公开(公告)号：US20050093148A1

公开(公告)日：2005-05-05

申请号：US10944684

申请日：2004-09-17

申请人： Andre Hanke ,  Stephan Dobritz

发明人： Andre Hanke ,  Stephan Dobritz

IPC分类号： H01L23/31 ,  H01L23/498 ,  H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40 ,  H01L21/44 ,  H01L23/52

CPC分类号： H05K3/4007 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  H05K3/0041 ,  H05K3/22 ,  H05K3/3436 ,  H05K2201/0367 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip. A plurality of connection elements are positioned for electrical contact-connection with a printed circuit board. The interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate.

摘要翻译： 电子部件包括插入器基板和安装在插入器基板上的至少一个半导体芯片。 多个电连接将所述插入器基板的再布线电耦合到所述至少一个半导体芯片的接触区域。 定位多个连接元件用于与印刷电路板的电接触连接。 互连元件包括中空圆柱形或棒形元件，其穿透并固定地连接到插入器基板。

公开(公告)号：US20070123066A1

公开(公告)日：2007-05-31

申请号：US11657164

申请日：2007-01-24

申请人： Andre Hanke ,  Stephan Dobritz

发明人： Andre Hanke ,  Stephan Dobritz

IPC分类号： H01R12/00

CPC分类号： H05K3/4007 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  H05K3/0041 ,  H05K3/22 ,  H05K3/3436 ,  H05K2201/0367 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip. A plurality of connection elements are positioned for electrical contact-connection with a printed circuit board. The interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate.

公开(公告)号：US20050085105A1

公开(公告)日：2005-04-21

申请号：US10944537

申请日：2004-09-17

申请人： Andre Hanke ,  Stephan Dobritz

发明人： Andre Hanke ,  Stephan Dobritz

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R31/28 ,  H01R13/22 ,  H01R33/76 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H01R12/00

CPC分类号： H01R13/22 ,  G01R1/0483 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/28 ,  H05K3/325 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/167 ,  H01L2924/00

摘要： An arrangement for producing an electrical connection between a ball grid array (BGA) package and a signal source is disclosed. A flexible printed circuit board (PCB) has conductor (e.g., copper) tracks arranged between flexible plastic layers. A contact receptacle with guide elements for the BGA package is located over a portion of the flexible PCB. Contact structures are electrically coupled to the conductor tracks of the flexible PCB and accessible via the contact receptacle. The contact structures serve for providing an electrical contact-connection of terminals of a BGA package placed in the receptacle. The contact structures comprise column- or sleeve-shaped contact elements that extend through the flexible PCB and project upwards on one side from one of the flexible plastic layers.

摘要翻译： 公开了一种用于在球栅阵列（BGA）封装和信号源之间产生电连接的装置。 柔性印刷电路板（PCB）具有布置在柔性塑料层之间的导体（例如，铜）轨道。 具有用于BGA封装的引导元件的接触插座位于柔性PCB的一部分上方。 接触结构电耦合到柔性PCB的导体轨道并且经由接触插座可接近。 接触结构用于提供放置在容器中的BGA封装的端子的电接触连接。 接触结构包括延伸穿过柔性PCB并从一个柔性塑料层的一侧向上突出的柱形或套筒状接触元件。

公开(公告)号：US20090001366A1

公开(公告)日：2009-01-01

申请号：US11778555

申请日：2007-07-16

申请人： Stephan Dobritz ,  Stefan Ruckmich

发明人： Stephan Dobritz ,  Stefan Ruckmich

IPC分类号： H01L23/58 ,  G01R31/26 ,  H01L21/66

CPC分类号： H01L22/32 ,  G01R31/2884

摘要： A wafer arrangement in accordance with an embodiment of the invention includes a wafer having a plurality of dice, wherein at least some of the dice have a first connection, and at least one contact pad formed at the wafer edge, wherein a plurality of first connections are coupled by means of a section of a redistribution layer and the contact pad is formed by the section of the redistribution layer.

摘要翻译： 根据本发明的实施例的晶片布置包括具有多个裸片的晶片，其中至少一些裸片具有第一连接，以及形成在晶片边缘处的至少一个接触焊盘，其中多个第一连接 通过再分配层的一部分耦合，并且接触垫由再分布层的部分形成。

公开(公告)号：US08072084B2

公开(公告)日：2011-12-06

申请号：US11855734

申请日：2007-09-14

申请人： Roland Irsigler ,  Harry Hedler ,  Stephan Dobritz

发明人： Roland Irsigler ,  Harry Hedler ,  Stephan Dobritz

IPC分类号： H01L23/482

CPC分类号： H01L24/11 ,  H01L23/3128 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/00014

摘要： An integrated circuit, a circuit system and method of manufacturing such is disclosed. One embodiment provides a circuit chip including a first contact field on a chip surface; and an insulating layer on the chip surface. The insulating layer includes a flexible material. A contact pillar is coupled to the first contact field and extends from the chip surface through the insulating layer. The contact pillar includes a conductive material.

摘要翻译： 公开了一种集成电路，电路系统及其制造方法。 一个实施例提供一种包括芯片表面上的第一接触场的电路芯片; 以及芯片表面上的绝缘层。 绝缘层包括柔性材料。 接触柱耦合到第一接触场，并从芯片表面延伸穿过绝缘层。 接触柱包括导电材料。

公开(公告)号：US08093696B2

公开(公告)日：2012-01-10

申请号：US12122215

申请日：2008-05-16

申请人： Kimyung Yoon ,  Stephan Dobritz ,  Stefan Ruckmich

发明人： Kimyung Yoon ,  Stephan Dobritz ,  Stefan Ruckmich

IPC分类号： H01L23/02

CPC分类号： H01L23/49822 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19107 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment of the present invention, a semiconductor device is provided, that includes a semiconductor carrier; a cavity formed within the semiconductor carrier, the cavity extending from the top surface of the semiconductor carrier into the semiconductor carrier; and at least one semiconductor chip provided within the cavity.

摘要翻译： 根据本发明的一个实施例，提供一种包括半导体载体的半导体器件; 形成在所述半导体载体内的空腔，所述空腔从所述半导体载体的顶表面延伸到所述半导体载体中; 以及设置在腔内的至少一个半导体芯片。

公开(公告)号：US07834462B2

公开(公告)日：2010-11-16

申请号：US11856652

申请日：2007-09-17

申请人： Stephan Dobritz ,  Christoph Polaczyk ,  Roland Irsigler

发明人： Stephan Dobritz ,  Christoph Polaczyk ,  Roland Irsigler

IPC分类号： H01L23/48 ,  H01L23/02

CPC分类号： H05K3/3436 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/112 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment of the present invention, an electric device includes: a top surface and a bottom surface; a contact hole extending from the top surface through the device to the bottom surface; a conductive sealing element which seals the contact hole at or near the bottom surface; a conductive connection which is coupled to the conductive sealing element and which extends through the contact hole to the top surface; and solder material which is provided on a bottom surface of the conductive sealing element.

摘要翻译： 根据本发明的一个实施例，电气设备包括：顶表面和底表面; 从所述顶表面穿过所述装置延伸到所述底表面的接触孔; 导电密封元件，其在底表面处或附近密封接触孔; 导电连接，其连接到导电密封元件并且延伸穿过接触孔到达顶表面; 以及设置在导电性密封元件的底面上的焊料。

公开(公告)号：US07220666B2

公开(公告)日：2007-05-22

申请号：US10944684

申请日：2004-09-17

申请人： André Hanke ,  Stephan Dobritz

发明人： André Hanke ,  Stephan Dobritz

IPC分类号： H01L21/4763

CPC分类号： H05K3/4007 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  H05K3/0041 ,  H05K3/22 ,  H05K3/3436 ,  H05K2201/0367 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip. A plurality of connection elements are positioned for electrical contact-connection with a printed circuit board. The interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate.

摘要翻译： 电子部件包括插入器基板和安装在插入器基板上的至少一个半导体芯片。 多个电连接将所述插入器基板的再布线电耦合到所述至少一个半导体芯片的接触区域。 定位多个连接元件用于与印刷电路板的电接触连接。 互连元件包括中空圆柱形或棒形元件，其穿透并固定地连接到插入器基板。

公开(公告)号：US20090072398A1

公开(公告)日：2009-03-19

申请号：US11855734

申请日：2007-09-14

申请人： Roland Irsigler ,  Harry Hedler ,  Stephan Dobritz

发明人： Roland Irsigler ,  Harry Hedler ,  Stephan Dobritz

IPC分类号： H01L23/482 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L23/3128 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/00014

摘要： An integrated circuit, a circuit system and method of manufacturing such is disclosed. One embodiment provides a circuit chip including a first contact field on a chip surface; and an insulating layer on the chip surface. The insulating layer includes a flexible material. A contact pillar is coupled to the first contact field and extends from the chip surface through the insulating layer. The contact pillar includes a conductive material.

摘要翻译： 公开了一种集成电路，电路系统及其制造方法。 一个实施例提供一种包括芯片表面上的第一接触场的电路芯片; 以及芯片表面上的绝缘层。 绝缘层包括柔性材料。 接触柱耦合到第一接触场，并从芯片表面延伸穿过绝缘层。 接触柱包括导电材料。

公开(公告)号：US20080079149A1

公开(公告)日：2008-04-03

申请号：US11529751

申请日：2006-09-28

申请人： Harry Hedler ,  Stephan Dobritz

发明人： Harry Hedler ,  Stephan Dobritz

IPC分类号： H01L23/48

CPC分类号： H05K1/181 ,  G11C5/04 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K2201/097 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2224/0401

摘要： A circuit board arrangement has a circuit board and a number of die elements, which are electrically conductively coupled to the circuit board by means of contacting elements. The die elements are arranged laterally partially overlapping one another on the circuit board, the contacting elements of the respective die elements being arranged next to one another.

摘要翻译： 电路板布置具有电路板和多个管芯元件，其通过接触元件导电地耦合到电路板。 模具元件在电路板上横向部分地彼此重叠地布置，各个模具元件的接触元件彼此相邻布置。