Abstract:
A first potential and a second potential lower than the first potential are applied to a first end of a memory gate electrode part of the nonvolatile memory and to a second end of the memory gate electrode part, respectively, so that a current is caused to flow in a direction in which the memory gate electrode part extends, then, a hole is injected from the memory gate electrode part into a charge accumulating part below it, therefore, an electron accumulated in the charge accumulating part is eliminated. By causing the current to flow through the memory gate electrode part of a memory cell region as described above, Joule heat can be generated to heat the memory cell. Consequently, in the erasing by a FN tunneling method in which the erasing characteristics degrade at a low temperature, the erasing speed can be improved by heating the memory gate electrode part.
Abstract:
A charge trapping memristor is disclosed. An example charge trapping memristor includes a first electrode and second electrode configured on opposite sides of a channel to generate an electric potential across the channel, and a charge barrier. The example charge trapping memristor also includes a charge trapping material configured to store and release an electric charge therein, wherein storing and releasing the electric charge changes electrical properties of the channel.
Abstract:
A semiconductor memory device has a memory block including memory strings with first and second selection transistors at opposite ends of the memory strings. A bit line is connected to the first selection transistor of each memory string and a sense amplifier is connected to the bit line. The memory block includes word lines connected to each memory cell transistor in the memory strings. The memory device also includes a controller to control an erase operation that includes applying an erase voltage to the word lines, addressing a first memory string by applying a selection voltage to a gate electrode of first and second selection transistors of the first memory string, then applying an erase verify voltage to the word lines and using the sense amplifier to read data of memory cell transistors in the first memory string, then addressing a second memory string without first discharging the word lines.
Abstract:
A SONOS byte-erasable EEPROM is disclosed. In one aspect, an apparatus includes a plurality of SONOS memory cells forming an EEPROM memory array. The apparatus also includes a controller that generates bias voltages to program and erase the memory cells. The controller performs a refresh operation when programming selected memory cells to reduce write-disturb on unselected memory cells to prevent data loss.
Abstract:
An erase method of a nonvolatile memory includes supplying an erase voltage to a substrate, supplying a selection word line voltage to word lines connected with a selected sub-block within a memory block of the nonvolatile memory, supplying a non-selection word line voltage to word lines connected with an unselected sub-block within the memory block during a first delay time from a point of time when the erase voltage is supplied, and thereafter floating the word lines connected with the unselected sub-block.
Abstract:
In a semiconductor device including a split gate type MONOS memory, and a trench capacitor element having an upper electrode partially embedded in trenches formed in the main surface of a semiconductor substrate, merged therein, the flatness of the top surface of the upper electrode embedded in the trench is improved. The polysilicon film formed over the semiconductor substrate to form a control gate electrode forming a memory cell of the MONOS memory is embedded in the trenches formed in the main surface of the semiconductor substrate in a capacitor element formation region, thereby to form the upper electrode including the polysilicon film in the trenches.
Abstract:
A highly integrated semiconductor device that holds data and includes a first semiconductor layer, a first gate insulating film over the first semiconductor layer, a first gate electrode over the first gate insulating film, a second semiconductor layer over the first gate electrode, a conductive layer over the second semiconductor layer, a second gate insulating film covering the second semiconductor layer and the conductive layer, and a second gate electrode covering at least part of a side surface of the second semiconductor layer with the second gate insulating film interposed therebetween. An end portion of the second semiconductor layer is substantially aligned with an end portion of the conductive layer.
Abstract:
A data storage device includes a non-volatile memory device, which includes a memory cell array including a plurality of memory cells and a control circuit. Each of the memory cells includes a channel layer, a charge trap layer on the channel layer, and a control electrode on the charge trap layer, the charge trap layer being shared by the memory cells. The charge trap layer includes program regions respectively disposed below the control electrodes of the memory cells, and charge spread blocking regions, each of which is disposed between two adjacent ones of the program regions and between two adjacent ones of the control electrodes. The control circuit controls the memory cell array so that a potential barrier is generated in the charge spread blocking regions by charging the charge spread blocking regions with charges having the same polarity as that of program charges stored in the program regions.
Abstract:
In a non-volatile semiconductor memory device, it is only necessary that, at the time of data writing, a voltage drop is caused in a high resistance region. Therefore, the value of voltage applied to a gate electrode can be reduced as compared with a conventional device. In correspondence with the reduction in the value of applied voltage, it is possible to reduce the film thickness of a gate insulating film of memory transistors, and further the film thickness of the gate insulating film of a peripheral transistor for controlling the memory transistors. As a result, the circuit configuration of the non-volatile semiconductor memory device can be reduced in size as compared with the conventional device.
Abstract:
This invention provides 3D stacked memory arrays and methods for determining threshold voltages of string selection transistors by LSMP (layer selection by multi-level permutation) for enabling to select layers regardless of the number or as many as possible by the limited numbers of threshold voltage states and SSLs. Thus, this invention enables to maximize the degree of integrity of memory by minimizing the number of SSLs and to select layers with no limitation of the number by considering a recent aspect ratio of the semiconductor etching process.