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发明授权
US07732913B2 Semiconductor package substrate 有权
半导体封装基板

Semiconductor package substrate
摘要：
A semiconductor package substrate is provided, which includes a substrate body having a plurality of conductive through holes formed therein, wherein at least two adjacent conductive through holes are formed as a differential pair, each of which has a ball pad formed at an end thereof; and at least one electrically integrated layer formed in the substrate body, and having an opening corresponding to the two adjacent conductive through holes formed as the differential pair and the ball pads thereof. Thus, the spacing between the conductive through holes and the electrically integrated layer and the spacing between the ball pads can be enlarged by the opening, so as to balance the impedance match.
摘要（中）：

提供了一种半导体封装基板，其包括其中形成有多个导电通孔的基板主体，其中至少两个相邻的导电通孔形成为差分对，每个导体通孔在其一端形成有球垫; 以及形成在所述基板主体中的至少一个电气集成层，并且具有与形成为所述差动对的两个相邻的导电通孔对应的开口及其球垫。 因此，可以通过开口来扩大导电通孔和电气集成层之间的间隔以及球垫之间的间隔，从而平衡阻抗匹配。

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