Abstract:
The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.
Abstract:
The invention relates to a circuit board unit and a method for production thereof. The circuit board unit comprises a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices. The circuit board topmost laminate features a thickness dimensioned such that the anticipated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board laminate to good effect. The circuit board unit further comprises an electrically insulating laminate arranged under the circuit board topmost laminate, inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipation, and a cooling plate arranged below the electrically insulating laminate and the inserts.
Abstract:
An electronic apparatus includes an outer cover member, an internal structure member, first and second external connection connectors, and first and second printed circuit boards. The first printed circuit board has a first surface on which the first external connector is mounted thereon, a signal pattern of the first external connector is formed on the first surface, and a second surface. The second printed circuit board has a first surface on which the second external connector is mounted thereon, a signal pattern of the second external connector is formed on the first surface, and a second surface. Ground patterns are formed on the second surfaces of the printed circuit boards. The first and second external connectors overlap and are arranged in a space surrounded by the outer cover member and the internal structure member so that the second surfaces of the first and second printed circuit boards face each other.
Abstract:
The present invention provides a receiver that includes a plurality of tuners for receiving broadcasts such as satellite broadcast. A tuner circuit (1) includes an input terminal (11) for inputting a broadcast wave in which a video signal and/or an audio signal are modulated in a predetermined format, and a mount layer (13) on which a main circuit (12) for selecting, from the broadcast wave, a video signal and/or an audio signal included in a predetermined frequency band is mounted. In the tuner circuit (1), a first ground layer (15) is disposed, through a first dielectric layer (14), on the surface opposite to that on which the main circuit (12) of the mount layer (13) is arranged, and a second ground layer (17) is disposed through a second dielectric layer, thereby suppressing mutual interference between tuners.
Abstract:
A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.
Abstract:
The present invention relates to a stripline arrangement (10′) comprising a number of stripline layers each comprising a laminate layer (1A, 1B) and conducting layers (2A, 2B, 3A, 3B) provided on each of said laminate layers (1A, 1B), said conducting layers (2A, 2B, 3A, 3B) each comprising a conductive pattern, RF signal (microwave) input and output ports respectively, and an interconnecting arrangement (5) for interconnecting said layers. At least two of said stripline layers are arranged such that a given overlapping zone (L′) is provided between each other facing conducting layers (2A, 2B) of said striplines layers, said interconnecting arrangement (5) comprising a bonding arrangement provided between adjacent and one another facing and overlapping conducting layers (2A, 2B). Connectors (4A, 4B) are provided substantially perpendicularly with respect to an extension plane of the respective stripline layers and crossing said laminate layers (1A, 1B) and conducting layers for, in said overlapping zone, providing contact between the adjacent conducting layers of adjacent stripline layers.
Abstract:
A printed circuit board includes a lower plate provided with an internal circuit wiring and having a recessed part at a surface thereof and a plurality of projection patterns at a lower surface of the recessed part; an upper plate having the same structure of the lower plate and adhered to the lower plate so that surfaces formed with the recessed part are opposite to each other; a heat circulation medium injected into an internal space formed by the recessed parts of the lower and upper plates.
Abstract:
A method for assembling a circuit card assembly includes populating a plurality of components on a top side of a component layer, performing component-level testing on at least one component of the plurality of components populated on the component layer, adhering a bonding layer to a bottom side of the component layer, the bonding layer to facilitate bonding the component layer to an interconnect layer and to provide connectivity between the plurality of components and the interconnect layer, and forming a single-sided circuit card assembly by adhering the interconnect layer to the bonding layer, the interconnect layer having a top side and a bottom side, the bonding layer adhered to the top side of the interconnect layer.
Abstract:
A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
Abstract:
A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.