发明授权
- 专利标题： Optimization of electronic package geometry for thermal dissipation
- 专利标题（中）： 用于散热的电子封装几何的优化
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申请号： US11847716申请日： 2007-08-30
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公开(公告)号： US07737550B2公开(公告)日： 2010-06-15
- 发明人: Stephen W. MacQuarrie , Scott P. Moore
- 申请人： Stephen W. MacQuarrie , Scott P. Moore
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Carl Lanuti, Esq.
- 主分类号： H01L23/43
- IPC分类号： H01L23/43 ; H01L21/00
摘要：
An electronic package device is disclosed including a microelectronic package and a heat sink positioned over the microelectronic package. A thermal interface element is positioned between the microelectronic package and the heat sink. The thermal interface element is elongated and has differing thicknesses along its length to enhance the dissipation of heat.
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