摘要:
According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.
摘要:
According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.
摘要:
According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.
摘要:
An electronic device includes: a circuit board that has a wireless communication module that is mounted thereon and a feed line that is formed on the circuit board and electrically connected to the wireless communication module; a planar member that is formed with an opening and has a flexible planar piece that is formed to protrude toward the circuit board from an edge of the opening; and an antenna pattern that includes an antenna part that is formed on the planar member and a feeder part that is formed on the flexible planar piece, wherein circuit board and the planar member are arranged to be in positions to flexibly bend the flexible planar piece by the circuit board to electrically connect the feeder part of the antenna pattern and the feed line formed on the circuit board.
摘要:
According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.
摘要:
According to one embodiment, an electronic apparatus includes a conductive layer provided on an outer surface of a housing, a conductive member provided inside the housing, and a connecting component attached to the housing. The housing is provided with a through hole which causes the inside of the housing to communicate with the outside. The connecting component has conductivity, and is provided with a major diameter section and a minor diameter section. The major diameter section is formed larger than the through hole, is opposed to the conductive layer from outside the housing, and is electrically connected to the conductive layer. The minor diameter section is formed smaller than the through hole, is inserted in the through hole to reach the inside of the housing, and is electrically connected to the conductive member.
摘要:
According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.
摘要:
The cooling unit includes a heat receiving portion, a heat radiating portion and a circulation path. The heat radiating portion has an impeller, a heat-radiating member and a case. The heat-radiating member surround the impeller that applies cooling air. The heat-radiating member has a coolant passage in which liquid coolant flows, and a plurality of heat-radiating fins which are thermally connected to the coolant passage. The case contains the impeller and the heat-radiating member and has at least one outlet port through which the cooling air is expelled.
摘要:
According to one embodiment, an electronic device includes a case, a heat generation body mounted in the case, a cooling member mounted in the case, and a heat conduction member. The heat conduction member includes a heat receiving section opposed to the heat generation body and thermally connected to the heat generation body, a heat radiation section opposed to the cooling member, and a section provided between the heat receiving section and the heat radiation section. The heat conduction member is formed by laminating a plurality of sheet members each having thermal conductivity. The plurality of sheet members are joined together in a portion of the heat conduction member.
摘要:
A fluid pump includes a case including a pump chamber, a reserve tank for storing spare liquid and located in the case but outside the pump chamber and formed so that a space independent of the pump chamber is defined by the reserve tank, a fluid path forming member arranged inside the reserve tank and including a discharge path communicating between a discharge port and the pump chamber, and a communication hole which is formed in a side of the fluid path forming member so as to assume such a position that the communication hole faces an inside of the reserve tank so that the hole communicates between the discharge path and the inside of the reserve tank, the communication hole being sized so that air in the pump chamber is allowed to flow through the hole into the reserve tank.