Magnetic flux mitigation in superconducting circuits

    公开(公告)号:US11937518B2

    公开(公告)日:2024-03-19

    申请号:US17749298

    申请日:2022-05-20

    CPC classification number: H10N60/80 H10N60/01

    Abstract: One example includes a superconducting circuit. The circuit superconducting circuitry fabricated on a first surface of a circuit layer. The circuit layer includes a dielectric material. The circuit also includes a metal layer formed on a second surface of the circuit layer opposite the first surface and a through-substrate via (TSV) conductively coupled to the metal layer and extending through the circuit layer to the first surface. The circuit further includes a flux gasket conductively coupled to and extending from the TSV on the first surface proximal to the superconducting circuitry. The flux gasket can be configured to divert magnetic fields away from the superconducting circuitry.

    QUANTUM INFORMATION PROCESSING DEVICE FORMATION

    公开(公告)号:US20240023461A1

    公开(公告)日:2024-01-18

    申请号:US18198192

    申请日:2023-05-16

    Applicant: Google LLC

    CPC classification number: H10N60/0912 G06N10/00 H10N60/01

    Abstract: A method for forming at least part of a quantum information processing device is presented. The method includes providing a first electrically-conductive layer formed of a first electrically-conductive material on a principal surface of a substrate, depositing a layer of dielectric material on the first electrically-conductive material, patterning the layer of dielectric material to form a pad of dielectric material and to reveal a first region of the first electrically-conductive layer, depositing a second electrically-conductive layer on the pad of dielectric material and on the first region of the first electrically-conductive layer, patterning the second electrically-conductive layer and removing the pad of dielectric material using isotropic gas phase etching.

    Methods and systems for atomic layer etching and atomic layer deposition

    公开(公告)号:US11864472B2

    公开(公告)日:2024-01-02

    申请号:US17373619

    申请日:2021-07-12

    CPC classification number: H10N60/01 H10N60/83

    Abstract: A method for etching a surface including obtaining a structure comprising a plurality of nanowires on or above a substrate and a dielectric layer on or above the nanowires, wherein the dielectric layer comprises protrusions formed by the underlying nanowires; reacting a surface of the dielectric layer with a reactant, comprising a gas or a plasma, to form a reactive layer on the dielectric layer, wherein the reactive layer comprises a chemical compound including the reactant and elements of the dielectric layer and the reactive layer comprises sidewalls defined by the protrusions; and selectively etching the reactive layer, wherein the etching etches the protrusions laterally through the sidewalls so as to planarize the surface and remove or shrink the protrusions.

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