公开(公告)号：USRE38677E1

公开(公告)日：2004-12-28

申请号：US10142836

申请日：2002-05-09

申请人： Michael L. Blomquist

发明人： Michael L. Blomquist

IPC分类号： H05K720

CPC分类号： H01L23/4093 ,  H01L23/3677 ,  H01L2924/0002 ,  Y10T24/308 ,  Y10T24/44026 ,  H01L2924/00

摘要： A heat sink assembly comprises a heat sink and a retainer clip for attachment to an electronic package or semiconductor device so as to dissipate heat from such device. The heat sink may comprise a flat base with a plurality of upwardly extending fins. The fins will define at least one channel. The retainer clip includes two parts. One part is an elongated, resilient, metal strap that has holding means at each end for engaging a semiconductor socket, or a semiconductor module, so as to secure the retainer clip and heat sink to the device or module. The retainer clip also includes a cam-type latch which is pivotally positioned in the middle of the elongated strap and includes an arm and a cam. The cam has a bearing surface which is spaced from the axis of the elongated member a distance greater than the distance between the elongated member and the upper surface of the heat sink base when in the initially assembled position. When the arm is rotated, the bearing surface of the cam is forced against the upper surface of the heat sink which causes the strap to be displaced upwardly placing pressure on the strap and thereby forcing the heat sink into heat conducting engagement with the electronic device or module.

公开(公告)号：US06834711B2

公开(公告)日：2004-12-28

申请号：US10425954

申请日：2003-04-30

申请人： Ming-Hwa Liu ,  Brian D. F. Chen ,  Cheng Paug Chang

发明人： Ming-Hwa Liu ,  Brian D. F. Chen ,  Cheng Paug Chang

IPC分类号： H05K720

CPC分类号： H01L23/367 ,  F28F3/02 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat-radiating structure with low height, including a first heat-radiating plate and a second heat-radiating plate spaced above the first heat-radiating plate. The first heat-radiating plate is formed with multiple first perforations arranged at intervals and multiple first dents arranged at intervals and extending downward. The second heat-radiating plate is formed with multiple second perforations arranged at intervals and multiple second dents extending downward and fitted with the first perforations. A heat-generating body such as a CPU is adjacent to outer sides of the bottoms of the first and second dents. The heat-radiating structure has a height much smaller than that of a conventional vertical heat-radiating plate and a heat conducting area much larger than that of the vertical heat-radiating plate. Accordingly, the heat-radiating structure can achieve better heat-radiating effect and is applicable to those products having small internal space and necessitating heat-radiation, such as a portable computer.

摘要翻译： 一种具有低高度的散热结构，包括在第一散热板上方间隔开的第一散热板和第二散热板。 第一散热板形成有间隔布置的多个第一穿孔和间隔布置并向下延伸的多个第一凹痕。 第二散热板形成有多个第二穿孔，间隔布置，多个第二凹口向下延伸并装配有第一穿孔。 诸如CPU的发热体邻近第一和第二凹陷的底部的外侧。 散热结构的高度比传统的垂直散热板的高度远远大于垂直散热板的导热面积。 因此，散热结构可以获得更好的散热效果，并且适用于具有小的内部空间并且需要热辐射的产品，例如便携式计算机。

公开(公告)号：US06833992B2

公开(公告)日：2004-12-21

申请号：US10665563

申请日：2003-09-22

申请人： Hiroyuki Kusaka ,  Kentaro Tomioka ,  Mitsuyoshi Tanimoto

发明人： Hiroyuki Kusaka ,  Kentaro Tomioka ,  Mitsuyoshi Tanimoto

IPC分类号： H05K720

CPC分类号： G06F1/203 ,  G06F2200/201 ,  G06F2200/203

摘要： An electronic apparatus comprises a heat-generating component, a main unit having a heat-receiving portion thermally connected to the heat-generating component, and a display unit supported by the main unit. The display unit incorporates a heat-radiating portion which radiates the heat of the heat-generating component. A circulating path connects the heat-receiving portion and the heat-radiating portion and circulates liquid coolant. The heat-radiating portion includes a first radiator and a second radiator. The radiators are connected in series in a direction in which the liquid coolant flows. The second radiator is located at the downstream of the liquid coolant, and is exposed outside the display unit.

摘要翻译： 电子设备包括发热部件，具有与发热部件热连接的热接收部分的主单元和由主单元支撑的显示单元。 显示单元包括辐射发热部件的热量的散热部分。 循环路径连接受热部和散热部，并使液体冷却剂循环。 散热部包括第一散热器和第二散热器。 散热器在液体冷却剂流动的方向上串联连接。 第二散热器位于液体冷却剂的下游，并且暴露在显示单元外部。

公开(公告)号：US06833991B2

公开(公告)日：2004-12-21

申请号：US10293218

申请日：2002-11-12

申请人： Adrianus Van Gaal

发明人： Adrianus Van Gaal

IPC分类号： H05K720

CPC分类号： H05K7/206

摘要： A cooling apparatus attaches to a cabinet housing electronics for protecting the electronics from external elements. The cooling apparatus includes an exterior surface for exposure to the external elements and a coupling that attaches the exterior surface to the cabinet. When the cooling apparatus is attached to a surface of the cabinet, the exterior surface is maintained in a spaced-apart relationship from the cabinet, forming an enclosed channel having a pair of openings, one of the openings being located above the other. In such a manner, the cooling apparatus can be added to cool an existing, installed, in-place cabinet without requiring extensive modification to the existing cabinet.

摘要翻译： 冷却装置连接到机柜壳体电子器件，用于保护电子元件免受外部元件的影响。 冷却装置包括用于暴露于外部元件的外表面和将外表面附接到机柜的联接器。 当冷却装置附接到机柜的表面时，外表面与机柜保持间隔开的关系，形成具有一对开口的封闭通道，其中一个开口位于另一个开口之上。 以这种方式，可以添加冷却装置以冷却现有的，安装的就地机柜，而不需要对现有的机柜进行大量的修改。

公开(公告)号：US06832646B1

公开(公告)日：2004-12-21

申请号：US09889577

申请日：2001-11-08

申请人： Yasuharu Uomori ,  Masanori Takahashi ,  Satoshi Ito

发明人： Yasuharu Uomori ,  Masanori Takahashi ,  Satoshi Ito

IPC分类号： H05K720

CPC分类号： H01L23/473 ,  G06F1/203 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： This is a cooler for dissipating heat away from an electronic device (A). The cooler includes a liquid cooling mechanism (B), a forcible air cooling mechanism (C) and a substrate (D). The liquid cooling mechanism includes a set of metal pipes (20-21) connected to a pump (3) with an impeller (16) to transfer cooling liquid to a liquid channel (4). The forcible air cooling mechanism (C) includes a fan (25) discharging air onto a radiating fin (37) located on the set of metal pipes (20-21). The substrates (D) is in fluid communication with the forcible air cooling mechanism (C) and the liquid cooling mechanism (B) and in direct contact with the electronic device (A) so as to remove heat away from the electronic device (A).

摘要翻译： 这是一种用于从电子设备（A）散热的冷却器。 冷却器包括液体冷却机构（B），强制空气冷却机构（C）和基板（D）。 液体冷却机构包括一组连接到具有叶轮（16）的泵（3）的金属管（20-21），以将冷却液转移到液体通道（4）。 强制空气冷却机构（C）包括将空气排放到位于所述一组金属管（20-21）上的散热片（37）上的风扇（25）。 基板（D）与强制空气冷却机构（C）和液体冷却机构（B）流体连通，并与电子设备（A）直接接触，从而从电子设备（A）移除热量， 。

公开(公告)号：US06831833B2

公开(公告)日：2004-12-14

申请号：US10621381

申请日：2003-07-18

申请人： Tae Hyoung Kim ,  Kyung Hawn Park ,  Un Gyu Park ,  Tae Sung Kim

发明人： Tae Hyoung Kim ,  Kyung Hawn Park ,  Un Gyu Park ,  Tae Sung Kim

IPC分类号： H05K720

CPC分类号： G11B5/486

摘要： Disclosed is a heat dissipator for an optical writing and/or reproducing apparatus. The heat dissipator comprises a main base having mounted thereto a plurality of parts including at least one motor for optical writing and/or reproduction; a circuit board positioned below the main base and having installed thereon elements for controlling the parts; a heat generating element formed with a plurality of leads which are connected to a circuit pattern of the circuit board; a heat conduction member brought into contact with at least the leads, for receiving heat generated in the heat generating element; and a cabinet brought into contact with the heat conduction member and formed with an element accommodating section and/or a pair of protrusions which are shaped to be functionally associated with an outer surface of the heat generating element to ensure that the heat dissipating member is brought into close contact with the leads of the heat generating element.

摘要翻译： 公开了一种用于光学写入和/或再现装置的散热器。 散热器包括：主基座，其安装有多个部件，所述多个部件包括用于光学写入和/或再现的至少一个电机; 位于主基座下方并且已经安装有用于控制部件的元件的电路板; 形成有多个引线的发热元件，其连接到所述电路板的电路图案; 导热部件至少与引线接触，用于接收在发热元件中产生的热量; 以及与导热构件接触并形成有元件容纳部和/或一对突起的机壳，其被成形为在功能上与发热元件的外表面相关联，以确保散热构件被带入 与发热元件的引线紧密接触。

公开(公告)号：US06829144B1

公开(公告)日：2004-12-07

申请号：US10634554

申请日：2003-08-05

申请人： Randall J. Stutzman ,  Jamil A. Wakil

发明人： Randall J. Stutzman ,  Jamil A. Wakil

IPC分类号： H05K720

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  H01L2924/00

摘要： A chip package is provided with multiple ways of attaching a heat sink directly to the chip carrier. Corner post are mounted to the surface of the chip carrier. A heat spreading plate, with a surface area substantially the same size as the surface area of the chip carrier, is positioned in thermal contact with the surface of a flip chip, for example. The heat spreading plate has corner cuts to accommodate the corner posts of the chip carrier and notches cut into at least two opposing sides. A heat sink plate with holes extending therethrough at each of its four corners is positioned to allow the corner posts of said chip carrier to extend therethrough. Notches cut in two opposing sides of said heat sink plate are aligned with the notches in said heat spreading plate to create slots for a flexible clip to clamp the assembly together. Alternatively, nuts may also be threaded onto the posts to clamp the assembly together.

摘要翻译： 芯片封装具有将散热器直接附接到芯片载体的多种方式。 角柱安装到芯片载体的表面。 具有与芯片载体的表面积基本相同的表面积的散热板例如被定位成与倒装芯片的表面热接触。 散热板具有角切口以适应芯片载体的角柱和切割成至少两个相对侧的切口。 在其四个角中的每一个处具有穿过其延伸的孔的散热板被定位成允许所述芯片载体的角柱延伸穿过其中。 在所述散热板的两个相对侧切割的凹口与所述散热板中的切口对准，以产生用于将组件夹紧在一起的柔性夹具的狭槽。 或者，也可以将螺母拧到柱上以将组件夹紧在一起。

公开(公告)号：US06826048B1

公开(公告)日：2004-11-30

申请号：US10666360

申请日：2003-09-18

申请人： Ronald P. Dean ,  Owen T. Richard ,  William J. Armiger ,  James R. Bullington

发明人： Ronald P. Dean ,  Owen T. Richard ,  William J. Armiger ,  James R. Bullington

IPC分类号： H05K720

CPC分类号： H05K7/20172 ,  F04D29/601 ,  G06F1/20

摘要： A system and method for securing a fan within an electrical device. The system comprising a housing adapted to capture the fan therein. The housing may comprise a first catch adapted to capture a fan having an having a first thickness within the housing. The system may comprise a second catch adapted to capture a fan having a second thickness within the housing. The method comprises disposing a fan within a fan housing operable to capture fans of different thickness therein.

摘要翻译： 一种用于将风扇固定在电气设备内的系统和方法。 该系统包括适于在其中捕获风扇的壳体。 壳体可以包括适于捕获在壳体内具有第一厚度的风扇的第一卡扣。 系统可以包括适于捕获在壳体内具有第二厚度的风扇的第二挡块。 该方法包括将风扇设置在风扇壳体内，以可捕获其中不同厚度的风扇。

公开(公告)号：US06819565B2

公开(公告)日：2004-11-16

申请号：US10341711

申请日：2003-01-14

申请人： Nai-Hao Kao ,  Yu-Po Wang ,  Wen-Jung Chiang

发明人： Nai-Hao Kao ,  Yu-Po Wang ,  Wen-Jung Chiang

IPC分类号： H05K720

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85413 ,  H01L2224/85444 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A cavity-down ball grid array (CDBGA) semiconductor package with a heat spreader is provided, in which a substrate is formed with at least a ground ring, a plurality of ground vias, a ground layer, and at least an opening for receiving at least a chip. The substrate is mounted in a cavity of the heat spreader, and an electrically conductive adhesive is disposed between an inner wall of the cavity and edges of the substrate, so as to allow the ground layer and the ground ring exposed to the edges of the substrate to be electrically connected to the heat spreader by means of the electrically conductive adhesive. By the above arrangement with the heat spreader being included in a grounding circuit path of the chip, ground floatation and excess ground inductance and resistance can be prevented for the semiconductor package, thereby solving heat-dissipation, electromagnetic interference and crosstalk problems.

摘要翻译： 提供了具有散热器的空腔向下球栅阵列（CDBGA）半导体封装，其中衬底形成有至少接地环，多个接地通孔，接地层和至少一个开口，用于在 最小的芯片 基板安装在散热器的空腔中，并且导电粘合剂设置在空腔的内壁和基板的边缘之间，以便使接地层和接地环暴露于基板的边缘 通过导电粘合剂与散热器电连接。 通过上述布置，散热器被包括在芯片的接地电路中，可以防止半导体封装的地面漂浮和多余的接地电感和电阻，从而解决散热，电磁干扰和串扰问题。

公开(公告)号：US06816372B2

公开(公告)日：2004-11-09

申请号：US10338290

申请日：2003-01-08

申请人： Cary Michael Huettner ,  Jeffrey L. Justin ,  Michael Desmond O'Connell ,  Kenneth Robert Peters ,  Gregory Scott Vande Corput

发明人： Cary Michael Huettner ,  Jeffrey L. Justin ,  Michael Desmond O'Connell ,  Kenneth Robert Peters ,  Gregory Scott Vande Corput

IPC分类号： H05K720

CPC分类号： G06F1/181

摘要： A method, system, and apparatus are disclosed for handling fluid flow in a computer system for suppressing noise and heat, and, in addition, for enhancing external cable management for use with the computer system.

摘要翻译： 公开了一种用于处理用于抑制噪声和热量的计算机系统中的流体流动的方法，系统和装置，此外，还用于增强与计算机系统一起使用的外部电缆管理。