知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

9 records (took 0.014 seconds)

    Enhanced heat-dissipating printed circuit board package
    1.
    发明授权
    Enhanced heat-dissipating printed circuit board package 失效
    增强散热印刷电路板封装

    公开(公告)号：US06212076B1

    公开(公告)日：2001-04-03

    申请号：US09259809

    申请日：1999-02-26

    Applicant: Stephen W. MacQuarrie ,  Randall J. Stutzman ,  Jerzy M. Zalesinski

    Inventor： Stephen W. MacQuarrie ,  Randall J. Stutzman ,  Jerzy M. Zalesinski

    IPC: H05K720

    CPC classification number: H05K1/0209 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/189 ,  H05K3/429 ,  H05K3/4691 ,  H05K2201/066 ,  H05K2201/09354 ,  H05K2201/09781 ,  H05K2201/10159 ,  H05K2201/10689

    Abstract: A printed circuit board is provided comprising a substrate, a conductor on the surface of the substrate, and an electronic component mounted on the conductor. The printed circuit board includes a first thermally conductive layer within the substrate and a second thermally conductive layer on a portion of the surface of the substrate and spaced from the electronic component. The electronic component is thermally coupled to the second thermally conductive layer by a thermally conductive aperture positioned within the substrate and connected to the conductor and the first thermally conductive layer. The first thermally conductive layer is connected to the second thermally conductive layer by a plurality of apertures also positioned in the substrate. Another printed circuit board is also provided comprising a first plurality of laminate dielectric layers, a conductor on a surface of the first plurality of laminated dielectric layers, and an electronic component mounted on the conductor. The printed circuit board includes a second plurality of laminated dielectric layers connected to the first plurality of laminated dielectric layers by a flexible web. The flexible web includes a first thermally conductive layer positioned within the first plurality of dielectric layers. A thermally conductive aperture thermally connects the electronic component to the first thermally conductive layer. A plurality of thermally conductive apertures is positioned within the second plurality of dielectric layers and thermally couples the first thermally conductive layer to a second thermally conductive layer which is included on a portion of a surface of the second plurality of dielectric layers and spaced from the electronic component. The flexible web portion thus allows positioning of the second thermally conductive layer in a plane remote from the electronic component when it is positioned in a confined space.

    Abstract translation: 提供一种印刷电路板，包括基板，基板表面上的导体和安装在导体上的电子部件。 印刷电路板包括衬底内的第一导热层和在衬底的表面的一部分上并与电子部件隔开的第二导热层。 电子部件通过定位在衬底内并连接到导体和第一导热层的导热孔热耦合到第二导热层。 第一导热层通过也位于基板中的多个孔连接到第二导热层。 还提供了另一印刷电路板，其包括第一多个叠层电介质层，在第一多个叠层电介质层的表面上的导体和安装在导体上的电子部件。 印刷电路板包括通过柔性网连接到第一多个叠层电介质层的第二多个叠层电介质层。 柔性幅材包括位于第一多个电介质层内的第一导热层。 导热孔将电子部件热连接到第一导热层。 多个导热孔定位在第二多个介电层内并且将第一导热层热耦合到第二导热层，第二导热层包括在第二多个电介质层的表面的一部分上并与电子 零件。 柔性腹板部分因此允许第二导热层在位于密闭空间中时远离电子部件的平面定位。

    Fabrication of a metalized blind via
    2.
    发明授权
    Fabrication of a metalized blind via 失效
    金属化盲孔的制造

    公开(公告)号：US06576549B2

    公开(公告)日：2003-06-10

    申请号：US10282275

    申请日：2002-10-28

    Applicant: Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    Inventor： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    IPC: H01L2131

    CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/424 ,  H05K2201/0323 ,  H05K2203/1136

    Abstract: A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer includes a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, a rectangular channel, or a combination thereof.

    Abstract translation: 用于形成金属化盲孔的方法和结构。 在金属层上形成电介质层，随后在电介质层中激光钻出凹陷，使得在凹陷的侧壁上形成包含碳的碳膜。 如果激光钻孔不暴露金属层，则可以使用诸如反应离子蚀刻（RIE）的各向异性等离子体蚀刻来清洁和暴露金属层的表面。 电介质层包括具有碳基聚合物材料的电介质材料，例如永久性光致抗蚀剂，聚酰亚胺和高级阻焊剂（ASM）。 金属层包括金属材料，例如铜，铝和金。 碳膜与金属层导电接触，并且碳膜具有足够的导电性，以允许直接在碳膜上电镀连续的金属层（例如铜），而不需要在电镀层下面的无电镀层。 激光钻孔使用波长在约180纳米和约600纳米之间的激光辐射完成。 凹陷可以具有任何横截面形状和深度的任何空间分布。 作为示例，凹陷可以包括盲孔，矩形通道或其组合。

    Fabrication of a metalized blind via
    3.
    发明授权
    Fabrication of a metalized blind via 有权
    金属化盲孔的制造

    公开(公告)号：US06522014B1

    公开(公告)日：2003-02-18

    申请号：US09670968

    申请日：2000-09-27

    Applicant: Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    Inventor： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  David E. Houser ,  Mark L. Janecek ,  Thomas E. Kindl ,  Jeffrey A. Knight ,  Stephen W. MacQuarrie ,  Voya R. Markovich ,  Luis J. Matienzo ,  Amarjit S. Rai ,  David J. Russell ,  William T. Wike

    IPC: H01L2348

    CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/424 ,  H05K2201/0323 ,  H05K2203/1136

    Abstract: A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer comprises a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, then the blind via may have any cross-sectional shape, such as circular or non-circular, a rectangular channel, or a combination thereof.

    Abstract translation: 用于形成金属化盲孔的方法和结构。 在金属层上形成电介质层，随后在电介质层中激光钻出凹陷，使得在凹陷的侧壁上形成包含碳的碳膜。 如果激光钻孔不暴露金属层，则可以使用诸如反应离子蚀刻（RIE）的各向异性等离子体蚀刻来清洁和暴露金属层的表面。 电介质层包括具有碳基聚合物材料的介电材料，例如永久性光致抗蚀剂，聚酰亚胺和先进的焊接掩模（ASM）。 金属层包括金属材料，例如铜，铝和金。 碳膜与金属层导电接触，并且碳膜具有足够的导电性，以允许直接在碳膜上电镀连续的金属层（例如铜），而不需要在电镀层下面的无电镀层。 激光钻孔使用波长在约180纳米和约600纳米之间的激光辐射完成。 凹陷可以具有任何横截面形状和深度的任何空间分布。 作为示例，凹陷可以包括盲孔，则盲孔可以具有任何横截面形状，例如圆形或非圆形，矩形通道或其组合。

    Process of producing plastic pin grid array
    4.
    发明授权
    Process of producing plastic pin grid array 失效
    生产塑料针格栅阵列的工艺

    公开(公告)号：US06438830B1

    公开(公告)日：2002-08-27

    申请号：US09292163

    申请日：1999-04-15

    Applicant: Eric P. Dibble ,  Eric H. Laine ,  Stephen W. MacQuarrie

    Inventor： Eric P. Dibble ,  Eric H. Laine ,  Stephen W. MacQuarrie

    IPC: H01R4320

    CPC classification number: H05K3/308 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15312 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49165 ,  Y10T29/49181 ,  Y10T29/49208 ,  H01L2924/00

    Abstract: A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping old or gold-plated pin located in the through-holes to form a pin head on the top and a pin bulge on the bottom of the laminate carrier to produce a plastic pin grid array. A variety of mechanical forming processes may be employed to form the pin heads and pin bulges and cause the pin to at least partially, and preferably substantially, fill and contact the gold-plated through-hole including swage pinning, impact pinning, and double-die pinning operations. By combining the steps of gold-plating through-holes of a laminate carrier and using a mechanical pinning process to crimp a gold or gold-plated pin in the through-holes, a reliable mechanical and electrical connection may be established between the pin and the metal lines both inside and on the surface of the laminate carrier without the need for lead-containing solders and pastes.

    Abstract translation: 一种钉扎工艺，包括在叠层载体中镀金通孔的步骤，并且压接位于通孔中的旧镀金或镀金销，以在顶部形成销头，并在层压载体的底部上形成销凸起 生产塑料针格栅阵列。 可以采用各种机械成形工艺来形成销头和销凸起，并且使销至少部分地，优选地基本上填充和接触镀金通孔，包括模具钉扎，冲击钉扎和双重连接， 死亡钉扎操作。 通过结合层叠载体的镀金通孔的步骤，并使用机械钉扎工艺将金或镀金销压接在通孔中，可以在销和第二端之间建立可靠的机械和电连接 金属线在层压载体的内部和表面上，而不需要含铅焊料和糊料。

    Pin attach structure for an electronic package
    9.
    发明授权
    Pin attach structure for an electronic package 失效
    电子封装的引脚连接结构

    公开(公告)号：US5952716A

    公开(公告)日：1999-09-14

    申请号：US842859

    申请日：1997-04-16

    Applicant: Eric P. Dibble ,  Eric H. Laine ,  Stephen W. MacQuarrie

    Inventor： Eric P. Dibble ,  Eric H. Laine ,  Stephen W. MacQuarrie

    IPC: H01L23/498 ,  H05K3/30 ,  H01L23/532

    CPC classification number: H05K3/308 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15312 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49165 ,  Y10T29/49181 ,  Y10T29/49208

    Abstract: A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping a gold or gold-plated pin located in the through-holes to form a pin head on the top and a pin bulge on the bottom of the laminate carrier to produce a plastic pin grid array. A variety of mechanical forming processes may be employed to form the pin heads and pin bulges and cause the pin to at least partially, and preferably substantially, fill and contact the gold-plated through-hole including swage pinning, impact pinning, and double-die pinning operations. By combining the steps of gold-plating through-holes of a laminate carrier and using a mechanical pinning process to crimp a gold or gold-plated pin in the through-holes, a reliable mechanical and electrical connection may be established between the pin and the metal lines both inside and on the surface of the laminate carrier without the need for lead-containing solders and pastes.

    Abstract translation: 一种钉扎工艺，包括在层叠载体中镀金通孔的步骤，并且压接位于通孔中的金或镀金销，以在顶部形成销头，并在层压体的底部上形成销凸起 载体产生塑料针格栅阵列。 可以采用各种机械成形工艺来形成销头和销凸起，并且使销至少部分地，优选地基本上填充和接触镀金通孔，包括模具钉扎，冲击钉扎和双重连接， 死亡钉扎操作。 通过结合层叠载体的镀金通孔的步骤，并使用机械钉扎工艺将金或镀金销压接在通孔中，可以在销和第二端之间建立可靠的机械和电连接 金属管线在层压载体的内部和表面上，而不需要含铅的焊料和糊料。

Patent Agency Ranking