公开(公告)号：US11374053B2

公开(公告)日：2022-06-28

申请号：US16761085

申请日：2018-11-06

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  David Robert Heine

IPC: H01L27/15 ,  H01L33/62

Abstract: A method of assembling a display area includes selecting a first tile from a plurality of tiles, each tile of the plurality of tiles includes a predetermined parameter and a plurality of microLEDs defining a plurality of pixels. The selecting the first tile based on a value of the predetermined parameter of the first tile. The method includes selecting a second tile from the plurality of tiles based on a value of the predetermined parameter of the second tile. The method further includes positioning the first tile and the second tile into an array defining at least a portion of the display area. A first edge of the first tile facing a second edge of the second tile. A display device including the display area assembled by the method is also provided.

公开(公告)号：US11282994B2

公开(公告)日：2022-03-22

申请号：US16756692

申请日：2018-10-16

Applicant: CORNING INCORPORATED

Inventor： Jiangwei Feng ,  Sean Matthew Garner ,  Jen-Chieh Lin ,  Robert George Manley ,  Timothy James Orsley ,  Richard Curwood Peterson ,  Michael Lesley Sorensen ,  Pei-Lien Tseng ,  Rajesh Vaddi ,  Lu Zhang

IPC: H01L33/62 ,  H01L27/15

Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

公开(公告)号：US20190259969A1

公开(公告)日：2019-08-22

申请号：US16405224

申请日：2019-05-07

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Gregory Scott Glaesemann ,  James Joseph Price

IPC: H01L51/00 ,  C03C17/34 ,  H01L31/0392 ,  C03C4/00

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

公开(公告)号：US20180249579A1

公开(公告)日：2018-08-30

申请号：US15754144

申请日：2016-08-19

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Samuel Odei Owusu ,  Garrett Andrew Piech ,  Scott Christopher Pollard

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/02 ,  H05K3/40 ,  H05K1/11 ,  C03C23/00 ,  C03C15/00 ,  C03C17/00

CPC classification number: H05K3/0029 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/002 ,  C03C17/008 ,  C03C23/0025 ,  C03C23/007 ,  C03C2217/445 ,  C03C2217/70 ,  H01L21/4807 ,  H01L23/15 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/036 ,  H05K1/115 ,  H05K3/002 ,  H05K3/107 ,  H05K3/388 ,  H05K3/4038 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2203/0143 ,  H05K2203/0743 ,  H05K2203/075 ,  H05K2203/0776 ,  H05K2203/0789 ,  H05K2203/107 ,  H05K2203/1194 ,  H05K2203/1545 ,  Y02P40/57

Abstract: Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.

公开(公告)号：US20170349395A1

公开(公告)日：2017-12-07

申请号：US15667193

申请日：2017-08-02

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Richard Jonathan Kohler ,  Sue Camille Lewis ,  Lynn Bernard Simpson ,  Lili Tian

IPC: B65H69/06 ,  B65H19/18 ,  C03B33/07 ,  C03B33/023 ,  C03B33/02

CPC classification number: B65H69/06 ,  B65H19/18 ,  B65H19/1852 ,  B65H2301/4621 ,  B65H2301/4631 ,  B65H2801/61 ,  B65H2801/87 ,  C03B33/02 ,  C03B33/0235 ,  C03B33/074 ,  Y10T83/0405 ,  Y10T428/18 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/24273

Abstract: Glass web including a first glass-web portion (30), a second portion (40), and a splice joint (50) coupling the first glass-web portion to the second portion, wherein the slice joint includes a splice member (60) with at least one gas-permeable attachment portion. In further examples, methods of splicing a first glass-web portion to a second portion include the step of splicing the first glass-web portion to the second portion with a splice member, wherein the step of splicing includes attaching a gas-permeable attachment portion of the splice member to the first glass-web portion.

公开(公告)号：US09751720B2

公开(公告)日：2017-09-05

申请号：US14437625

申请日：2013-10-22

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Richard Jonathon Kohler ,  Sue Camille Lewis ,  Lynn Bernard Simpson ,  Lili Tian

IPC: B65H69/06 ,  B65H19/18 ,  C03B33/02 ,  C03B33/023 ,  C03B33/07

CPC classification number: B65H69/06 ,  B65H19/18 ,  B65H19/1852 ,  B65H2301/4621 ,  B65H2301/4631 ,  B65H2801/61 ,  B65H2801/87 ,  C03B33/02 ,  C03B33/0235 ,  C03B33/074 ,  Y10T83/0405 ,  Y10T428/18 ,  Y10T428/192

Abstract: Glass web including a first glass-web portion (30), a second portion (40), and a splice joint (50) coupling the first glass-web portion to the second portion, wherein the slice joint includes a splice member (60) with at least one gas-permeable attachment portion. In further examples, methods of splicing a first glass-web portion to a second portion include the step of splicing the first glass-web portion to the second portion with a splice member, wherein the step of splicing includes attaching a gas-permeable attachment portion of the splice member to the first glass-web portion.

公开(公告)号：US20160214889A1

公开(公告)日：2016-07-28

申请号：US15026691

申请日：2014-10-13

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Michael Lesley Sorensen

IPC: C03C21/00 ,  B32B17/06 ,  B32B17/10

CPC classification number: C03C21/002 ,  B32B17/061 ,  B32B17/064 ,  B32B17/10137 ,  C03C3/076 ,  C03C3/078 ,  C03C3/083 ,  C03C3/085 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C3/093 ,  C03C3/095 ,  C03C4/18

Abstract: A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.

Abstract translation: 公开了一种平均厚度等于或小于约0.3mm的薄柔性玻璃基板进行离子交换以化学强化玻璃基板的方法。 化学强化的玻璃基板包括具有第一深度层的第一压缩应力层和具有第二深度层的第二压应力层，第一和第二应力层被拉伸应力层隔开。 还描述了包含化学强化玻璃基板的层压制品。

公开(公告)号：US20160009593A1

公开(公告)日：2016-01-14

申请号：US14770014

申请日：2014-02-24

Applicant: CORNING INCORPORATED

Inventor： Joseph Gerard Brychell ,  Sean Matthew Garner ,  Kurt Edward Gerber ,  Karthik Gopalakrishnan

IPC: C03C17/28 ,  B32B3/08 ,  C03C27/00 ,  B32B17/06

CPC classification number: C03C17/28 ,  B32B3/085 ,  B32B17/06 ,  B32B2457/00 ,  B32B2457/12 ,  B32B2457/206 ,  C03C27/00 ,  E04C2/54

Abstract: A flexible glass structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A stiffening layer is coupled to a surface of the flexible glass substrate. The stiffening layer includes at least one stiffening element extending along the surface of the flexible glass substrate in a running direction having a Young's modulus selected to provide a preferred bending axis of the flexible glass substrate in a direction substantially parallel to the running direction of the stiffening element.

Abstract translation: 柔性玻璃结构包括厚度不大于约0.3mm的柔性玻璃基板。 加强层耦合到柔性玻璃基板的表面。 所述加强层包括至少一个加强元件，所述至少一个加强元件沿柔性玻璃基板的表面在运行方向上延伸，所述运行方向具有杨氏模量，所述弹性模量选择为在柔性玻璃基板的基本上平行于加强件的运行方向的方向上提供优选的弯曲轴线 元件。

公开(公告)号：US20150367607A1

公开(公告)日：2015-12-24

申请号：US14768118

申请日：2014-02-13

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner

IPC: B32B17/06 ,  C03C27/04 ,  C03C17/04

CPC classification number: B32B17/06 ,  C03C17/04 ,  C03C27/044 ,  C03C27/10 ,  C03C2217/91 ,  C03C2218/17 ,  C03C2218/32 ,  Y10T428/24967 ,  Y10T428/266

Abstract: A strengthened layered glass structure includes a first substrate layer comprising a flexible glass sheet having a thickness of less than or equal to 300 μm, a second substrate layer, and a sintered glass frit material layer coupled to a first surface of the first substrate layer and a second surface of the second substrate layer, the sintered glass frit material layer comprising a sintered glass frit coupled to the first and second surfaces providing the flexible glass sheet with a compressive stress of at least about 100 MPa across a thickness of the flexible glass sheet.

Abstract translation: 加强层状玻璃结构包括：第一基板层，其包括厚度小于或等于300μm的柔性玻璃板;第二基板层;以及与第一基板层的第一表面耦合的烧结玻璃料材料层;以及 所述第二基底层的第二表面，所述烧结玻璃料材料层包括连接到所述第一和第二表面的烧结玻璃料，所述烧结玻璃料通过所述柔性玻璃板的厚度提供柔性玻璃板至少约100MPa的压缩应力 。

公开(公告)号：US20250008654A1

公开(公告)日：2025-01-02

申请号：US18710331

申请日：2022-11-08

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Mandakini Kanungo ,  Rajesh Vaddi

IPC: H05K1/11 ,  H05K1/09

Abstract: An electronic apparatus includes a substrate including a first major surface, a second major surface, and an edge surface extending between the major surfaces. A first electrode is attached to the first major surface and a second electrode is attached to the second major surface. A first surface interconnect is electrically connected to the first electrode. A first extension portion extends beyond an edge plane. A second surface interconnect is electrically connected to the second electrode and includes a second extension portion extending beyond the edge plane. An anisotropic conductor defines a current path between the first electrode and the second electrode. The anisotropic conductor is attached to the edge surface and extends between the first extension portion and the second extension portion such that the current path extends along the first major surface, edge surface, and the second major surface. Methods of manufacturing an electronic apparatus are provided.