公开(公告)号：US06819565B2

公开(公告)日：2004-11-16

申请号：US10341711

申请日：2003-01-14

申请人： Nai-Hao Kao ,  Yu-Po Wang ,  Wen-Jung Chiang

发明人： Nai-Hao Kao ,  Yu-Po Wang ,  Wen-Jung Chiang

IPC分类号： H05K720

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85413 ,  H01L2224/85444 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A cavity-down ball grid array (CDBGA) semiconductor package with a heat spreader is provided, in which a substrate is formed with at least a ground ring, a plurality of ground vias, a ground layer, and at least an opening for receiving at least a chip. The substrate is mounted in a cavity of the heat spreader, and an electrically conductive adhesive is disposed between an inner wall of the cavity and edges of the substrate, so as to allow the ground layer and the ground ring exposed to the edges of the substrate to be electrically connected to the heat spreader by means of the electrically conductive adhesive. By the above arrangement with the heat spreader being included in a grounding circuit path of the chip, ground floatation and excess ground inductance and resistance can be prevented for the semiconductor package, thereby solving heat-dissipation, electromagnetic interference and crosstalk problems.

摘要翻译： 提供了具有散热器的空腔向下球栅阵列（CDBGA）半导体封装，其中衬底形成有至少接地环，多个接地通孔，接地层和至少一个开口，用于在 最小的芯片 基板安装在散热器的空腔中，并且导电粘合剂设置在空腔的内壁和基板的边缘之间，以便使接地层和接地环暴露于基板的边缘 通过导电粘合剂与散热器电连接。 通过上述布置，散热器被包括在芯片的接地电路中，可以防止半导体封装的地面漂浮和多余的接地电感和电阻，从而解决散热，电磁干扰和串扰问题。

公开(公告)号：US20070273026A1

公开(公告)日：2007-11-29

申请号：US11701767

申请日：2007-02-02

申请人： Hsieh-Tsung Tien ,  Wen-Jung Chiang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao ,  Sen-Yen Yang

发明人： Hsieh-Tsung Tien ,  Wen-Jung Chiang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao ,  Sen-Yen Yang

IPC分类号： H01L23/488

CPC分类号： H01L23/49827 ,  H01L23/64 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/114 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09636 ,  H05K2201/09718 ,  H01L2924/00

摘要： A semiconductor package substrate is provided, which includes a substrate body having a plurality of conductive through holes formed therein, wherein at least two adjacent conductive through holes are formed as a differential pair, each of which has a ball pad formed at an end thereof; and at least one electrically integrated layer formed in the substrate body, and having an opening corresponding to the two adjacent conductive through holes formed as the differential pair and the ball pads thereof. Thus, the spacing between the conductive through holes and the electrically integrated layer and the spacing between the ball pads can be enlarged by the opening, so as to balance the impedance match.

摘要翻译： 提供了一种半导体封装基板，其包括其中形成有多个导电通孔的基板主体，其中至少两个相邻的导电通孔形成为差分对，每个导体通孔在其一端形成有球垫; 以及形成在所述基板主体中的至少一个电气集成层，并且具有与形成为所述差动对的两个相邻的导电通孔对应的开口及其球垫。 因此，可以通过开口来扩大导电通孔和电气集成层之间的间隔以及球垫之间的间隔，从而平衡阻抗匹配。

公开(公告)号：US20050253253A1

公开(公告)日：2005-11-17

申请号：US10974376

申请日：2004-10-26

申请人： Wen-Jung Chiang ,  Chien-Te Chen ,  Yu-Po Wang

发明人： Wen-Jung Chiang ,  Chien-Te Chen ,  Yu-Po Wang

IPC分类号： H01L23/10 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/49838 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A high electrical performance semiconductor package is proposed. A carrier is provided having a first surface, an opposite second surface, and conductive vias for electrically connecting the first surface to the second surface. A chip is attached to the first surface of the carrier. A plurality of via lands are disposed peripherally on the first surface of the carrier and electrically connected to the vias. A plurality of conductive regions are disposed on the second surface of the carrier and electrically connected to the vias. A plurality of fingers are disposed around the chip and electrically connected to the via lands by conductive traces formed on the first surface of the carrier. A plurality of bonding wires electrically connect the chip to the fingers. Lengths of the wires for transmitting differential pair signals are substantially equal, and lengths of the traces for transmitting the differential pair signals are substantially equal.

摘要翻译： 提出了一种高性能半导体封装。 提供具有第一表面，相对的第二表面和用于将第一表面电连接到第二表面的导电通孔的载体。 芯片附接到载体的第一表面。 多个通孔焊盘周边设置在载体的第一表面上并电连接到通孔。 多个导电区域设置在载体的第二表面上并电连接到通孔。 多个指状物设置在芯片周围，并通过形成在载体的第一表面上的导电迹线电连接到通孔焊盘。 多个接合线将芯片电连接到手指。 用于传输差分对信号的导线的长度基本相等，用于发送差分对信号的迹线的长度基本相等。

公开(公告)号：US07732913B2

公开(公告)日：2010-06-08

申请号：US11701767

申请日：2007-02-02

申请人： Tsung-Tien Hsieh ,  Wen-Jung Chiang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao ,  Sen-Yen Yang

发明人： Tsung-Tien Hsieh ,  Wen-Jung Chiang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao ,  Sen-Yen Yang

IPC分类号： H01L23/04

CPC分类号： H01L23/49827 ,  H01L23/64 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/114 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09636 ,  H05K2201/09718 ,  H01L2924/00

摘要： A semiconductor package substrate is provided, which includes a substrate body having a plurality of conductive through holes formed therein, wherein at least two adjacent conductive through holes are formed as a differential pair, each of which has a ball pad formed at an end thereof; and at least one electrically integrated layer formed in the substrate body, and having an opening corresponding to the two adjacent conductive through holes formed as the differential pair and the ball pads thereof. Thus, the spacing between the conductive through holes and the electrically integrated layer and the spacing between the ball pads can be enlarged by the opening, so as to balance the impedance match.

摘要翻译： 提供了一种半导体封装基板，其包括其中形成有多个导电通孔的基板主体，其中至少两个相邻的导电通孔形成为差分对，每个导体通孔在其一端形成有球垫; 以及形成在所述基板主体中的至少一个电气集成层，并且具有与形成为所述差动对的两个相邻的导电通孔对应的开口及其球垫。 因此，可以通过开口来扩大导电通孔和电气集成层之间的间隔以及球垫之间的间隔，从而平衡阻抗匹配。

公开(公告)号：US07361846B2

公开(公告)日：2008-04-22

申请号：US10974376

申请日：2004-10-26

申请人： Wen-Jung Chiang ,  Chien-Te Chen ,  Yu-Po Wang

发明人： Wen-Jung Chiang ,  Chien-Te Chen ,  Yu-Po Wang

IPC分类号： H05K1/16

CPC分类号： H01L23/49838 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A high electrical performance semiconductor package is proposed. A carrier is provided having a first surface, an opposite second surface, and conductive vias for electrically connecting the first surface to the second surface. A chip is attached to the first surface of the carrier. A plurality of via lands are disposed peripherally on the first surface of the carrier and electrically connected to the vias. A plurality of conductive regions are disposed on the second surface of the carrier and electrically connected to the vias. A plurality of fingers are disposed around the chip and electrically connected to the via lands by conductive traces formed on the first surface of the carrier. A plurality of bonding wires electrically connect the chip to the fingers. Lengths of the wires for transmitting differential pair signals are substantially equal, and lengths of the traces for transmitting the differential pair signals are substantially equal.

摘要翻译： 提出了一种高性能半导体封装。 提供具有第一表面，相对的第二表面和用于将第一表面电连接到第二表面的导电通孔的载体。 芯片附接到载体的第一表面。 多个通孔焊盘周边设置在载体的第一表面上并电连接到通孔。 多个导电区域设置在载体的第二表面上并电连接到通孔。 多个指状物设置在芯片周围，并通过形成在载体的第一表面上的导电迹线电连接到通孔焊盘。 多个接合线将芯片电连接到手指。 用于传输差分对信号的导线的长度基本相等，用于发送差分对信号的迹线的长度基本相等。

公开(公告)号：US07394237B2

公开(公告)日：2008-07-01

申请号：US11541739

申请日：2006-10-03

申请人： Hung-Liang Chou ,  Wen-Jung Chiang ,  Chin-Chang Wu ,  Ya-Tsung Feng ,  Li-Hsiang Lai

发明人： Hung-Liang Chou ,  Wen-Jung Chiang ,  Chin-Chang Wu ,  Ya-Tsung Feng ,  Li-Hsiang Lai

IPC分类号： G05F5/00 ,  G05F1/40 ,  H02M7/00

CPC分类号： G05F1/67 ,  H02M1/42 ,  H02M3/157 ,  Y02B70/12 ,  Y10S323/906

摘要： A maximum power point tracking method, applied to a tracking device, employs a DC/DC converter connecting with a solar cell array, and including a controller actuating the DC/DC converter to perform an active resistance characteristic; a maximum power point tracking circuit adjusting the active resistance of the DC/DC converter; monitoring a change of an output power of the solar cell array in determining a direction for adjusting the active resistance of the DC/DC converter; and the maximum power point tracking circuit repeatedly adjusting the active resistance of the DC/DC converter. If the change of the output power of the solar cell array is positive, the active resistance of the DC/DC converter is adjusted in the same direction; but, conversely, if the change of the output power of the solar cell array is negative, the active resistance of the DC/DC converter is adjusted in an opposite direction.

摘要翻译： 应用于跟踪装置的最大功率点跟踪方法采用与太阳能电池阵列连接的DC / DC转换器，并且包括致动DC / DC转换器以执行有源电阻特性的控制器; 最大功率点跟踪电路，调整DC / DC转换器的有效电阻; 在确定用于调节DC / DC转换器的有效电阻的方向的同时监视太阳能电池阵列的输出功率的变化; 并且最大功率点跟踪电路重复调整DC / DC转换器的有效电阻。 如果太阳能电池阵列的输出功率的变化为正，则DC / DC转换器的有效电阻在相同的方向上被调整; 但是相反，如果太阳能电池阵列的输出功率的变化为负，则DC / DC转换器的有效电阻在相反的方向上被调节。

公开(公告)号：US07843082B2

公开(公告)日：2010-11-30

申请号：US11546277

申请日：2006-10-12

申请人： Hung-Liang Chou ,  Wen-Jung Chiang ,  Chin-Chang Wu ,  Ya-Tsung Feng

发明人： Hung-Liang Chou ,  Wen-Jung Chiang ,  Chin-Chang Wu ,  Ya-Tsung Feng

IPC分类号： H02J9/00

CPC分类号： H02J3/38 ,  H02J2003/388 ,  Y10T307/615

摘要： An islanding detection apparatus for a distributed generation power system and a detection method therefor operates a power converter to act as a virtual capacitor or inductor at a frequency close to but unequal to that of a utility power system under abnormal condition of the utility power system. When power failure occurs in the utility power system, only the distributed generation power system supplies power to a load so that a load voltage has been changed in at least one of amplitude and frequency which can be immediately detected islanding phenomenon.

摘要翻译： 用于分布式发电系统的孤岛检测装置及其检测方法使功率转换器在公用电力系统的异常状态下以与公用电力系统的频率接近但不相等的频率充当虚拟电容器或电感器。 当在公用电力系统中发生电力故障时，只有分布式发电系统向负载供电，使负载电压发生变化，其幅度和频率至少可以立即检测到孤岛现象。

公开(公告)号：US20070290668A1

公开(公告)日：2007-12-20

申请号：US11541739

申请日：2006-10-03

申请人： Hung-Liang Chou ,  Wen-Jung Chiang ,  Chin-Chang Wu ,  Ya-Tsung Feng ,  Li-Hsiang Lai

发明人： Hung-Liang Chou ,  Wen-Jung Chiang ,  Chin-Chang Wu ,  Ya-Tsung Feng ,  Li-Hsiang Lai

IPC分类号： G05F5/00

CPC分类号： G05F1/67 ,  H02M1/42 ,  H02M3/157 ,  Y02B70/12 ,  Y10S323/906

摘要： A maximum power point tracking method, applied to a tracking device, employs a DC/DC converter connecting with a solar cell array, and including a controller actuating the DC/DC converter to perform an active resistance characteristic; a maximum power point tracking circuit adjusting the active resistance of the DC/DC converter; monitoring a change of an output power of the solar cell array in determining a direction for adjusting the active resistance of the DC/DC converter; and the maximum power point tracking circuit repeatedly adjusting the active resistance of the DC/DC converter. If the change of the output power of the solar cell array is positive, the active resistance of the DC/DC converter is adjusted in the same direction; but, conversely, if the change of the output power of the solar cell array is negative, the active resistance of the DC/DC converter is adjusted in an opposite direction.

摘要翻译： 应用于跟踪装置的最大功率点跟踪方法采用与太阳能电池阵列连接的DC / DC转换器，并且包括致动DC / DC转换器以执行有源电阻特性的控制器; 最大功率点跟踪电路，调整DC / DC转换器的有效电阻; 在确定用于调节DC / DC转换器的有效电阻的方向的同时监视太阳能电池阵列的输出功率的变化; 并且最大功率点跟踪电路重复调整DC / DC转换器的有效电阻。 如果太阳能电池阵列的输出功率的变化为正，则DC / DC转换器的有效电阻在相同的方向上被调整; 但是相反，如果太阳能电池阵列的输出功率的变化为负，则DC / DC转换器的有效电阻在相反的方向上被调节。

公开(公告)号：US08923027B2

公开(公告)日：2014-12-30

申请号：US13371895

申请日：2012-02-13

申请人： Chin-Chang Wu ,  Wen-Jung Chiang ,  Ming-Pin Mai ,  Chia-Wei Chou ,  Mao-Jang He

发明人： Chin-Chang Wu ,  Wen-Jung Chiang ,  Ming-Pin Mai ,  Chia-Wei Chou ,  Mao-Jang He

IPC分类号： H02M7/5387 ,  H02M7/483

CPC分类号： H02M7/483 ,  H02M2007/4835

摘要： A five-level DC-AC converter includes a capacitor set and a full-bridge circuit. The capacitor set contains two DC capacitors, a power electronic switch and two diodes. When the power electronic switch is turned on/off, the two DC capacitors are connected in series/parallel to provide a two-level DC voltage to the full-bridge circuit. The full-bridge circuit further converts the two-level DC voltage to output a voltage with three voltage levels in the positive half cycle and three voltage levels in the negative half cycle. This achieves the goal of using five power electronic switches to convert DC power into AC power with five voltage levels.

摘要翻译： 五级DC-AC转换器包括电容器组和全桥电路。 电容器组包含两个直流电容器，一个电力电子开关和两个二极管。 当电力电子开关打开/关闭时，两个直流电容器串联/并联连接，为全桥电路提供两级直流电压。 全桥电路进一步转换两级直流电压，以在正半周期中输出三个电压电平的电压，在负半周期中输出三个电压电平。 这实现了使用五个电力电子开关将DC电力转换成具有五个电压电平的AC电力的目标。

公开(公告)号：US20070103004A1

公开(公告)日：2007-05-10

申请号：US11546277

申请日：2006-10-12

申请人： Hung-Liang Chou ,  Wen-Jung Chiang ,  Chin-Chang Wu ,  Ya-Tsung Feng

发明人： Hung-Liang Chou ,  Wen-Jung Chiang ,  Chin-Chang Wu ,  Ya-Tsung Feng

IPC分类号： H02J9/00

CPC分类号： H02J3/38 ,  H02J2003/388 ,  Y10T307/615

摘要： An islanding detection apparatus for a distributed generation power system and a detection method therefor operates a power converter to act as a virtual capacitor or inductor at a frequency close to but unequal to that of a utility power system under abnormal condition of the utility power system. When power failure occurs in the utility power system, only the distributed generation power system supplies power to a load so that a load voltage has been changed in at least one of amplitude and frequency which can be immediately detected islanding phenomenon.

摘要翻译： 用于分布式发电系统的孤岛检测装置及其检测方法使功率转换器在公用电力系统的异常状态下以与公用电力系统的频率接近但不相等的频率充当虚拟电容器或电感器。 当在公用电力系统中发生电力故障时，只有分布式发电系统向负载供电，使负载电压发生变化，其幅度和频率中至少有一个可立即检测到孤岛现象。