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公开(公告)号：US12078693B1
公开(公告)日：2024-09-03
申请号：US18562342
申请日：2023-02-28
发明人： Wei Miao , Shengcai Shi , Jing Li , Zhenhui Lin , Feiming Li , Qianghui Luo
IPC分类号： G01R33/32 , G01R33/035 , H10N60/12 , H10N60/80
CPC分类号： G01R33/0354 , G01R33/323 , H10N60/12 , H10N60/805
摘要： A terahertz graphene Josephson junction detection system based on readout of a microwave resonant circuit includes a graphene Josephson junction detector, a microwave resonant readout circuit, and a microwave network analyzer. The graphene Josephson junction detector and the microwave resonant readout circuit form a microwave resonant circuit. A terahertz signal causes a change of an equivalent microwave inductance of the graphene Josephson junction detector, such that a resonant frequency and a quality factor of the microwave resonant circuit are changed. The present disclosure monitors the resonant frequency and the quality factor of the microwave resonant circuit with the microwave network analyzer, thereby realizing high-sensitivity detection on the terahertz signal. Compared with conventional direct-current (DC)-biased readout, readout of the microwave resonant circuit is not interfered by an external magnetic field, and has a strong interference resistance.
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公开(公告)号：US20240274325A1
公开(公告)日：2024-08-15
申请号：US18107575
申请日：2023-02-09
发明人： Qian Wang , Christopher L. Chua , Yu Wang , Eugene M. Chow
摘要： A microspring includes a film stack having a base disposed on a build plane and a spring member extending from the base. The film stack includes a compressive layer, a substantially stress-free layer, and a tensile layer. The film stack is formed of one or more materials that become superconducting below 140 K. A stress gradient in the film stack causes the spring member to curl away from the build plane of the base.
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公开(公告)号：US20240237556A9
公开(公告)日：2024-07-11
申请号：US18277505
申请日：2022-02-17
申请人： Yale University
CPC分类号： H10N60/805 , G06N10/40 , H10N60/12 , H10N60/85
摘要： Techniques are described to construct an electromagnetic resonator by arranging a resonant structure within a super-conducting cavity. The architecture of the design may provide a low loss superconducting cavity resonator that may exhibit multiple modes. The multimode nature of this resonator is produced in part by the resonant structure in such a way that allows the modes of the resonator to be adjusted through adjustment of the resonant structure rather than by having to alter the physical dimensions of the cavity, as would otherwise be required in a conventional superconducting cavity resonator. In some embodiments, the resonant structure may include a suspended superconductor comprising metal and/or metallized parts.
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公开(公告)号：US12022750B2
公开(公告)日：2024-06-25
申请号：US18159777
申请日：2023-01-26
发明人： Aaron Finck , April Carniol , John Blair
CPC分类号： H10N69/00 , G06N10/00 , H01P3/003 , H10N60/12 , H10N60/805
摘要： Devices and/or computer-implemented methods facilitating static ZZ suppression and Purcell loss reduction using mode-selective coupling in two junction superconducting qubits are provided. In an embodiment, a device can comprise a superconducting bus resonator. The device can further comprise a first superconducting qubit. The device can further comprise a second superconducting qubit, the first superconducting qubit and the second superconducting qubit respectively comprising: a first superconducting pad; a second superconducting pad; a third superconducting pad; a first Josephson Junction coupled to the first superconducting pad and the second superconducting pad; and a second Josephson Junction coupled to the second superconducting pad and the third superconducting pad. The first superconducting pad and the second superconducting pad of the first superconducting qubit and the second superconducting qubit are coupled to the superconducting bus resonator. The superconducting bus resonator entangles the first superconducting qubit and the second superconducting qubit based on receiving a control signal.
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公开(公告)号：US20240206350A1
公开(公告)日：2024-06-20
申请号：US18544605
申请日：2023-12-19
申请人： NEC Corporation
发明人： Tomohiro Yamaji , Yohei Kawakami
CPC分类号： H10N60/805 , H10N60/12 , H10N60/82 , H10N69/00
摘要： A quantum device includes on a wiring pattern of first lines and second lines coupled capacitively and inductively to qubits, respectively, and third lines and fourth lines coupled capacitively and inductively to couplers, respectively. The wiring pattern includes a first pattern of adjacent three lines in which one of the second line and the fourth line is disposed between two lines selected from the first lines and the third lines, and/or a second pattern of adjacent three lines in which two lines selected from the second lines and the fourth lines are disposed on both sides of one of the first line and the third line.
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公开(公告)号：US20240180046A1
公开(公告)日：2024-05-30
申请号：US18431342
申请日：2024-02-02
CPC分类号： H10N60/0884 , G06N10/00 , H10N60/0661 , H10N60/0912 , H10N60/12 , H10N60/805
摘要： The invention includes methods, and the structures formed, for multi-qubit chips. The methods may include annealing a Josephson junction of a qubit to either increase or decrease the frequency of the qubit. The conditions of the anneal may be based on historical conditions, and may be chosen to tune each qubit to a desired frequency.
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公开(公告)号：US11972877B2
公开(公告)日：2024-04-30
申请号：US17186223
申请日：2021-02-26
申请人： HITACHI, LTD.
发明人： Shinji Fujita , Tsuyoshi Wakuda , Yota Ichiki , Motomune Kodama
CPC分类号： H01B12/02 , H01R4/68 , H10N60/202 , H10N60/80
摘要： A superconducting wire connector includes superconducting wires and a sintered body containing MgB2. The superconducting wires are connected by the sintered body. At least one of the superconducting wires includes a superconducting core having a first outer surface. The sintered body is in contact with the first outer surface. A method of connecting superconducting wires by a sintered body containing MgB2 includes exposing a superconducting core of at least one of the superconducting wires by removing a portion, positioned in the middle in a longitudinal direction of the at least one of the superconducting wires, of a metal sheath disposed around the superconducting core, disposing the at least one of the superconducting wires through a container, filling the container with a raw material of MgB2, and forming the sintered body being in contact with an outer surface of the superconducting core by sintering the raw material filled in the container.
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公开(公告)号：US11950516B2
公开(公告)日：2024-04-02
申请号：US17040433
申请日：2019-03-25
CPC分类号： H10N60/83 , B82Y40/00 , H10N60/0912 , H10N60/12 , H10N60/805 , H10N60/85
摘要： The present disclosure relates to a method for manufacturing of specially designed substrates for growth of nanostructures and patterned growth on said nanostructures. The present disclosure further relates to nanostructures, in particular hybrid semiconductor nanostructures with patterned growth of superconducting material for use in quantum devices. The presently disclosed method can be utilized for in-situ manufacturing of quantum devices that have not been contaminated by ex-situ processes.
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公开(公告)号：US20240099161A1
公开(公告)日：2024-03-21
申请号：US18116681
申请日：2023-03-02
发明人： Jaehyeong Lee , Jinhyoun Kang , Jaeho Shin , Daeseok Han
CPC分类号： H10N60/805 , H10N60/0912 , H10N60/12
摘要： A Josephson junction device and a method of manufacturing the Josephson junction device are disclosed. The Josephson junction device includes a substrate having a top surface and a trench recessed below the first surface, wherein sidewalls of the substrate define sidewalls of the trench; a first superconducting electrode formed on the top surface of the substrate with sidewalls further defining the sidewalls of the trench; a tunneling thin film formed over the sidewalls of the substrate and over the sidewalls of the first superconducting electrode; and a second superconducting electrode formed in the trench in contact with the tunneling thin film and with top surface above the top surface of the substrate, wherein a superconducting tunnel junction is formed between the first superconducting electrode and the second superconducting electrode through the tunneling thin film.
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公开(公告)号：US11923628B2
公开(公告)日：2024-03-05
申请号：US17476755
申请日：2021-09-16
申请人： Google LLC
IPC分类号： H01R12/61 , G06N10/40 , G06N10/80 , H01R43/02 , H05K1/02 , H05K1/03 , H05K1/09 , H05K1/14 , H05K3/36 , H10N60/80
CPC分类号： H01R12/61 , H01R43/02 , H05K1/0281 , H05K1/023 , H05K1/09
摘要： Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.
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