发明申请
US20120302063A1 NON-POLISHED GLASS WAFER, THINNING SYSTEM AND METHOD FOR USING THE NON-POLISHED GLASS WAFER TO THIN A SEMICONDUCTOR WAFER
有权
非抛光玻璃滚筒，薄膜系统和使用非抛光玻璃波形以减少半导体波长的方法
- 专利标题： NON-POLISHED GLASS WAFER, THINNING SYSTEM AND METHOD FOR USING THE NON-POLISHED GLASS WAFER TO THIN A SEMICONDUCTOR WAFER
- 专利标题（中）： 非抛光玻璃滚筒，薄膜系统和使用非抛光玻璃波形以减少半导体波长的方法
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申请号： US13474137申请日： 2012-05-17
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公开(公告)号： US20120302063A1公开(公告)日： 2012-11-29
- 发明人: Shawn Rachelle Markham , Windsor Pipes Thomas, III
- 申请人： Shawn Rachelle Markham , Windsor Pipes Thomas, III
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B32B3/26 ; H01L21/306 ; C03B17/06 ; B44C1/22 ; B24B7/00 ; B32B17/00
摘要：
A non-polished glass wafer, a thinning system, and a method for using the non-polished glass wafer to thin a semiconductor wafer are described herein. In one embodiment, the glass wafer has a body (e.g., circular body) including a non-polished first surface and a non-polished second surface substantially parallel to each other. In addition, the circular body has a wafer quality index which is equal to a total thickness variation in micrometers plus one-tenth of a warp in micrometers that is less than 6.0.
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