发明申请
US20050085105A1 Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection
失效
用于产生BGA封装和信号源之间的电连接的布置以及用于产生这种连接的方法
- 专利标题： Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection
- 专利标题（中）： 用于产生BGA封装和信号源之间的电连接的布置以及用于产生这种连接的方法
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申请号： US10944537申请日： 2004-09-17
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公开(公告)号： US20050085105A1公开(公告)日： 2005-04-21
- 发明人: Andre Hanke , Stephan Dobritz
- 申请人： Andre Hanke , Stephan Dobritz
- 优先权： DE10343256.6 20030917
- 主分类号： G01R31/26
- IPC分类号： G01R31/26 ; G01R1/04 ; G01R31/28 ; H01R13/22 ; H01R33/76 ; H05K1/11 ; H05K3/28 ; H05K3/32 ; H05K3/40 ; H01R12/00
摘要：
An arrangement for producing an electrical connection between a ball grid array (BGA) package and a signal source is disclosed. A flexible printed circuit board (PCB) has conductor (e.g., copper) tracks arranged between flexible plastic layers. A contact receptacle with guide elements for the BGA package is located over a portion of the flexible PCB. Contact structures are electrically coupled to the conductor tracks of the flexible PCB and accessible via the contact receptacle. The contact structures serve for providing an electrical contact-connection of terminals of a BGA package placed in the receptacle. The contact structures comprise column- or sleeve-shaped contact elements that extend through the flexible PCB and project upwards on one side from one of the flexible plastic layers.
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