Optical fiber cutter
    3.
    发明授权
    Optical fiber cutter 有权
    光纤切割机

    公开(公告)号:US09395492B2

    公开(公告)日:2016-07-19

    申请号:US14004949

    申请日:2012-03-15

    IPC分类号: B26D7/26 B26D3/08 G02B6/25

    摘要: A slider is attached to a cutter main body of an optical fiber cutter in a forward/backward movable state. A round blade member for making a scratch in an optical fiber is attached to the slider in a rotatable state. An operation lever pin for changing over rotation operation modes from one to another is attached to one end side of a pin member which penetrates a wall of the cutter main body. The rotation operation modes include a non-rotation mode for preventing the round blade member from being rotated and a continuous rotation mode for rotating the round blade member by a predetermined angle with every backward movement of the slider.

    摘要翻译: 滑块以向前/向后移动状态附接到光纤切割器的切割器主体。 用于在光纤中划伤的圆形刀片构件以可旋转状态附接到滑块。 用于将旋转操作模式从一个转换到另一个的操作杆销安装在穿过刀具主体的壁的销构件的一端侧。 旋转操作模式包括用于防止圆形刀片构件旋转的非旋转模式以及用于使滑动件每次向后移动使圆形刀片构件旋转预定角度的连续旋转模式。

    Glass-plate working method and glass-plate working apparatus
    4.
    发明授权
    Glass-plate working method and glass-plate working apparatus 有权
    玻璃板加工方法和玻璃板加工装置

    公开(公告)号:US09283690B2

    公开(公告)日:2016-03-15

    申请号:US13058397

    申请日:2009-06-03

    申请人: Kazuaki Bando

    发明人: Kazuaki Bando

    摘要: A glass-plate working apparatus includes a glass-plate supporting portion 20a of a feed conveyor 7, a glass-plate supporting portion 20b of a cutting section 2, a glass-plate supporting portion 20c of a bend-breaking section 4, a glass-plate supporting portion 20d of a grinding section 3, and a glass-plate supporting portion 20e of a discharge conveyor 8; a cutting head 9, a bend-breaking device 66, and a grinding head 10 for processing glass plates 5 which are respectively supported by the supporting portions 20b, 20c, and 20d; and a transporting device 89 for transporting the glass plate 5 on the supporting portion 20a onto the supporting portion 20b, the glass plate 5 on the supporting portion 20b onto the supporting portion 20c, the glass plate 5 on the supporting portion 20c onto the supporting portion 20d, and the glass plate 5 on the supporting portion 20d onto the supporting portion 20e, respectively. The transporting device 89 is adapted to repeat reciprocating movement so as to sequentially transfer the glass plate 5 onto each of the supporting portions 20a, 20b, 20c, 20d, and 20e each time the processing operation by processing means is completed.

    摘要翻译: 玻璃板加工装置包括进料输送机7的玻璃板支撑部分20a,切割部分2的玻璃板支撑部分20b,折弯部分4的玻璃板支撑部分20c,玻璃板 研磨部3的板支撑部20d和排出输送机8的玻璃板支撑部20e; 切割头9,折弯装置66和用于加工玻璃板5的研磨头10,它们分别由支撑部分20b,20c和20d支撑; 以及用于将支撑部分20a上的玻璃板5输送到支撑部分20b上的运送装置89,支撑部分20b上的玻璃板5支撑在支撑部分20c上,将支撑部分20c上的玻璃板5支撑到支撑部分 20d和支撑部分20d上的玻璃板5分别支撑在支撑部分20e上。 传送装置89适于重复往复运动,以便每当处理装置的处理操作完成时,将玻璃板5依次传送到每个支撑部分20a,20b,20c,20d和20e上。

    Breaking apparatus for glass substrate
    5.
    发明授权
    Breaking apparatus for glass substrate 有权
    玻璃基板破碎装置

    公开(公告)号:US08944304B2

    公开(公告)日:2015-02-03

    申请号:US13541177

    申请日:2012-07-03

    IPC分类号: C03B33/00

    摘要: Disclosed herein is a breaking apparatus for glass substrates. The breaking apparatus includes a breaking bar connected to a linear driver, a plurality of linear bushes longitudinally mounted on the breaking bar and each including an outer barrel, a plurality of buffer cylinders longitudinally mounted on the breaking bar, and a breaking tip extending in one direction and having a bar shape with a predetermined width. Each of the buffer cylinders includes a hollow cylinder body generating pressure therein, a piston received in the cylinder body, and a piston rod connected to the piston. The breaking tip is disposed in a longitudinal direction of the breaking bar beneath the breaking bar and connected to the piston rods and the shafts to be brought into contact with a glass substrate.

    摘要翻译: 本文公开了一种用于玻璃基板的断裂装置。 破碎装置包括连接到线性驱动器的断开杆,纵向安装在断裂杆上的多个线性衬套,每个包括外筒,纵向安装在破坏杆上的多个缓冲筒,以及一个在一个 方向并且具有预定宽度的条形。 每个缓冲筒包括产生压力的中空筒体,容纳在缸体中的活塞和连接到活塞的活塞杆。 破碎头沿断裂杆的纵向方向设置在断裂杆下方并连接到活塞杆和与玻璃基板接触的轴。

    Method for cutting glass sheet
    6.
    发明授权
    Method for cutting glass sheet 有权
    切割玻璃板的方法

    公开(公告)号:US08910845B2

    公开(公告)日:2014-12-16

    申请号:US13580152

    申请日:2011-05-24

    申请人: Takayoshi Saitoh

    发明人: Takayoshi Saitoh

    IPC分类号: B26F3/00

    摘要: Provided is a method for cutting a glass sheet whereby even a thin glass sheet having a thickness of 1 mm or less can be suitably cut. A nick (20a) is formed on a section of a planned cutting line (L) of a glass sheet (20). The glass sheet (20) is placed on a surface (10a) of a jig (10) in which an uneven portion (10b) having a shape corresponding to the planned cutting line (L) is formed. The glass sheet (20) is cut by deforming a portion thereof located above the uneven portion (10b) and developing a crack originating from the nick (20a).

    摘要翻译: 提供一种用于切割玻璃板的方法,由此即使能够适当地切割厚度为1mm以下的薄玻璃板。 在玻璃板(20)的规划切割线(L)的一部分上形成有切口(20a)。 将玻璃板(20)放置在具有与规划切割线(L)对应的形状的凹凸部(10b)的夹具(10)的表面(10a)上。 玻璃板(20)通过使其位于不平坦部分(10b)上方的部分变形并且形成来自切口(20a)的裂纹来切割。

    Wafer dicing press and method and semiconductor wafer dicing system including the same
    7.
    发明授权
    Wafer dicing press and method and semiconductor wafer dicing system including the same 有权
    晶片切割机及其制造方法及半导体晶圆切片系统

    公开(公告)号:US08870047B2

    公开(公告)日:2014-10-28

    申请号:US13336218

    申请日:2011-12-23

    申请人: Won-chul Lim

    发明人: Won-chul Lim

    摘要: In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.

    摘要翻译: 在晶片切割机中,为了降低晶片切割的时间和成本,并且对整个晶片均匀地施加切割压力,晶片切割机包括支撑晶片的第一侧的支撑单元; 以及加压装置,通过将压力分散到晶片的第二面上,使得晶片的激光划线层作为分割起点施加压力。 因此,晶片切割机减少了将晶片分成半导体器件的激光辐射和压力施加时间。 在不增加损坏晶片的可能性的情况下实现提高的效率。