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公开(公告)号：US20180123206A1
公开(公告)日：2018-05-03
申请号：US15856122
申请日：2017-12-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki YOSUI
CPC classification number: H01P3/08 , H01L23/12 , H01L23/66 , H01L2924/0002 , H01P3/085 , H01P5/028 , H05K1/0251 , H05K1/0253 , H05K1/118 , H05K1/147 , H05K2201/0191 , H05K2201/058 , H05K2201/0919 , H05K2201/09445 , H05K2201/09727 , H05K2201/09845 , H05K2201/10189 , H01L2924/00
Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.
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公开(公告)号：US20180053981A1
公开(公告)日：2018-02-22
申请号：US15630101
申请日：2017-06-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Bum-hee BAE , Young-kun KWON
CPC classification number: H01P3/08 , H01B7/0807 , H01B7/0823 , H01B13/0036 , H01P3/085 , H01P5/028 , H01P11/003 , H05K1/0218 , H05K1/0245 , H05K1/148 , H05K2201/058 , H05K2201/0715
Abstract: A flexible flat cable and a manufacturing method thereof are provided. The flexible flat cable includes a plurality of ground parts comprising a conductive material disposed at intervals, a plurality of signal transmission parts comprising a conductive material disposed between the plurality of ground parts, an outer skin covering the signal transmission parts and the ground parts, and a conductive adhesive layer disposed between the ground parts and the signal transmission parts and the outer skin part, the signal transmission part comprising an insulating member and a strip line disposed within the insulating member and the ground part comprising a ground member having the same cross section as the strip line and a conductive adhesive block coupled to the ground member with the conductive adhesive layer.
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公开(公告)号：US09899719B2
公开(公告)日：2018-02-20
申请号：US14938881
申请日：2015-11-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
CPC classification number: H01P3/08 , H01L23/12 , H01L23/66 , H01L2924/0002 , H01P3/085 , H01P5/028 , H05K1/0251 , H05K1/0253 , H05K1/118 , H05K1/147 , H05K2201/0191 , H05K2201/058 , H05K2201/0919 , H05K2201/09445 , H05K2201/09727 , H05K2201/09845 , H05K2201/10189 , H01L2924/00
Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.
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公开(公告)号：US09853340B2
公开(公告)日：2017-12-26
申请号：US14931541
申请日：2015-11-03
Applicant: RF Micro Devices, Inc.
Inventor： Dirk Robert Walter Leipold , George Maxim , Marcus Granger-Jones , Baker Scott
CPC classification number: H01P1/20381 , H01P3/085 , H01P5/028 , H01P9/006
Abstract: The present disclosure relates to coupled slow-wave transmission lines. In this regard, a transmission line structure is provided. The transmission line structure includes a first undulating signal path formed from first loop structures. The transmission line structure also includes a second undulating signal path formed from second loop structures. The second undulating signal path is disposed alongside of the first undulating signal path. Further, a first ground structure is disposed above or below either one or both of the first undulating signal path and the second undulating signal path.
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公开(公告)号：US09847564B2
公开(公告)日：2017-12-19
申请号：US14921218
申请日：2015-10-23
Applicant: RF Micro Devices, Inc.
Inventor： Dirk Robert Walter Leipold , George Maxim , Marcus Granger-Jones , Baker Scott
CPC classification number: H01P1/20381 , H01P3/085 , H01P5/028 , H01P9/006 , H05K1/00 , H05K1/0219 , H05K1/0239 , H05K1/0298 , H05K3/4611 , H05K2201/097
Abstract: The present disclosure relates to a slow-wave transmission line for transmitting slow-wave signals with reduced loss. In this regard, the slow-wave transmission line is formed in a multi-layer substrate and includes an undulating signal path. The undulating signal path includes at least two loop structures, wherein each loop structure includes at least two via structures connected by at least one intra-loop trace. The undulating signal path further includes at least one inter-loop trace connecting the at least two loop structures. Additionally, the slow-wave transmission line includes a first ground structure disposed along the undulating signal path. In this manner, a loop inductance is formed by each of the at least two loop structures, while a first distributed capacitance is formed between the undulating signal path and the ground structure.
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Patent Agency Ranking
公开(公告)号：US09793590B2
公开(公告)日：2017-10-17
申请号：US15027506
申请日：2014-10-03
Applicant: NEC Corporation
Inventor： Takahiro Miyamoto , Norihisa Shiroyama , Kiyotake Sasaki , Sumio Ueda
CPC classification number: H01P3/08 , H01P1/203 , H01P1/209 , H01P1/213 , H01P1/2135 , H01P3/085 , H01P3/087 , H01P5/103 , H01P5/107 , H01P11/00
Abstract: The first member and the second member include, when a line that connects a first port and a second port is denoted by a reference line, a first groove that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove that connects one end of the first groove and the first port; a third groove that connects the other end of the first groove and the first port and has a shape that is line symmetrical to the second groove with respect to the reference line; a fourth groove that connects the other end (FN2) of the first groove and the second port; and a fifth groove that connects one end (FN1) of the first groove and the second port and has a shape that is line symmetrical to the fourth groove with respect to the reference line.
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公开(公告)号：US20170271735A1
公开(公告)日：2017-09-21
申请号：US15460546
申请日：2017-03-16
Applicant: Oclaro Japan, Inc.
Inventor： Osamu KAGAYA , Koyu TAKAHASHI
CPC classification number: H01P3/081 , G01J1/44 , H01P1/047 , H01P3/085 , H01P5/028 , H05K1/024 , H05K1/0242 , H05K1/115 , H05K1/18 , H05K2201/10121
Abstract: A printed circuit board includes a first signal line inside a first dielectric layer; a first ground conductor layer and a second ground conductor layer; a second signal line disposed on the first ground conductor layer; a signal via for connecting the first signal line and the second signal line; and ground vias formed surrounding the signal via. The ground vias include first ground vias formed at respective first points, second ground vias formed at respective second points. The first points are placed on the line of a first polygon, and the second points are placed on the line of a second polygon, and the distances between adjacent first points and those between adjacent second points are all equal to or shorter than a first distance, and at least one second point is placed within the first distance from each of the adjacent first points.
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公开(公告)号：US20170244145A1
公开(公告)日：2017-08-24
申请号：US15587770
申请日：2017-05-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO
CPC classification number: H01P3/082 , H01P1/20363 , H01P3/084 , H01P3/085 , H05K1/0225 , H05K1/0242 , H05K1/115 , H05K1/147 , H05K2201/09618 , H05K2201/09663 , H05K2201/09672 , H05K2201/09727 , H05K2201/0979
Abstract: A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line.
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9.发明申请公开(公告)号：US20170187132A1
公开(公告)日：2017-06-29
申请号：US15456698
申请日：2017-03-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO , Masahiro OZAWA
CPC classification number: H01R12/62 , H01P1/047 , H01P3/08 , H01P3/085 , H01P5/085 , H01R12/53 , H01R12/613 , H05K1/0222 , H05K1/148 , H05K3/361 , H05K2201/2072
Abstract: A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes.
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公开(公告)号：US09680195B2
公开(公告)日：2017-06-13
申请号：US14568341
申请日：2014-12-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato
CPC classification number: H01P3/082 , H01P1/20363 , H01P3/084 , H01P3/085 , H05K1/0225 , H05K1/0242 , H05K1/115 , H05K1/147 , H05K2201/09618 , H05K2201/09663 , H05K2201/09672 , H05K2201/09727 , H05K2201/0979
Abstract: A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line.
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