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公开(公告)号:US12119063B2
公开(公告)日:2024-10-15
申请号:US17957532
申请日:2022-09-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Wan Nam , Hyunggon Kim , Bong-Kil Jung , Younho Hong , Juseong Hwang
IPC: G11C16/08
CPC classification number: G11C16/08
Abstract: Disclosed is a memory device includes a memory block that is connected with a plurality of wordlines, a voltage generating circuit configured to output a first non-selection voltage through a plurality of driving lines, and an address decoding circuit configured to connect the plurality of driving lines with unselected wordlines of the plurality of wordlines. During a wordline setup period for the plurality of wordlines, the voltage generating circuit floats first driving lines corresponding to first unselected wordlines of the unselected wordlines from among the plurality of driving lines when the first unselected wordlines reach a first target level, and floats second driving lines corresponding to second unselected wordlines of the unselected wordlines from among the plurality of driving lines when the second unselected wordlines reach a second target level different from the first target level.
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公开(公告)号:US12080358B2
公开(公告)日:2024-09-03
申请号:US17866904
申请日:2022-07-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bong-Kil Jung , Sang-Wan Nam , Jong Min Baek , Min Ki Jeon , Woo Chul Jung , Yoon-Hee Choi
CPC classification number: G11C16/3404 , G11C16/0483 , G11C16/08 , G11C16/24
Abstract: A nonvolatile memory device including a memory cell array, a first voltage generator configured to generate a word line operating voltage for each word line of the memory cell array, a second voltage generator configured to generate a bit line operating voltage of the memory cell array, and a temperature unit configured to determine, from a temperature range table, a temperature range for a temperature code according to a real-time temperature of the memory cell array, and to adjust a power supply voltage of the first or second voltage generator based on a selection signal mapped to the determined temperature range.
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63.
公开(公告)号:USRE48930E1
公开(公告)日:2022-02-15
申请号:US16670668
申请日:2019-10-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sang-Wan Nam , Kitae Park
Abstract: A three-dimensional (3D) flash memory includes a first dummy word line disposed between a ground select line and a lowermost main word line, and a second dummy word line of different word line configuration disposed between a string select line and an upper most main word line.
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公开(公告)号:US11238934B2
公开(公告)日:2022-02-01
申请号:US16991912
申请日:2020-08-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Wan Nam , Euihyun Cheon , Byungjun Min
Abstract: A nonvolatile memory device includes a peripheral circuit region and a memory cell region. The peripheral circuit region includes a block selecting circuit, a block unselecting circuit, and a first metal pad. The memory cell region is vertically connected to the peripheral circuit region, and includes a first memory block and a second metal pad directly connected to the first metal pad. The block selecting circuit is connected with ground selection lines, word lines, and string selection lines, and provides corresponding driving voltages to the ground selection lines, the word lines, and the string selection lines in response to a block selection signal corresponding to the first memory block, respectively. The block unselecting circuit is connected only with specific string selection lines, and provides an off-voltage only to the specific string selection lines in response to a block un-selection signal.
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65.
公开(公告)号:US11200955B2
公开(公告)日:2021-12-14
申请号:US16734799
申请日:2020-01-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Won-Taeck Jung , Sang-Wan Nam , Jinwoo Park , Jaeyong Jeong
IPC: G11C16/10 , G11C16/20 , G11C16/08 , G11C16/34 , G11C16/04 , H01L27/11582 , H01L27/11524 , H01L27/1157 , H01L27/11556
Abstract: A three-dimensional (3D) nonvolatile memory device includes a cell string. The cell string includes a pillar structure comprising a ground selection transistor, a plurality of memory cells, and a string selection transistor stacked vertically over a substrate. The memory cells comprise a first cell group and a second cell group stacked on the first cell group, and a horizontal width of at least a portion of the pillar structure decreases in a depth direction towards the substrate. A method of programming the memory device includes initializing a channel of a memory cell of the first cell group of the cell string through the ground selection transistor of the pillar structure, and then applying a program voltage to the memory cell of the pillar structure of the cell string.
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公开(公告)号:US11056194B2
公开(公告)日:2021-07-06
申请号:US17036387
申请日:2020-09-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Won-Bo Shim , Sang-Wan Nam , Ji-Ho Cho
Abstract: A nonvolatile memory device includes a memory cell region, a peripheral circuit region, a memory block in the memory cell region, a row decoder in the peripheral circuit region, and a control circuit in the peripheral circuit region. The memory cell region includes a first metal pad. The peripheral circuit region includes a second metal pad and is vertically connected to the memory cell region by the first metal pad and the second metal pad. The memory block includes memory cells stacked in a direction intersecting a substrate, and is divided into a plurality of sub-blocks configured to be erased independently. The row decoder selects the memory block by units of a sub-block. The control circuit receives a data erase command for a selected sub-block among the plurality of sub-blocks, performs a data read operation on at least one victim sub-block among the plurality of sub-blocks in response to the data erase command, selectively performs a soft program operation on the at least one victim sub-block based on a result of the data read operation, and performs a data erase operation on the selected sub-block after the data read operation is performed and the soft program operation is selectively performed.
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67.
公开(公告)号:US10909032B2
公开(公告)日:2021-02-02
申请号:US16849645
申请日:2020-04-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chi Weon Yoon , Dong Hyuk Chae , Sang-Wan Nam , Jung-Yun Yun
Abstract: At least one address scheduling method includes selecting a first bit line, selecting a first string connected to the first bit line, performing address scheduling on N pages of each of multi-level cells in the first string sequentially from a bottom word line to a top word line, and after completing the address scheduling on all word lines in the first string, performing address scheduling on second to k-th strings sequentially in the same manner as performed with respect to the first string, where “k” is 2 or a natural number greater than 2.
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公开(公告)号:US10658043B2
公开(公告)日:2020-05-19
申请号:US16164845
申请日:2018-10-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Won-Bo Shim , Sang-Wan Nam , Ji-Ho Cho
Abstract: A method of operating a memory device includes performing a data read operation on at least one victim sub-block within a memory block containing a plurality of sub-blocks therein, in response to an erase command directed to a selected sub-block within the plurality of sub-blocks. Next, a soft program operation is performed on the at least one victim sub-block. This soft programming operation is then followed by an operation to erase the selected sub-block within the plurality of sub-blocks. This operation to erase the selected sub-block may include providing an erase voltage to a bulk region of a substrate on which the memory block extends, and the at least one victim sub-block may be disposed between the selected sub-block and the substrate.
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公开(公告)号:US10573386B2
公开(公告)日:2020-02-25
申请号:US16035958
申请日:2018-07-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wan-Dong Kim , Tae-Hyun Kim , Sang-Wan Nam , Sang-Soo Park , Jae-Yong Jeong
IPC: G11C16/04 , G11C16/08 , G11C16/28 , G11C16/10 , G11C16/26 , G11C16/34 , G11C11/56 , G11C16/32 , G11C5/06
Abstract: To operate a memory device including a plurality of NAND strings, an unselected NAND string among a plurality of NAND strings is floated when a voltage of a selected word line is increased such that a channel voltage of the unselected NAND string is boosted. The channel voltage of the unselected NAND string may be discharged when the voltage of the selected word line is decreased. The load when the voltage of the selected word line increases may be reduced by floating the unselected NAND string to boost the channel voltage of the unselected NAND string together with the increase of the voltage of the selected word line. The load when the voltage of the selected word line is decreased may be reduced by discharging the boosted channel voltage of the unselected NAND string when the voltage of the selected word line is decreased. Through such reduction of the load of the selected word line, a voltage setup time may be reduced and an operation speed of the memory device may be enhanced.
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公开(公告)号:US10324629B2
公开(公告)日:2019-06-18
申请号:US15869769
申请日:2018-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jong-Hoon Lee , Eun-Suk Cho , Woo-Pyo Jeong , Sang-Wan Nam , Jung-Ho Song , Yun-Ho Hong , Jae-Hoon Lee
IPC: G11C7/06 , G06F3/06 , H01L27/02 , H01L21/265 , G11C7/10 , G11C16/26 , G11C16/04 , G11C16/32 , H01L27/11582 , H01L27/11573
Abstract: A non-volatile memory device includes a memory cell array region in which memory cells are vertically stacked on a substrate and a page buffer region in which first and second page buffers are arranged. A first distance between the memory cell array region and the first page buffer is shorter than a second distance between the memory cell array region and the second page buffer. The first page buffer includes a first transistor driven in response to a first control signal. The second page buffer includes a second transistor driven in response to a second control signal corresponding to the first control signal. At least one of design constraints and processing constraints with respect to the first and second transistors is different.
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