公开(公告)号：US07678636B2

公开(公告)日：2010-03-16

申请号：US11520377

申请日：2006-09-13

申请人： Harry Chuang ,  Mong-Song Liang ,  Kong-Beng Thei ,  Jung-Hui Kao ,  Chung Long Cheng ,  Sheng-Chen Chung ,  Wen-Huei Guo

发明人： Harry Chuang ,  Mong-Song Liang ,  Kong-Beng Thei ,  Jung-Hui Kao ,  Chung Long Cheng ,  Sheng-Chen Chung ,  Wen-Huei Guo

IPC分类号： H01L21/8238 ,  H01L21/337

CPC分类号： H01L21/823807 ,  H01L21/823864 ,  H01L21/823878 ,  H01L21/84 ,  H01L27/0629 ,  H01L27/1203 ,  H01L29/7843

摘要： A method of forming a semiconductor structure includes providing a semiconductor substrate comprising a first region and a second region, forming a first PMOS device in the first region wherein a first gate electrode of the first PMOS device has a first p-type impurity concentration, forming a stress memorization layer over the first PMOS device, reducing the stress memorization layer in the first region, performing an annealing after the step of reducing the stress memorization layer in the first region, and removing the stress memorization layer. The same stress memorization layer is not reduced in a region having an NMOS device. The same stress memorization layer may not be reduced in a region including a second PMOS device.

摘要翻译： 一种形成半导体结构的方法包括提供包括第一区域和第二区域的半导体衬底，在第一区域中形成第一PMOS器件，其中第一PMOS器件的第一栅电极具有第一p型杂质浓度，形成 在第一PMOS器件上方的应力记忆层，减小第一区域中的应力存储层，在减少第一区域中的应力存储层的步骤之后进行退火，以及去除应力存储层。 在具有NMOS器件的区域中，相同的应力记忆层没有减小。 在包括第二PMOS器件的区域中，相同的应力记忆层可能不会减小。

公开(公告)号：US09105744B2

公开(公告)日：2015-08-11

申请号：US13410207

申请日：2012-03-01

申请人： Tung Ying Lee ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang

发明人： Tung Ying Lee ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang

IPC分类号： H01L21/8234 ,  H01L29/66 ,  H01L21/84

CPC分类号： H01L27/0886 ,  H01L21/823431 ,  H01L21/845 ,  H01L27/0629 ,  H01L29/0642 ,  H01L29/66636 ,  H01L29/6681

摘要： Semiconductor devices and manufacturing and design methods thereof are disclosed. In one embodiment, a semiconductor device includes an active FinFET disposed over a workpiece comprising a first semiconductive material, the active FinFET comprising a first fin. An electrically inactive FinFET structure is disposed over the workpiece proximate the active FinFET, the electrically inactive FinFET comprising a second fin. A second semiconductive material is disposed between the first fin and the second fin.

摘要翻译： 公开了半导体器件及其制造和设计方法。 在一个实施例中，半导体器件包括设置在包括第一半导体材料的工件上的有源FinFET，所述有源FinFET包括第一鳍片。 非活性FinFET结构设置在靠近有源FinFET的工件上方，该非活性FinFET包括第二鳍片。 第二半导体材料设置在第一鳍片和第二鳍片之间。

公开(公告)号：US09054188B2

公开(公告)日：2015-06-09

申请号：US13404819

申请日：2012-02-24

申请人： I-Ming Chang ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang ,  Clement Hsingjen Wann ,  Tung Ying Lee ,  Cheng-Long Chen ,  Jui-Chien Huang

发明人： I-Ming Chang ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang ,  Clement Hsingjen Wann ,  Tung Ying Lee ,  Cheng-Long Chen ,  Jui-Chien Huang

IPC分类号： H01L21/3205 ,  H01L21/683 ,  H01L21/687 ,  H01L21/31 ,  H01L29/78 ,  H01L29/10 ,  H01L29/66

CPC分类号： H01L21/687 ,  H01L21/6838 ,  H01L29/1054 ,  H01L29/66545 ,  H01L29/7845 ,  H01L29/7847 ,  H01L29/7848 ,  H01L29/785

摘要： An apparatus for and a method of forming a semiconductor structure is provided. The apparatus includes a substrate holder that maintains a substrate such that the processing surface is curved, such as a convex or a concave shape. The substrate is held in place using point contacts, a plurality of continuous contacts extending partially around the substrate, and/or a continuous ring extending completely around the substrate. The processing may include, for example, forming source/drain regions, channel regions, silicides, stress memorization layers, or the like.

摘要翻译： 提供了一种形成半导体结构的装置和方法。 该装置包括：基板保持件，其保持基板，使得处理表面是弯曲的，例如凸形或凹形。 基板使用点接触保持就位，多个连续接触部分围绕基板延伸，和/或完全围绕基板延伸的连续环。 处理可以包括例如形成源极/漏极区域，沟道区域，硅化物，应力存储层等。

公开(公告)号：US08551841B2

公开(公告)日：2013-10-08

申请号：US13345473

申请日：2012-01-06

申请人： Tung Ying Lee ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang

发明人： Tung Ying Lee ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang

IPC分类号： H01L21/336

CPC分类号： H01L27/088 ,  H01L27/0255 ,  H01L29/66795 ,  H01L29/785

摘要： A method includes forming an ESD diode including performing an epitaxy growth to form an epitaxy region comprising silicon and substantially free from germanium. The epitaxy region is doped with a p-type impurity to form a p-type region, wherein the p-type region forms an anode of the ESD diode.

摘要翻译： 一种方法包括形成ESD二极管，包括进行外延生长以形成包含硅且基本上不含锗的外延区。 外延区域掺杂有p型杂质以形成p型区域，其中p型区域形成ESD二极管的阳极。

公开(公告)号：US08558278B2

公开(公告)日：2013-10-15

申请号：US11849798

申请日：2007-09-04

申请人： Harry Chuang ,  Kong-Beng Thei ,  Wen-Huei Guo ,  Mong Song Liang

发明人： Harry Chuang ,  Kong-Beng Thei ,  Wen-Huei Guo ,  Mong Song Liang

IPC分类号： H01L27/092

CPC分类号： H01L21/823807 ,  H01L29/7843

摘要： A strain-induced layer is formed atop a MOS device in order to increase carrier mobility in the channel region. The dimension of the strain-induced layer in preferred embodiments may lead to an optimized drive current increase and improved drive current uniformity in an NMOS and PMOS device. An advantage of the preferred embodiments is that improved device performance is obtained without adding complex processing steps. A further advantage of the preferred embodiments is that the added processing steps can be readily integrated into a known CMOS process flow. Moreover, the creation of the photo masks defining the tensile and compressive strain-induced layers does not require extra design work on an existed design database.

摘要翻译： 应变感应层形成在MOS器件的顶部，以增加沟道区中的载流子迁移率。 在优选实施例中，应变诱导层的尺寸可导致优化的驱动电流增加和改进的NMOS和PMOS器件中的驱动电流均匀性。 优选实施例的优点是在不添加复杂的处理步骤的情况下获得改进的设备性能。 优选实施例的另一个优点是附加的处理步骤可以容易地集成到已知的CMOS工艺流程中。 此外，创建定义拉伸和压缩应变诱导层的光罩不需要对现有设计数据库进行额外的设计工作。

公开(公告)号：US20130224952A1

公开(公告)日：2013-08-29

申请号：US13404819

申请日：2012-02-24

申请人： I-Ming Chang ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang ,  Clement Hsingjen Wann ,  Tung Ying Lee ,  Cheng-Long Chen ,  Jui-Chien Huang

发明人： I-Ming Chang ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang ,  Clement Hsingjen Wann ,  Tung Ying Lee ,  Cheng-Long Chen ,  Jui-Chien Huang

IPC分类号： H01L21/3205 ,  H01L21/683 ,  H01L21/687 ,  H01L21/31

CPC分类号： H01L21/687 ,  H01L21/6838 ,  H01L29/1054 ,  H01L29/66545 ,  H01L29/7845 ,  H01L29/7847 ,  H01L29/7848 ,  H01L29/785

摘要： An apparatus for and a method of forming a semiconductor structure is provided. The apparatus includes a substrate holder that maintains a substrate such that the processing surface is curved, such as a convex or a concave shape. The substrate is held in place using point contacts, a plurality of continuous contacts extending partially around the substrate, and/or a continuous ring extending completely around the substrate. The processing may include, for example, forming source/drain regions, channel regions, silicides, stress memorization layers, or the like.

摘要翻译： 提供了一种形成半导体结构的装置和方法。 该装置包括：基板保持件，其保持基板，使得处理表面是弯曲的，例如凸形或凹形。 基板使用点接触保持就位，多个连续接触部分围绕基板延伸，和/或完全围绕基板延伸的连续环。 处理可以包括例如形成源极/漏极区域，沟道区域，硅化物，应力存储层等。

公开(公告)号：US20080169484A1

公开(公告)日：2008-07-17

申请号：US11849798

申请日：2007-09-04

申请人： Harry Chuang ,  Kong-Beng Thei ,  Wen-Huei Guo ,  Mong Song Liang

发明人： Harry Chuang ,  Kong-Beng Thei ,  Wen-Huei Guo ,  Mong Song Liang

IPC分类号： H01L27/092 ,  H01L29/778

CPC分类号： H01L21/823807 ,  H01L29/7843

摘要： A strain-induced layer is formed atop a MOS device in order to increase carrier mobility in the channel region. The dimension of the strain-induced layer in preferred embodiments may lead to an optimized drive current increase and improved drive current uniformity in an NMOS and PMOS device. An advantage of the preferred embodiments is that improved device performance is obtained without adding complex processing steps. A further advantage of the preferred embodiments is that the added processing steps can be readily integrated into a known CMOS process flow. Moreover, the creation of the photo masks defining the tensile and compressive strain-induced layers does not require extra design work on an existed design database.

摘要翻译： 应变感应层形成在MOS器件的顶部，以增加沟道区中的载流子迁移率。 在优选实施例中，应变诱导层的尺寸可导致优化的驱动电流增加和改进的NMOS和PMOS器件中的驱动电流均匀性。 优选实施例的优点是在不添加复杂的处理步骤的情况下获得改进的设备性能。 优选实施例的另一个优点是附加的处理步骤可以容易地集成到已知的CMOS工艺流程中。 此外，创建定义拉伸和压缩应变诱导层的光罩不需要对现有设计数据库进行额外的设计工作。

公开(公告)号：US20080076215A1

公开(公告)日：2008-03-27

申请号：US11527616

申请日：2006-09-27

申请人： Harry Chuang ,  Kong-Beng Thei ,  Chung-Long Cheng ,  Sheng-Chen Chung ,  Wen-Huei Guo ,  Jung-Hui Kao ,  Ryan Chia-Jen Chen ,  Mong-Song Liang

发明人： Harry Chuang ,  Kong-Beng Thei ,  Chung-Long Cheng ,  Sheng-Chen Chung ,  Wen-Huei Guo ,  Jung-Hui Kao ,  Ryan Chia-Jen Chen ,  Mong-Song Liang

IPC分类号： H01L21/8238

CPC分类号： H01L21/823807 ,  H01L21/823814 ,  H01L21/823842 ,  H01L29/7843

摘要： A method of manufacturing a semiconductor device is disclosed. The method provides a semiconductor substrate with at least a PMOS device and at least an NMOS device thereon. A first insulating layer is formed overlying the NMOS and PMOS devices. A second insulating layer is formed overlying the first insulating layer. The second insulating layer overlying the PMOS device is thinned to leave portion of the second insulating layer. A first thermal treatment is performed on the NMOS and PMOS devices. The second insulating layer overlying the NMOS device and the remaining portion of the second insulating layer overlying the PMOS device are removed and the first insulating layer overlying the NMOS and PMOS devices is thinned to leave a remaining portion thereof.

摘要翻译： 公开了制造半导体器件的方法。 该方法提供具有至少PMOS器件和至少NMOS器件的半导体衬底。 在NMOS和PMOS器件上形成第一绝缘层。 在第一绝缘层上形成第二绝缘层。 覆盖PMOS器件的第二绝缘层变薄以留下第二绝缘层的部分。 在NMOS和PMOS器件上进行第一次热处理。 去除覆盖NMOS器件的第二绝缘层和覆盖PMOS器件的第二绝缘层的剩余部分，并且覆盖NMOS和PMOS器件的第一绝缘层变薄以留下其余部分。

公开(公告)号：US09041158B2

公开(公告)日：2015-05-26

申请号：US13403630

申请日：2012-02-23

申请人： Clement Hsingjen Wann ,  Ling-Yen Yeh ,  Chi-Yuan Shih ,  Yuan-Fu Shao ,  Wen-Huei Guo ,  Tung Ying Lee

发明人： Clement Hsingjen Wann ,  Ling-Yen Yeh ,  Chi-Yuan Shih ,  Yuan-Fu Shao ,  Wen-Huei Guo ,  Tung Ying Lee

IPC分类号： H01L29/06 ,  H01L29/02

CPC分类号： H01L29/42368 ,  H01L21/823431 ,  H01L21/845 ,  H01L29/02 ,  H01L29/06 ,  H01L29/0653 ,  H01L29/7856

摘要： A semiconductor apparatus includes fin field-effect transistor (FinFETs) having controlled fin heights. The apparatus includes a high fin density area and a low fin density area. Each fin density area includes fins and dielectric material between the fins. The dielectric material includes different dopant concentrations for different fin density areas and is the same material as deposited.

摘要翻译： 半导体装置包括具有受控制的翅片高度的鳍状场效应晶体管（FinFET）。 该装置包括高翅片密度区域和低翅片密度区域。 每个翅片密度区域包括翅片和翅片之间的电介质材料。 电介质材料包括用于不同翅片密度区域的不同掺杂剂浓度，并且是与沉积物相同的材料。

公开(公告)号：US20130175578A1

公开(公告)日：2013-07-11

申请号：US13345473

申请日：2012-01-06

申请人： Tung Ying Lee ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang

发明人： Tung Ying Lee ,  Wen-Huei Guo ,  Chih-Hao Chang ,  Shou-Zen Chang

IPC分类号： H01L27/088 ,  H01L21/336 ,  H01L21/20

CPC分类号： H01L27/088 ,  H01L27/0255 ,  H01L29/66795 ,  H01L29/785

摘要： A method includes forming an ESD diode including performing an epitaxy growth to form an epitaxy region comprising silicon and substantially free from germanium. The epitaxy region is doped with a p-type impurity to form a p-type region, wherein the p-type region forms an anode of the ESD diode.