摘要:
An X-ray and gamma-ray shielding glass, including the following components in weight-%: 10-35% SiO2; 60-70% PbO; 0-8% B2O3; 0-10% Al2O3; 0-10% Na2O; 0-10% K2O; 0-0.3% As2O3; 0-2% Sb2O3; 0-6% BaO; and 0.05-2% ZrO2.
摘要:
A method of forming a scribe line in a strengthened glass substrate includes providing a strengthened glass substrate having a first surface, a second surface, a first edge and a second edge. The first and second surfaces have a strengthened surface layer under a compressive stress, and a central region under tensile stress. The method further includes applying a scoring blade to the first surface at an initiation location that is offset from the first edge by an initiation offset distance greater than a diameter of the scoring blade, and translating the scoring blade or the strengthened glass substrate such that the scoring blade scores the first surface. The translation is terminated such that the scoring blade stops at a termination location that is offset from the second edge of the strengthened glass substrate by a termination offset distance greater than the diameter of the scoring blade.
摘要:
Provided is a method of cutting a glass sheet (G) by performing at least localized heating along a preset cutting line (5) of the glass sheet (G), the method comprising cutting a full body of the glass sheet (G) by performing at least the localized heating along the preset cutting line (5) of the glass sheet (G) under a state in which support members (2 (8)) for supporting, from a back surface side of the glass sheet (G), portions of the glass sheet (G) that are situated apart from the preset cutting line (5) toward both sides thereof are arranged apart from each other so as to form a space (S) on the back surface side of the preset cutting line (8).
摘要:
A method of manufacturing a tempered glass sheet of the present invention includes: subjecting a glass sheet to be tempered having a sheet thickness of 2.0 mm or less to ion exchange treatment; and performing heat treatment at a temperature of 50° C. or more and less than a strain point of the glass sheet to be tempered.
摘要:
Temperable and non-temperable coatings are provided which have similar optical characteristics. The non-temperable coating is placed on glass that is not to be tempered and provides certain optical characteristics. The temperable coating is placed on a glass substrate and the coated substrate is then tempered. After tempering, the coated tempered glass sheet and the coated non-tempered glass sheet have similar optical characteristics. Both coatings have a plurality of metal layers, with at least one of the metallic layers being a discontinuous layer with a primer layer over the discontinuous metal layer. For the non-temperable coating, the discontinuous metal layer has an effective thickness in the range of 1.5 nm to 1.7 nm. For the temperable coating, the discontinuous metal layer has an effective thickness in the range of 1.7 nm to 1.8 nm. The primer layer of the temperable coating is thinner than the primer layer of the non-temperable coating.
摘要:
Temperable and non-temperable coatings are provided which have similar optical characteristics. The non-temperable coating is placed on glass that is not to be tempered and provides certain optical characteristics. The temperable coating is placed on a glass substrate and the coated substrate is then tempered. After tempering, the coated tempered glass sheet and the coated non-tempered glass sheet have similar optical characteristics. Both coatings have a plurality of metal layers, with at least one of the metallic layers being a discontinuous layer with a primer layer over the discontinuous metal layer. For the non-temperable coating, the discontinuous metal layer has an effective thickness in the range of 1.5 nm to 1.7 nm. For the temperable coating, the discontinuous metal layer has an effective thickness in the range of 1.7 nm to 1.8 nm. The primer layer of the temperable coating is thinner than the primer layer of the non-temperable coating.
摘要:
A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.
摘要:
A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.
摘要:
A method for manufacturing tempered-glass panels for electronic devices is provided. The method includes pre-processing an original glass substrate so as to reduce weak portions that are formed in the original glass substrate when the original glass substrate is first tempered and then processed tempering the pre-processed original glass substrate and cutting the tempered pre-processed original glass substrate to produce a number of tempered-glass panels. The method can produce the tempered-glass panels from the original glass substrate, maintaining a certain level of production efficiency.
摘要:
A non-polished glass wafer, a thinning system, and a method for using the non-polished glass wafer to thin a semiconductor wafer are described herein. In one embodiment, the glass wafer has a body (e.g., circular body) including a non-polished first surface and a non-polished second surface substantially parallel to each other. In addition, the circular body has a wafer quality index which is equal to a total thickness variation in micrometers plus one-tenth of a warp in micrometers that is less than 6.0.