公开(公告)号：US20130292444A1

公开(公告)日：2013-11-07

申请号：US13541177

申请日：2012-07-03

申请人： Hyung Sang ROH ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chnag-Ha Lee

发明人： Hyung Sang ROH ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chnag-Ha Lee

IPC分类号： C03B33/02

CPC分类号： C03B33/033 ,  Y02P40/57 ,  Y10T225/321 ,  Y10T225/325 ,  Y10T225/371

摘要： Disclosed herein is a breaking apparatus for glass substrates. The breaking apparatus includes a breaking bar connected to a linear driver, a plurality of linear bushes longitudinally mounted on the breaking bar and each including an outer barrel, a plurality of buffer cylinders longitudinally mounted on the breaking bar, and a breaking tip extending in one direction and having a bar shape with a predetermined width. Each of the buffer cylinders includes a hollow cylinder body generating pressure therein, a piston received in the cylinder body, and a piston rod connected to the piston. The breaking tip is disposed in a longitudinal direction of the breaking bar beneath the breaking bar and connected to the piston rods and the shafts to be brought into contact with a glass substrate.

摘要翻译： 本文公开了一种用于玻璃基板的断裂装置。 破碎装置包括连接到线性驱动器的断开杆，纵向安装在断裂杆上的多个线性衬套，每个包括外筒，纵向安装在破坏杆上的多个缓冲筒，以及在一个 方向并且具有预定宽度的条形。 每个缓冲筒包括产生压力的中空筒体，容纳在缸体中的活塞和连接到活塞的活塞杆。 破碎头沿断裂杆的纵向方向设置在断裂杆下方并连接到活塞杆和与玻璃基板接触的轴。

公开(公告)号：US08084711B2

公开(公告)日：2011-12-27

申请号：US12164148

申请日：2008-06-30

申请人： Hun Sik Lee ,  Chang Ha Lee ,  Hun Sang Jung ,  Hyung Sang Roh ,  Taeho Keem

发明人： Hun Sik Lee ,  Chang Ha Lee ,  Hun Sang Jung ,  Hyung Sang Roh ,  Taeho Keem

IPC分类号： B23K26/00

CPC分类号： C03B33/033 ,  C03B33/0222 ,  C03B33/091 ,  Y02P40/57 ,  Y10T225/325

摘要： Disclosed herein are apparatuses for breaking a glass panel unified with a process table which break the glass panel formed with scribing lines along the scribing lines by irradiating laser beams. The apparatuses for breaking a glass panel unified with a process table to conduct breaking operations of the glass panel after scribing work of the glass panel as one body with the process table are installed on both sides of the process table included in a transfer-type cutting head laser cutting device. Each apparatus for breaking the glass panel unified with the process table comprises: breaking bars for cutting the glass panel by applying pressure to cutting sections of the glass panel; rotating devices for rotating the breaking bars by combining with both ends of the breaking bars; and a support equipped with cylinders for vertically moving the rotating devices in both sections.

摘要翻译： 本文公开了一种用于将通过照射激光束沿划线划分划线的玻璃面板与工艺台一体化的装置。 用于将玻璃面板与工艺台统一的装置安装在包括在转印式切割中的处理台的两侧上，该玻璃面板与工艺台一起进行切割操作以进行玻璃面板的划线工作， 头激光切割装置。 用于破碎与工艺台统一的玻璃面板的每个装置包括：通过向玻璃面板的切割部分施加压力来切割玻璃板的断裂条; 旋转装置，用于通过与断棒的两端结合来旋转断棒; 以及配备有用于在两部分中垂直移动旋转装置的气缸的支撑件。

公开(公告)号：US20090134135A1

公开(公告)日：2009-05-28

申请号：US12164150

申请日：2008-06-30

申请人： Hun Sik Lee ,  Chang Ha Lee ,  Hun Sang Jung ,  Hyung Sang Roh ,  Taeho Keem

发明人： Hun Sik Lee ,  Chang Ha Lee ,  Hun Sang Jung ,  Hyung Sang Roh ,  Taeho Keem

IPC分类号： B23K26/14

CPC分类号： C03B33/091 ,  B65G49/064 ,  B65G49/067 ,  C03B33/027 ,  C03B33/03 ,  C03B33/033 ,  Y02P40/57 ,  Y10T225/325

摘要： Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser oscillation parts fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser oscillation parts fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.

摘要翻译： 公开了使用激光器的玻璃基板切割装置，其中激光切割头移动。 玻璃基板切割装置包括用于激光切割头的两个部分：固定到台架结构的两端的重激光振荡部分，其平行移动位于位于切割台的任一侧上的两个台架台，并且相对较轻的激光照射头水平移动 与龙门架结构平行。 玻璃基板切割装置包括用于将玻璃基板维持在水平状态的切割台; 用于沿着切割台移动龙门架结构的双轴龙门架; 台架结构在双轴台阶的上部之间移动; 激光振荡部分固定在台架结构的各个端部，用于振荡激光; 以及在台架结构的两端水平移动并将激光照射在玻璃基板上的激光照射头。

公开(公告)号：US08766135B2

公开(公告)日：2014-07-01

申请号：US13543497

申请日：2012-07-06

申请人： Hyung-sang Roh ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chang-Ha Lee

发明人： Hyung-sang Roh ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chang-Ha Lee

IPC分类号： C03B33/02 ,  C03B33/03 ,  C03B33/037 ,  B23K26/38 ,  C03B33/10

CPC分类号： C03B33/02 ,  B23K26/38 ,  B65G2249/04 ,  B65G2249/045 ,  C03B33/03 ,  C03B33/033 ,  C03B33/037 ,  C03B33/091 ,  C03B33/102 ,  G01N21/958

摘要： A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.

摘要翻译： 根据本发明的玻璃基板激光切割装置包括：工作台，其具有多个真空吸收槽; 激光切割机 压力传感器，其在真空状态下抽吸玻璃基板时测量压力传感器; 计算处理单元，其将由压力传感器测量的真空压力与预定阈值压力进行比较，并确定玻璃基板是否断裂; 激光切割器，其包括沿着所述玻璃基板的切割方向移动的激光头并发射激光束; 以及光学传感器，其附接到激光头以一起移动并且被布置在发射到外部的激光束的前面的点处，以便检测玻璃基板的断裂。

公开(公告)号：US20130291593A1

公开(公告)日：2013-11-07

申请号：US13543497

申请日：2012-07-06

申请人： Hyung-sang ROH ,  Ja-Yong KOO ,  Sung Cheal KIM ,  Won-Kyu PARK ,  Chang-Ha LEE

发明人： Hyung-sang ROH ,  Ja-Yong KOO ,  Sung Cheal KIM ,  Won-Kyu PARK ,  Chang-Ha LEE

IPC分类号： C03B33/09

CPC分类号： C03B33/02 ,  B23K26/38 ,  B65G2249/04 ,  B65G2249/045 ,  C03B33/03 ,  C03B33/033 ,  C03B33/037 ,  C03B33/091 ,  C03B33/102 ,  G01N21/958

摘要： A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.

摘要翻译： 根据本发明的玻璃基板激光切割装置包括：工作台，其具有多个真空吸收槽; 激光切割机 压力传感器，其在真空状态下抽吸玻璃基板时测量压力传感器; 计算处理单元，其将由所述压力传感器测量的真空压力与预定阈值压力进行比较，并确定所述玻璃基板是否断裂; 激光切割器，其包括沿着所述玻璃基板的切割方向移动的激光头并发射激光束; 以及光学传感器，其附接到激光头以一起移动并且被布置在发射到外部的激光束的前面的点处，以便检测玻璃基板的断裂。

公开(公告)号：US20090188960A1

公开(公告)日：2009-07-30

申请号：US12164148

申请日：2008-06-30

申请人： Hun Sik Lee ,  Chang Ha Lee ,  Hun Sang Jung ,  Hyung Sang Roh ,  Taeho Keem

发明人： Hun Sik Lee ,  Chang Ha Lee ,  Hun Sang Jung ,  Hyung Sang Roh ,  Taeho Keem

IPC分类号： B28D5/00

CPC分类号： C03B33/033 ,  C03B33/0222 ,  C03B33/091 ,  Y02P40/57 ,  Y10T225/325

摘要： Disclosed herein are apparatuses for breaking a glass panel unified with a process table which break the glass panel formed with scribing lines along the scribing lines by irradiating laser beams. The apparatuses for breaking a glass panel unified with a process table to conduct breaking operations of the glass panel after scribing work of the glass panel as one body with the process table are installed on both sides of the process table included in a transfer-type cutting head laser cutting device. Each apparatus for breaking the glass panel unified with the process table comprises: breaking bars for cutting the glass panel by applying pressure to cutting sections of the glass panel; rotating devices for rotating the breaking bars by combining with both ends of the breaking bars; and a support equipped with cylinders for vertically moving the rotating devices in both sections.

摘要翻译： 本文公开了一种用于将通过照射激光束沿划线划分划线的玻璃面板与工艺台一体化的装置。 用于将玻璃面板与工艺台统一的装置安装在包括在转印式切割中的处理台的两侧上，该玻璃面板与工艺台一起进行切割操作以进行玻璃面板的划线工作， 头激光切割装置。 用于破碎与工艺台统一的玻璃面板的每个装置包括：通过向玻璃面板的切割部分施加压力来切割玻璃板的断裂条; 旋转装置，用于通过与断棒的两端结合来旋转断棒; 以及配备有用于在两部分中垂直移动旋转装置的气缸的支撑件。

公开(公告)号：US08944304B2

公开(公告)日：2015-02-03

申请号：US13541177

申请日：2012-07-03

申请人： Hyung-sang Roh ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chang-Ha Lee

发明人： Hyung-sang Roh ,  Ja-Yong Koo ,  Sung Cheal Kim ,  Won-Kyu Park ,  Chang-Ha Lee

IPC分类号： C03B33/00

CPC分类号： C03B33/033 ,  Y02P40/57 ,  Y10T225/321 ,  Y10T225/325 ,  Y10T225/371

摘要： Disclosed herein is a breaking apparatus for glass substrates. The breaking apparatus includes a breaking bar connected to a linear driver, a plurality of linear bushes longitudinally mounted on the breaking bar and each including an outer barrel, a plurality of buffer cylinders longitudinally mounted on the breaking bar, and a breaking tip extending in one direction and having a bar shape with a predetermined width. Each of the buffer cylinders includes a hollow cylinder body generating pressure therein, a piston received in the cylinder body, and a piston rod connected to the piston. The breaking tip is disposed in a longitudinal direction of the breaking bar beneath the breaking bar and connected to the piston rods and the shafts to be brought into contact with a glass substrate.

摘要翻译： 本文公开了一种用于玻璃基板的断裂装置。 破碎装置包括连接到线性驱动器的断开杆，纵向安装在断裂杆上的多个线性衬套，每个包括外筒，纵向安装在破坏杆上的多个缓冲筒，以及一个在一个 方向并且具有预定宽度的条形。 每个缓冲筒包括产生压力的中空筒体，容纳在缸体中的活塞和连接到活塞的活塞杆。 破碎头沿断裂杆的纵向方向设置在断裂杆下方并连接到活塞杆和与玻璃基板接触的轴。

公开(公告)号：US08110776B2

公开(公告)日：2012-02-07

申请号：US12164150

申请日：2008-06-30

申请人： Hun Sang Jung ,  Hyung Sang Roh ,  Taeho Keem ,  Hun Sik Lee ,  Chang Ha Lee

发明人： Hun Sang Jung ,  Hyung Sang Roh ,  Taeho Keem ,  Hun Sik Lee ,  Chang Ha Lee

IPC分类号： C03B33/02 ,  C03B33/10

CPC分类号： C03B33/091 ,  B65G49/064 ,  B65G49/067 ,  C03B33/027 ,  C03B33/03 ,  C03B33/033 ,  Y02P40/57 ,  Y10T225/325

摘要： Glass substrate cutting apparatuses using lasers are disclosed, where a laser cutting head is moved. A glass substrate cutting apparatus includes two parts for a laser cutting head: heavy laser beam generators fixed to respective ends of a gantry structure moving in parallel along two gantry stages located on either side of a cutting table, and relatively lightweight laser irradiation heads moving horizontally in parallel with the gantry structure. The glass substrate cutting apparatus includes a cutting table for maintaining a glass substrate in a horizontal state; biaxial gantry stages for moving a gantry structure along the cutting table; the gantry structure moving in between an upper part of the biaxial gantry stages; laser beam generators fixed to respective ends of the gantry structure for oscillating the laser; and laser irradiation heads that move horizontally on respective ends of the gantry structure and irradiate the laser upon the glass substrate.

摘要翻译： 公开了使用激光器的玻璃基板切割装置，其中激光切割头移动。 玻璃基板切割装置包括用于激光切割头的两个部分：固定到台架结构的相应末端的重激光束发生器，其平行移动，位于位于切割台的任一侧的两个台架台，以及相对较轻的激光照射头水平移动 与龙门架结构平行。 玻璃基板切割装置包括用于将玻璃基板维持在水平状态的切割台; 用于沿着切割台移动龙门架结构的双轴龙门架; 台架结构在双轴台阶的上部之间移动; 激光束发生器固定到台架结构的相应末端以振荡激光; 以及在台架结构的两端水平移动并将激光照射在玻璃基板上的激光照射头。