Invention Grant
- Patent Title: Electronic apparatus in which an conductive layer on an outer surface of a housing is electrically connected to a conductive member in the housing
- Patent Title (中): 电子设备,其中壳体的外表面上的导电层电连接到壳体中的导电构件
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Application No.: US12140884Application Date: 2008-06-17
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Publication No.: US07651345B2Publication Date: 2010-01-26
- Inventor: Kentaro Tomioka , Tomomi Murayama , Noriyasu Kawamura , Toshiyuki Hirota , Hironori Motoe
- Applicant: Kentaro Tomioka , Tomomi Murayama , Noriyasu Kawamura , Toshiyuki Hirota , Hironori Motoe
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2007-161469 20070619
- Main IPC: H01R4/66
- IPC: H01R4/66

Abstract:
According to one embodiment, an electronic apparatus includes a conductive layer provided on an outer surface of a housing, a conductive member provided inside the housing, and a connecting component attached to the housing. The housing is provided with a through hole which causes the inside of the housing to communicate with the outside. The connecting component has conductivity, and is provided with a major diameter section and a minor diameter section. The major diameter section is formed larger than the through hole, is opposed to the conductive layer from outside the housing, and is electrically connected to the conductive layer. The minor diameter section is formed smaller than the through hole, is inserted in the through hole to reach the inside of the housing, and is electrically connected to the conductive member.
Public/Granted literature
- US20080318447A1 Electronic Apparatus Public/Granted day:2008-12-25
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