公开(公告)号：US20070045836A1

公开(公告)日：2007-03-01

申请号：US11436822

申请日：2006-05-18

Applicant: Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-Il Han ,  Dong-Ho Lee

Inventor： Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-Il Han ,  Dong-Ho Lee

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/31 ,  H01L24/83 ,  H01L24/90 ,  H01L24/94 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/02311 ,  H01L2224/02321 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/08112 ,  H01L2224/13009 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/81141 ,  H01L2224/83136 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05552

Abstract: In a stacked chip configuration, and manufacturing methods thereof, the gap between a lower chip and an upper chip is filled completely using a relatively simple process that eliminates voids between the lower and upper chips and the cracking and delamination problems associated with voids. The present invention is applicable to both chip-level bonding and wafer-level bonding approaches. A photosensitive polymer layer is applied to a first chip, or wafer, prior to stacking the chips or stacking the wafers. The photosensitive polymer layer is partially cured, so that the photosensitive polymer layer is made to be structurally stable, while retaining its adhesive properties. The second chip, or wafer, is stacked, aligned, and bonded to the first chip, or wafer, and the photosensitive polymer layer is then cured to fully bond the first and second chips, or wafers. In this manner, adhesion between chips/wafers is greatly improved, while providing complete fill of the gap. In addition, mechanical reliability is improved and CTE mismatch is reduced, alleviating the problems associated with warping, cracking and delamination, and leading to an improvement in device yield and device reliability.

Abstract translation: 在堆叠式芯片结构及其制造方法中，使用消除下部和上部芯片之间的空隙以及与空隙相关的开裂和分层问题的相对简单的工艺，完全填充下部芯片和上部芯片之间的间隙。 本发明可应用于芯片级接合和晶片级接合方式。 在堆叠芯片或堆叠晶片之前，将光敏聚合物层施加到第一芯片或晶片。 感光性聚合物层被部分固化，使得光敏聚合物层在结构上稳定，同时保持其粘合性能。 第二芯片或晶片被堆叠，对准并且结合到第一芯片或晶片，然后使光敏聚合物层固化以完全结合第一和​​第二芯片或晶片。 以这种方式，在提供间隙的完全填充的同时，大大提高了芯片/晶片之间的粘附。 另外，提高了机械可靠性，降低了CTE失配，缓解了翘曲，开裂，脱层等问题，提高了设备​​的产量和设备的可靠性。

公开(公告)号：US20060192747A1

公开(公告)日：2006-08-31

申请号：US10552088

申请日：2004-03-16

Applicant: Jong-Soo Yoon ,  Dong-Ho Lee

Inventor： Jong-Soo Yoon ,  Dong-Ho Lee

IPC: G09G3/36

CPC classification number: G09G3/3413 ,  G02F1/133555 ,  G02F2001/133342 ,  G02F2001/133622 ,  G02F2001/133626 ,  G02F2201/40 ,  G09G3/3406 ,  G09G3/342 ,  G09G3/3648 ,  G09G2300/023 ,  G09G2300/0456 ,  G09G2310/0235 ,  G09G2310/024

Abstract: In an LCD apparatus (400) having simplified structure and improved luminance, a light supplying unit (100) supplies an LCD panel (280) with red light during a time corresponding to one-third of a frame, green light during the time and blue light during the time. A light reflective-transmissive unit is disposed between the light supplying unit (100) and the LCD panel assembly (200) to transmit the red light, the green light and the blue light and to reflect an external light from exterior of the LCD panel assembly (200). The LCD apparatus displays an image by means of white light as well as red light, green light and blue light, thereby improving luminance and simplifying structure.

Abstract translation: 在具有简化的结构和改善的亮度的LCD装置（400）中，光供给单元（100）在对应于帧的三分之一的时间期间向LCD面板（280）供应红光，在时间期间为绿色光，蓝色 光在时间。 光反射透射单元设置在光供给单元（100）和LCD面板组件（200）之间以透射红光，绿光和蓝光，并且从LCD面板组件的外部反射外部光 （200）。 LCD装置通过白光以及红光，绿光和蓝光显示图像，从而提高亮度并简化结构。

公开(公告)号：US5587770A

公开(公告)日：1996-12-24

申请号：US389942

申请日：1995-02-17

Applicant: Hae-Seog Jo ,  Chang-Kyung Ko ,  Dong-Ho Lee

Inventor： Hae-Seog Jo ,  Chang-Kyung Ko ,  Dong-Ho Lee

IPC: G03G15/08

CPC classification number: G03G15/0822 ,  G03G15/0856 ,  G03G15/086 ,  G03G15/0862 ,  G03G15/0875

Abstract: The present invention provides a developing device of an electrophotographic recording system for developing an electrostatic latent image formed on a photosensitive drum. The developing device includes a hopper which stores toner and a developing roller which develops the electrostatic latent image formed on the photosensitive drum using the toner stored in the hopper. On one side of the hopper at a predetermined height from its bottom, a light-emitting element for emitting light is positioned. A toner detecting device detects the existence or non-existence of toner by using a light-receiving element positioned on the interior of the hopper which outputs signals corresponding to the existence or non-existence of toner in the hopper in response to the amount of the light received from the light-emitting element. An agitator conveys the toner to the developing roller and simultaneously cleans a light-emitting side of the light-emitting element and a light-receiving side of the light-receiving element in synchronism with a conveyance period of the toner. A signal transmitting device transmits signals from the light-receiving element to a CPU which compares the number of signals with a predetermined value, thereby determining a level of the toner.

Abstract translation: 本发明提供一种用于显影形成在感光鼓上的静电潜像的电子照相记录系统的显影装置。 显影装置包括存储调色剂的料斗和显影辊，显影辊使用存储在料斗中的调色剂显影形成在感光鼓上的静电潜像。 在料斗的与其底部预定高度的一侧上，定位用于发光的发光元件。 调色剂检测装置通过使用位于料斗内部的光接收元件来检测调色剂的存在或不存在，所述光接收元件响应于所述料斗的量而输出对应于料斗中存在或不存在调色剂的信号 从发光元件接收的光。 搅拌器将调色剂传送到显影辊，同时与调色剂的传送周期同步地清洁发光元件的发光侧和光接收元件的光接收侧。 信号发送装置将来自光接收元件的信号发送到将信号数与预定值进行比较的CPU，由此确定调色剂的电平。

公开(公告)号：US08887425B2

公开(公告)日：2014-11-18

申请号：US13315262

申请日：2011-12-08

Applicant: Akira Hirai ,  Dong-Ho Lee ,  Seon-Chool Kim ,  Sang-Wook Lee ,  Sung-Ki Jung

Inventor： Akira Hirai ,  Dong-Ho Lee ,  Seon-Chool Kim ,  Sang-Wook Lee ,  Sung-Ki Jung

IPC: H05K5/00 ,  G09F9/30 ,  G02F1/1333

CPC classification number: G09F9/30 ,  G02F1/133308 ,  G02F2001/133331 ,  G02F2201/50

Abstract: A display device has a cover window that is light, has good resistance against external impact, and is capable of being processed with various shapes. A display device according to the present invention includes: a display panel including a display area and a non-display area; and a cover window positioned at the front side of the display panel and including a transparent area corresponding to the display area and a non-transparent area corresponding to the non-display area, wherein the cover window includes a cover window main body formed with the transparent area and the non-transparent area, and a transparent protection layer formed at the front surface of the cover window main body. The transparent protection layer extends to the rear surface corresponding to at least a portion of the non-transparent area of the cover window main body.

Abstract translation: 显示装置具有遮光罩，光线良好，具有良好的抵抗外部冲击的能力，能够以各种形状进行加工。 根据本发明的显示装置包括：显示面板，包括显示区域和非显示区域; 以及位于所述显示面板的前侧的盖窗，其具有对应于所述显示区域的透明区域和对应于所述非显示区域的不透明区域，其中所述盖窗口包括盖窗主体， 透明区域和非透明区域，以及形成在盖窗主体的前表面处的透明保护层。 透明保护层延伸到对应于盖窗主体的不透明区域的至少一部分的后表面。

公开(公告)号：US20120273477A1

公开(公告)日：2012-11-01

申请号：US13456897

申请日：2012-04-26

Applicant: Guen Yong PARK ,  Jae Hyoun Kim ,  Cheol Jin Kim ,  Han Seong Kang ,  Jin Hae Cho ,  Eun Oh Kim ,  Chan Park ,  Dong-Ho Lee

Inventor： Guen Yong PARK ,  Jae Hyoun Kim ,  Cheol Jin Kim ,  Han Seong Kang ,  Jin Hae Cho ,  Eun Oh Kim ,  Chan Park ,  Dong-Ho Lee

IPC: A47J27/21 ,  H05B3/02

CPC classification number: F24C15/327

Abstract: A steam cooking apparatus with improved water supply and drainage structures. The apparatus includes a body, a cooking compartment, a steam generator to supply steam into the cooking compartment, a water vessel to store water and supply the water into the steam generator, a water supply device including a holder and a slider slidably mounted in the holder so as to be withdrawn from the body, a first water supply tube connecting the slider and the water vessel, a second water supply tube connecting the water vessel and the steam generator, and a drain tube to drain water in the steam generator to the outside of the body. The drain tube includes an end fixed to the slider so that the end of the drain tube is withdrawn with the slider from the body when water in the steam generator is drained to the outside.

Abstract translation: 具有改善给排水结构的蒸汽烹饪设备。 该装置包括主体，烹饪室，蒸汽发生器，以将蒸汽供应到烹饪室中，水容器，用于存储水并将水供应到蒸汽发生器中;供水装置，其包括保持器和可滑动地安装在所述蒸汽发生器中的滑块 保持器，以便从身体中取出，连接滑块和水容器的第一供水管，连接水容器和蒸汽发生器的第二供水管和排水管，以将蒸汽发生器中的水排出到 身体外。 排水管包括固定到滑块的端部，使得当蒸汽发生器中的水排出到外部时，排水管的端部与滑块一起从主体被抽出。

公开(公告)号：US20120129334A1

公开(公告)日：2012-05-24

申请号：US13365378

申请日：2012-02-03

Applicant: Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

Inventor： Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

IPC: H01L21/768

CPC classification number: H01L24/91 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure.

Abstract translation: 提供半导体封装和制造半导体封装的方法。 半导体封装可以包括衬底，其包括芯片焊盘，电连接到芯片焊盘并且包括开口的再分布线。 半导体封装还可以包括外部端子连接部分和设置在开口处并电连接到重新分配线路的外部端子连接焊盘。 本发明的总体构思可以解决包含在再分布线中的金的成分被阻止扩散到相邻的凸块焊盘中以形成空隙或不期望的金属间化合物的问题。 在片上芯片结构中，下部芯片的多个凸起连接到上部芯片以提高片上芯片结构的可靠性，分集性和功能性。

公开(公告)号：US08053807B2

公开(公告)日：2011-11-08

申请号：US12923554

申请日：2010-09-28

Applicant: Yong-Chai Kwon ,  Dong-Ho Lee

Inventor： Yong-Chai Kwon ,  Dong-Ho Lee

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/3121 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/03

Abstract: A semiconductor package may include a semiconductor pattern, a bonding pad, and a polymer insulation member. The semiconductor pattern may include a semiconductor device and first hole. The bonding pad may include a wiring pattern and plug. The wiring pattern may be formed on an upper face of the semiconductor pattern. The plug may extend from the wiring pattern to fill the first hole. The polymer insulation member may be formed on a lower face of the semiconductor pattern and may include a second hole exposing a lower end of the plug. A method of manufacturing a semiconductor package may include forming a first hole through a semiconductor substrate; forming a bonding pad and plug; attaching a supporting member to the upper face of the substrate; reducing a thickness of the substrate; forming a polymer insulation member on the lower face of the substrate; and cutting the substrate.

Abstract translation: 半导体封装可以包括半导体图案，接合焊盘和聚合物绝缘构件。 半导体图案可以包括半导体器件和第一孔。 接合焊盘可以包括布线​​图案和插头。 布线图案可以形成在半导体图案的上表面上。 插头可以从布线图案延伸以填充第一孔。 聚合物绝缘构件可以形成在半导体图案的下表面上，并且可以包括暴露插头的下端的第二孔。 制造半导体封装的方法可以包括通过半导体衬底形成第一孔; 形成焊盘和插头; 将支撑构件附接到所述基板的上表面; 减小基板的厚度; 在所述基板的下表面上形成聚合物绝缘部件; 并切割基板。

公开(公告)号：US07944539B2

公开(公告)日：2011-05-17

申请号：US10412451

申请日：2003-04-11

Applicant: Dong-Ho Lee

Inventor： Dong-Ho Lee

IPC: G02F1/1345 ,  G02F1/1343 ,  G02F1/1339

CPC classification number: G02F1/13454 ,  G02F1/133345 ,  G02F1/1339 ,  G02F1/136227 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2203/09

Abstract: An LCD device provides enhanced display quality. An insulating layer is formed on a first substrate. The insulating layer covers the contact portion of a switching device in which the switching device is electrically connected to a transparent electrode and has an opening for exposing a portion of the transparent electrode. A reflection electrode is electrically connected to the transparent electrode through the opening. The insulation layer covers a first portion of a driving circuit formed on the first substrate. A sealant is interposed between the first and second substrate to engage the first and second substrate and to cover a second portion of the driving circuit. Therefore, the driver circuit may operate normally, and the distortion of the signal outputted from the driver circuit may be prevented.

Abstract translation: LCD设备提供增强的显示质量。 在第一基板上形成绝缘层。 绝缘层覆盖开关器件的接触部分，其中开关器件电连接到透明电极并且具有用于暴露透明电极的一部分的开口。 反射电极通过开口与透明电极电连接。 绝缘层覆盖形成在第一基板上的驱动电路的第一部分。 密封剂插入在第一和第二基板之间以与第一和第二基板接合并覆盖驱动电路的第二部分。 因此，驱动器电路可以正常工作，并且可以防止从驱动器电路输出的信号的失真。

公开(公告)号：US07825468B2

公开(公告)日：2010-11-02

申请号：US12003544

申请日：2007-12-28

Applicant: Yong-Chai Kwon ,  Dong-Ho Lee

Inventor： Yong-Chai Kwon ,  Dong-Ho Lee

IPC: H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L23/04 ,  H01L23/48

CPC classification number: H01L23/3121 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/03

Abstract: A semiconductor package may include a semiconductor pattern, a bonding pad, and a polymer insulation member. The semiconductor pattern may include a semiconductor device and first hole. The bonding pad may include a wiring pattern and plug. The wiring pattern may be formed on an upper face of the semiconductor pattern. The plug may extend from the wiring pattern to fill the first hole. The polymer insulation member may be formed on a lower face of the semiconductor pattern and may include a second hole exposing a lower end of the plug. A method of manufacturing a semiconductor package may include forming a first hole through a semiconductor substrate; forming a bonding pad and plug; attaching a supporting member to the upper face of the substrate; reducing a thickness of the substrate; forming a polymer insulation member on the lower face of the substrate; and cutting the substrate.

Abstract translation: 半导体封装可以包括半导体图案，接合焊盘和聚合物绝缘构件。 半导体图案可以包括半导体器件和第一孔。 接合焊盘可以包括布线​​图案和插头。 布线图案可以形成在半导体图案的上表面上。 插头可以从布线图案延伸以填充第一孔。 聚合物绝缘构件可以形成在半导体图案的下表面上，并且可以包括暴露插头的下端的第二孔。 制造半导体封装的方法可以包括通过半导体衬底形成第一孔; 形成焊盘和插头; 将支撑构件附接到所述基板的上表面; 减小基板的厚度; 在所述基板的下表面上形成聚合物绝缘部件; 并切割基板。

公开(公告)号：US07732328B2

公开(公告)日：2010-06-08

申请号：US11866942

申请日：2007-10-03

Applicant: Yong-Chai Kwon ,  Dong-Ho Lee

Inventor： Yong-Chai Kwon ,  Dong-Ho Lee

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L25/0657 ,  H01L23/481 ,  H01L23/5258 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05569 ,  H01L2224/13008 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A semiconductor package structure and a method of fabricating the same are disclosed. A method of fabricating the semiconductor package structure can be characterized as including forming semiconductor chips on a semiconductor substrate. Each of the semiconductor chips includes chip pads. Through-vias are formed through the semiconductor chips. Redistribution structures and a chip selection interconnection layer are formed on the semiconductor chips, which connect the through-vias with the chip pads. The chip selection interconnection layers are patterned to form chip selection interconnection lines having different structures on at least one of the semiconductor chips. The semiconductor chips are stacked and electrically connected using the through-vias.

Abstract translation: 公开了一种半导体封装结构及其制造方法。 制造半导体封装结构的方法可以表征为包括在半导体衬底上形成半导体芯片。 每个半导体芯片包括芯片焊盘。 通孔通过半导体芯片形成。 重新分配结构和芯片选择互连层形成在将通孔与芯片焊盘连接的半导体芯片上。 芯片选择互连层被图案化以在至少一个半导体芯片上形成具有不同结构的芯片选择互连线。 半导体芯片使用贯通孔堆叠并电连接。