Abstract:
Techniques are provided for preventing inadvertent program or erase of select gate transistors and dummy memory cells during an erase operation involving data-storing memory cells in a three-dimensional memory device. The erase operation charges up a channel of a NAND string using gate-induced drain leakage from the select gate transistors. An erase voltage waveform and a select gate waveform are ramped up to intermediate levels which allow some charging of the channel to occur. The intermediate level of the select gate waveform is low enough to avoid inadvertent programming of the select gate transistors. Subsequently, the erase voltage waveform and the select gate waveform are ramped up to peak levels which allow additional charging of the channel to occur. The peak levels are set to avoid inadvertent erasing of the select gate transistors.
Abstract:
Methods and devices for erasing information stored on an electronic semiconductor component in a plurality of non-volatile memory elements are described. Irradiating the semiconductor component with erasing radiation until a target dose has been absorbed by the semiconductor component, the erasing radiation penetrating the semiconductor component, results in an ionization effect which influences the concentration of the charge carriers stored on the memory elements such that a statistical distribution of the threshold voltages of the memory elements forms a contiguous region.
Abstract:
An erase operation for a 3D stacked memory device assigns storage elements to groups according to an expected erase speed. The storage elements are then erased according to their group to provide a more uniform erase depth and a tighter erase distribution. In one approach, the control gate voltages are set differently for the different groups to slow down the storage elements which are expected to have a faster programming speed. An erase or inhibit status can be set for all groups together. In another approach, the control gate voltages are common for the different groups but an erase or inhibit status is set for each group separately.
Abstract:
An array of programmable non-volatile devices, such as a nominal OTP cell, is operated such that a Vt representing a particular binary logic state is changed over time. This allows for re-programming and emulating a few times or multi-time programmable device.
Abstract:
An operating method of a nonvolatile memory device is provided which sequentially performs a plurality of erase loops to erase at least one of a plurality of memory blocks. The operating method comprises performing at least one of the plurality of erase loops; performing a post-program operation on the at least one memory block after the at least one erase loop is executed; and performing remaining erase loops of the plurality of erase loops. The post-program operation is not performed when each of the remaining erase loops is executed.
Abstract:
A non-volatile semiconductor memory apparatus and a data erasing method thereof are provided to suppress deterioration in reliability due to data rewriting. An erasing method of a flash memory is provided, which includes the following steps. A control gate is maintained at 0V, a high-voltage erase pulse is applied to a P well, such that electrons is emitted from a floating gate to the P well. Then, the control gate is again maintained, and a weak erase pulse with a voltage lower than the erase pulse is applied to the P well.
Abstract:
A flash memory controller is configured to provide a first erase mode for erasing one or more groups of flash memory cells in a flash memory device using a plurality of erase pulses and a second erase mode for erasing the one or more groups of flash memory cells using a single erase pulse. The controller may receive a fast erase signal to erase the one or more groups of flash memory cells and, in response to the signal, switch operating parameters of the flash memory device from first parameters corresponding to the first erase mode to second parameters corresponding to the second erase mode, and instruct the flash memory device to perform an erase operation on the one or more groups of flash memory cells according to the second parameters. The controller may then verify that the erase operation was completed using the single erase pulse.
Abstract:
Technology for performing addressing in a NAND memory is described. A defined number of address cycles supported at either a memory controller or a NAND memory to address individual memory units in the NAND memory can be identified. The defined number of address cycles in which to operate can be selected in order to address the individual memory units in the NAND memory. Either the memory controller or the NAND memory can be configured to operate at the selected number of address cycles where the individual memory units in the NAND memory are uniquely addressable using a multi die select (MDS).
Abstract:
A memory device according to an embodiment includes a memory element; and a transistor including a semiconductor layer and a plurality of gates, wherein the plurality of gates include: a first set of gates, the gates being disposed in a manner to sandwich the semiconductor layer, and a second set of gates, the gates being disposed in a manner to sandwich the semiconductor layer, the gates included in the first set is disposed in a manner to separate from the gates included in the second set in a direction along a side surface of the semiconductor layer.
Abstract:
Techniques are provided to accelerate the redistribution of the holes in connection with an erase operation, so that there will be a reduced amount of redistribution of the holes after programming. As a result, short-term charge loss after programming is reduced. In one aspect, a positive control gate voltage is applied to a set of memory cells after erase and before programming. The positive control gate voltage has a relatively low amplitude and a long duration, compared to a programming voltage. The positive control gate voltage can be adjusted based on the erase depth of the memory cells and factors such as a count of program-erase cycles, a count of erase-verify iterations, sensing of a position of the lower tail, and a cross-sectional width of a vertical pillar of a memory hole.