CEA ,  Tahir GHANI ,  Harry GOMEZ ,  Jack T. KAVALIEROS ,  Patrick H. KEYS ,  Seiyon KIM ,  Kelin J. KUHN ,  Aaron D. LILAK ,  Rafael RIOS ,  Mayank SAHNI

IPC: H01L29/66 ,  H01L21/762 ,  H01L29/423 ,  H01L29/06 ,  H01L29/78

CPC classification number: H01L29/66818 ,  B82Y10/00 ,  H01L21/762 ,  H01L21/76216 ,  H01L27/1203 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785

Abstract: Semiconductor devices with isolated body portions are described. For example, a semiconductor structure includes a semiconductor body disposed above a semiconductor substrate. The semiconductor body includes a channel region and a pair of source and drain regions on either side of the channel region. An isolation pedestal is disposed between the semiconductor body and the semiconductor substrate. A gate electrode stack at least partially surrounds a portion of the channel region of the semiconductor body.

公开(公告)号：US20210050455A1

公开(公告)日：2021-02-18

申请号：US17074251

申请日：2020-10-19

Applicant: Intel Corporation

Inventor： Van H. LE ,  Gilbert DEWEY ,  Rafael RIOS ,  Jack T. KAVALIEROS ,  Marko RADOSAVLJEVIC ,  Kent E. MILLARD ,  Marc C. FRENCH ,  Ashish AGRAWAL ,  Benjamin CHU-KUNG ,  Ryan E. ARCH

IPC: H01L29/786 ,  H01L29/423 ,  H01L29/06 ,  H01L29/66 ,  H01L21/02 ,  H01L29/24 ,  H01L29/40 ,  H01L29/49

Abstract: Embodiments of the invention include non-planar InGaZnO (IGZO) transistors and methods of forming such devices. In an embodiment, the IGZO transistor may include a substrate and source and drain regions formed over the substrate. According to an embodiment, an IGZO layer may be formed above the substrate and may be electrically coupled to the source region and the drain region. Further embodiments include a gate electrode that is separated from the IGZO layer by a gate dielectric. In an embodiment, the gate dielectric contacts more than one surface of the IGZO layer. In one embodiment, the IGZO transistor is a finfet transistor. In another embodiment the IGZO transistor is a nanowire or a nanoribbon transistor. Embodiments of the invention may also include a non-planar IGZO transistor that is formed in the back end of line stack (BEOL) of an integrated circuit chip.

公开(公告)号：US20200185526A1

公开(公告)日：2020-06-11

申请号：US16785975

申请日：2020-02-10

Applicant: Intel Corporation

Inventor： Seiyon KIM ,  Rafael RIOS ,  Fahmida FERDOUSI ,  Kelin J. KUHN

IPC: H01L29/78 ,  H01L29/786 ,  H01L29/66 ,  H01L29/10 ,  H01L29/06 ,  H01L21/306 ,  H01L21/02 ,  H01L29/423 ,  H01L29/16 ,  H01L29/775 ,  B82Y40/00 ,  B82Y10/00

Abstract: Non-planar semiconductor devices having hybrid geometry-based active regions are described. For example, a semiconductor device includes a hybrid channel region including a nanowire portion disposed above an omega-FET portion disposed above a fin-FET portion. A gate stack is disposed on exposed surfaces of the hybrid channel region. The gate stack includes a gate dielectric layer and a gate electrode disposed on the gate dielectric layer. Source and drain regions are disposed on either side of the hybrid channel region.

公开(公告)号：US20190393223A1

公开(公告)日：2019-12-26

申请号：US16480948

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Abhishek Anil SHARMA ,  Van H. LE ,  Gilbert William DEWEY ,  Rafael RIOS ,  Jack T. KAVALIEROS ,  Yih WANG ,  Shriram SHIVARAMAN

IPC: H01L27/108 ,  H01L27/13 ,  G11C11/4096 ,  G11C11/408 ,  H01L29/786 ,  H01L21/768 ,  H01L21/02 ,  H01L29/40 ,  H01L21/311 ,  H01L49/02 ,  H01L29/423 ,  H01L29/66 ,  H01L29/24 ,  H01L29/22

Abstract: A charge storage memory is described based on a vertical shared gate thin-film transistor. In one example, a memory cell structure includes a capacitor to store a charge, the state of the charge representing a stored value, and an access transistor having a drain coupled to a bit line to read the capacitor state, a vertical gate coupled to a word line to write the capacitor state, and a drain coupled to the capacitor to charge the capacitor from the drain through the gate, wherein the gate extends from the word line through metal layers of an integrated circuit.

公开(公告)号：US20180254778A1

公开(公告)日：2018-09-06

申请号：US15755021

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Rafael RIOS ,  Van LE ,  Gilbert DEWEY ,  Jack T. KAVALIEROS

IPC: H03K19/00 ,  H03K19/094 ,  G06F1/32 ,  G06F17/50 ,  H01L27/02

CPC classification number: H03K19/0016 ,  G06F1/3203 ,  G06F17/5045 ,  G06F17/5068 ,  H01L27/0207 ,  H03K19/0008 ,  H03K19/0013 ,  H03K19/094

Abstract: A power gating switch is described at a local cell level of an integrated circuit die. In one example a plurality of logic cells have a data input line and a data output line and a power supply input to receive power to drive circuits of the logic cell. A power switch for each logic cell is coupled between a power supply and the power supply input of the respective logic cell to control power being connected from the power supply to the respective logic cell.