PASTE-LIKE THERMALLY EXPANDABLE FILLER
    1.
    发明申请
    PASTE-LIKE THERMALLY EXPANDABLE FILLER 审中-公开
    PASTE-LIKE热膨胀填料

    公开(公告)号:US20130280451A1

    公开(公告)日:2013-10-24

    申请号:US13976292

    申请日:2011-10-05

    IPC分类号: C08L21/00

    摘要: A paste-like thermally foaming filler contains 2 to 20 parts by weight of an uncrosslinked synthetic rubber. 5 to 30 parts by weight of a partially crosslinked rubber, 0.1 to 5 parts by weight of a quinone-based vulcanizing agent, 0.2 to 1 parts by weight of thermally expandable balloons, 1 to 10 parts by weight of a thermoplastic resin, 20 to 50 parts by weight of a plasticizer, 15 to 50 parts by weight of an inorganic filler, and 2 to 15 parts by weight of a chemical foaming agent. The paste-like thermally foaming filler exhibits high foaming capability even at low temperatures.

    摘要翻译: 糊状热发泡填料含有2〜20重量份的未交联的合成橡胶。 5〜30重量份的部分交联的橡胶,0.1〜5重量份的醌类硫化剂,0.2〜1重量份的热膨胀性气囊,1〜10重量份的热塑性树脂,20〜 50重量份的增塑剂,15〜50重量份的无机填料和2〜15重量份的化学发泡剂。 糊状热发泡填料即使在低温下也具有高发泡能力。

    Semiconductor device with electronic component incorporation substrate
    2.
    发明授权
    Semiconductor device with electronic component incorporation substrate 有权
    具有电子元件结合衬底的半导体器件

    公开(公告)号:US08482117B2

    公开(公告)日:2013-07-09

    申请号:US13181884

    申请日:2011-07-13

    IPC分类号: H01L23/04 H01L23/28

    摘要: An electronic component incorporation substrate and a method for manufacturing the same that provide a high degree of freedom for selecting materials. An electronic component incorporation substrate includes a first structure, which has a substrate and an electronic component. The substrate includes a substrate body having first and second surfaces. A first wiring pattern is formed on the first surface and electrically connected to a second wiring pattern formed on the second surface through a through via. The electronic component is electrically connected to the first wiring pattern. The electronic component incorporation substrate includes a sealing resin, which seals the first structure, and a third wiring pattern, which is connected to the second wiring pattern through a second via.

    摘要翻译: 一种电子元件掺合基板及其制造方法,其提供高选择材料的自由度。 电子元件并入基板包括具有基板和电子部件的第一结构。 衬底包括具有第一和第二表面的衬底本体。 第一布线图案形成在第一表面上,并且通过通孔电连接到形成在第二表面上的第二布线图案。 电子部件电连接到第一布线图案。 所述电子部件结合基板包括密封第一结构的密封树脂和通过第二通孔连接到第二布线图案的第三布线图案。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE 有权
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20120013021A1

    公开(公告)日:2012-01-19

    申请号:US13181884

    申请日:2011-07-13

    摘要: An electronic component incorporation substrate and a method for manufacturing the same that provide a high degree of freedom for selecting materials. An electronic component incorporation substrate includes a first structure, which has a substrate and an electronic component. The substrate includes a substrate body having first and second surfaces. A first wiring pattern is formed on the first surface and electrically connected to a second wiring pattern formed on the second surface through a through via. The electronic component is electrically connected to the first wiring pattern. The electronic component incorporation substrate includes a sealing resin, which seals the first structure, and a third wiring pattern, which is connected to the second wiring pattern through a second via.

    摘要翻译: 一种电子元件掺合基板及其制造方法,其提供高选择材料的自由度。 电子元件并入基板包括具有基板和电子元件的第一结构。 衬底包括具有第一和第二表面的衬底本体。 第一布线图案形成在第一表面上,并且通过通孔电连接到形成在第二表面上的第二布线图案。 电子部件电连接到第一布线图案。 所述电子部件结合基板包括密封所述第一结构的密封树脂和通过第二通孔连接到所述第二布线图案的第三布线图案。

    Method and device for excavating submerged stratum
    7.
    发明申请
    Method and device for excavating submerged stratum 有权
    挖潜水层的方法和装置

    公开(公告)号:US20090126235A1

    公开(公告)日:2009-05-21

    申请号:US11659730

    申请日:2006-03-16

    IPC分类号: E02F1/00

    摘要: An excavation technique for a stratum capable of excavating a submerged stratum such as a layer containing an underground resource by using laser irradiation in liquid is provided. In this technique, a laser beam transmitted through laser transmission means 20 is irradiated in liquid 90 in form of a laser beam having a wavelength with high absorptance of the liquid 90 by laser-induced bubble generation means 35, generating a bubble flow 36, thus excavation of a submerged stratum may be carried out by using a laser-induced destruction effect. Moreover, a laser beam 41 having low absorptance of the liquid 90 is irradiated by laser irradiation means 39 and passed through the bubble flow 36, thereby applying a thermal effect to a stratum to destroy rock and excavate the stratum. The destruction effect and the thermal effect also may be cooperatively worked.

    摘要翻译: 提供了一种能够通过在液体中使用激光照射来挖掘诸如含有地下资源的层的浸没层的地层的挖掘技术。 在这种技术中,通过激光发射装置35透射的激光束被激光诱导气泡生成装置35以具有高的液体吸收率的波长的激光束的形式在液体90中照射,从而产生气泡流36 浸没层的开挖可以通过使用激光诱发的破坏作用进行。 此外,激光照射装置39照射具有低液体吸收率的激光束41,并通过气泡流36,从而对层施加热效应以破坏岩石并挖掘层。 破坏效果和热效应也可以协同工作。

    COMMUNICATION MONITORING SYSTEM, COMMUNICATION MONITORING APPARATUS AND COMMUNICATION CONTROL APPARATUS
    8.
    发明申请
    COMMUNICATION MONITORING SYSTEM, COMMUNICATION MONITORING APPARATUS AND COMMUNICATION CONTROL APPARATUS 审中-公开
    通信监控系统,通信监控装置和通信控制装置

    公开(公告)号:US20080215721A1

    公开(公告)日:2008-09-04

    申请号:US11966032

    申请日:2007-12-28

    IPC分类号: G06F15/173

    摘要: A communication monitoring apparatus for monitoring communication data which are transmitted among a plurality of nodes on a network, includes a detecting section for detecting whether or not a shellcode is included in communication data transmitted and received between at least two nodes within the plurality of nodes and a storing section for storing communication data transmitted from the two nodes as being starting points during a predetermined time, when the detecting section detected the shellcode in communication data.

    摘要翻译: 一种用于监视在网络上的多个节点之间发送的通信数据的通信监视装置,包括检测部分,用于检测在所述多个节点之间的至少两个节点之间发送和接收的通信数据中是否包括壳码; 存储部分,用于当检测部分检测到通信数据中的shellcode时,将从两个节点发送的通信数据存储在预定时间内作为起始点。

    Nonvolatile semiconductor memory device and method of manufacturing the same
    10.
    发明申请
    Nonvolatile semiconductor memory device and method of manufacturing the same 失效
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20070145448A1

    公开(公告)日:2007-06-28

    申请号:US11633292

    申请日:2006-12-04

    IPC分类号: H01L29/94

    摘要: A nonvolatile semiconductor memory device includes: a first semiconductor region having first conductivity; a channel formation region in which a channel inversion layer having second conductivity is formed; a second semiconductor region having the second conductivity; a third semiconductor region having the second conductivity; a laminated insulating film formed on the channel formation region; and a control electrode formed on the laminated insulating film. The laminated insulating film includes a first insulating film, a charge storage film, and a second insulating film in order from the channel formation region side. The control electrode extends to above one of the second semiconductor region and the third semiconductor region. The charge storage film present between an extended portion of the control electrode and the second semiconductor region or the third semiconductor region is removed and a portion where the charge storage film is removed is filled with a third insulating film.

    摘要翻译: 非易失性半导体存储器件包括:具有第一导电性的第一半导体区域; 形成具有第二导电性的沟道反转层的沟道形成区域; 具有第二导电性的第二半导体区域; 具有第二导电性的第三半导体区域; 形成在沟道形成区上的叠层绝缘膜; 以及形成在层叠绝缘膜上的控制电极。 叠层绝缘膜从沟道形成区域侧开始依次包括第一绝缘膜,电荷存储膜和第二绝缘膜。 控制电极延伸到第二半导体区域和第三半导体区域中的一个之上。 除去存在于控制电极的延伸部分与第二半导体区域或第三半导体区域之间的电荷存储膜,并且用第三绝缘膜填充电荷存储膜被除去的部分。