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    Process of producing plastic pin grid array
    3.
    发明授权
    Process of producing plastic pin grid array 失效
    生产塑料针格栅阵列的工艺

    公开(公告)号：US06438830B1

    公开(公告)日：2002-08-27

    申请号：US09292163

    申请日：1999-04-15

    申请人： Eric P. Dibble ,  Eric H. Laine ,  Stephen W. MacQuarrie

    发明人： Eric P. Dibble ,  Eric H. Laine ,  Stephen W. MacQuarrie

    IPC分类号： H01R4320

    CPC分类号： H05K3/308 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15312 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49165 ,  Y10T29/49181 ,  Y10T29/49208 ,  H01L2924/00

    摘要： A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping old or gold-plated pin located in the through-holes to form a pin head on the top and a pin bulge on the bottom of the laminate carrier to produce a plastic pin grid array. A variety of mechanical forming processes may be employed to form the pin heads and pin bulges and cause the pin to at least partially, and preferably substantially, fill and contact the gold-plated through-hole including swage pinning, impact pinning, and double-die pinning operations. By combining the steps of gold-plating through-holes of a laminate carrier and using a mechanical pinning process to crimp a gold or gold-plated pin in the through-holes, a reliable mechanical and electrical connection may be established between the pin and the metal lines both inside and on the surface of the laminate carrier without the need for lead-containing solders and pastes.

    摘要翻译： 一种钉扎工艺，包括在叠层载体中镀金通孔的步骤，并且压接位于通孔中的旧镀金或镀金销，以在顶部形成销头，并在层压载体的底部上形成销凸起 生产塑料针格栅阵列。 可以采用各种机械成形工艺来形成销头和销凸起，并且使销至少部分地，优选地基本上填充和接触镀金通孔，包括模具钉扎，冲击钉扎和双重连接， 死亡钉扎操作。 通过结合层叠载体的镀金通孔的步骤，并使用机械钉扎工艺将金或镀金销压接在通孔中，可以在销和第二端之间建立可靠的机械和电连接 金属线在层压载体的内部和表面上，而不需要含铅焊料和糊料。

    Pin attach structure for an electronic package
    7.
    发明授权
    Pin attach structure for an electronic package 失效
    电子封装的引脚连接结构

    公开(公告)号：US5952716A

    公开(公告)日：1999-09-14

    申请号：US842859

    申请日：1997-04-16

    申请人： Eric P. Dibble ,  Eric H. Laine ,  Stephen W. MacQuarrie

    发明人： Eric P. Dibble ,  Eric H. Laine ,  Stephen W. MacQuarrie

    IPC分类号： H01L23/498 ,  H05K3/30 ,  H01L23/532

    CPC分类号： H05K3/308 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15312 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49165 ,  Y10T29/49181 ,  Y10T29/49208

    摘要： A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping a gold or gold-plated pin located in the through-holes to form a pin head on the top and a pin bulge on the bottom of the laminate carrier to produce a plastic pin grid array. A variety of mechanical forming processes may be employed to form the pin heads and pin bulges and cause the pin to at least partially, and preferably substantially, fill and contact the gold-plated through-hole including swage pinning, impact pinning, and double-die pinning operations. By combining the steps of gold-plating through-holes of a laminate carrier and using a mechanical pinning process to crimp a gold or gold-plated pin in the through-holes, a reliable mechanical and electrical connection may be established between the pin and the metal lines both inside and on the surface of the laminate carrier without the need for lead-containing solders and pastes.

    摘要翻译： 一种钉扎工艺，包括在层叠载体中镀金通孔的步骤，并且压接位于通孔中的金或镀金销，以在顶部形成销头，并在层压体的底部上形成销凸起 载体产生塑料针格栅阵列。 可以采用各种机械成形工艺来形成销头和销凸起，并且使销至少部分地，优选地基本上填充和接触镀金通孔，包括模具钉扎，冲击钉扎和双重连接， 死亡钉扎操作。 通过结合层叠载体的镀金通孔的步骤，并使用机械钉扎工艺将金或镀金销压接在通孔中，可以在销和第二端之间建立可靠的机械和电连接 金属管线在层压载体的内部和表面上，而不需要含铅的焊料和糊料。