公开(公告)号：US10829412B2

公开(公告)日：2020-11-10

申请号：US16446944

申请日：2019-06-20

Applicant: CORNING INCORPORATED

Inventor： Oladapo Olalekan Bello ,  Donald Arthur Clark ,  Gregory Scott Glaesemann ,  Pascale Oram ,  Charles Donahue Rizzolo

IPC: B32B7/02 ,  C03C21/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00

Abstract: Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm2. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 μm to about 150 μm. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/m2 providing for a flat fragmentation factor of less than or equal to 5.

公开(公告)号：US09488857B2

公开(公告)日：2016-11-08

申请号：US14591456

申请日：2015-01-07

Applicant: Corning Incorporated

Inventor： Kody Luce Bornstein ,  Donald Arthur Clark ,  Gregory Scott Glaesemann ,  Gregory William Keyes ,  Jennifer Lynn Lyon ,  Richard Curwood Peterson ,  Shyamala Shanmugam ,  Christopher Clark Thompson ,  Krishna Hemanth Vepakomma ,  Kathleen Ann Wexell

IPC: G02F1/1333 ,  C03C15/00 ,  C03C17/32 ,  C03C27/10

CPC classification number: G02F1/133308 ,  C03C15/00 ,  C03C17/32 ,  C03C27/10 ,  C03C2218/118 ,  C03C2218/34 ,  G02F1/1333 ,  G02F2001/133302 ,  G02F2001/133325 ,  G02F2001/133331

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Abstract translation: 公开了一种加强玻璃基板的边缘表面，特别是包含在显示面板内的玻璃基板的方法。 这些方法包括将显示面板的边缘暴露于酸溶液一段时间，并且有效地从边缘表面除去不超过约20微米的玻璃的温度，从边缘冲洗酸溶液并施加经冲洗的聚合物保护涂层 边缘以保持边缘表面的后蚀刻强度。 可能暴露于酸溶液的显示面板上的电子元件在蚀刻之前用终端掩模掩蔽。 边缘蚀刻可以与显示面板/覆盖玻璃基板的表面的蚀刻结合。

公开(公告)号：US20150198838A1

公开(公告)日：2015-07-16

申请号：US14591456

申请日：2015-01-07

Applicant: Corning Incorporated

Inventor： Kody Luce Bornstein ,  Donald Arthur Clark ,  Gregory Scott Glaesemann ,  Gregory William Keyes ,  Jennifer Lynn Lyon ,  Richard Curwood Peterson ,  Shyamala Shanmugam ,  Christopher Clark Thompson ,  Krishna Hemanth Vepakomma ,  Kathleen Ann Wexell

IPC: G02F1/1333 ,  C03C27/10 ,  C03C17/32 ,  C03C15/00

CPC classification number: G02F1/133308 ,  C03C15/00 ,  C03C17/32 ,  C03C27/10 ,  C03C2218/118 ,  C03C2218/34 ,  G02F1/1333 ,  G02F2001/133302 ,  G02F2001/133325 ,  G02F2001/133331

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Abstract translation: 公开了一种加强玻璃基板的边缘表面，特别是包含在显示面板内的玻璃基板的方法。 这些方法包括将显示面板的边缘暴露于酸溶液一段时间，并且有效地从边缘表面除去不超过约20微米的玻璃的温度，从边缘冲洗酸溶液并施加经冲洗的聚合物保护涂层 边缘以保持边缘表面的后蚀刻强度。 可能暴露于酸溶液的显示面板上的电子元件在蚀刻之前用终端掩模掩蔽。 边缘蚀刻可以与显示面板/覆盖玻璃基板的表面的蚀刻结合。

公开(公告)号：US20160351837A1

公开(公告)日：2016-12-01

申请号：US15232401

申请日：2016-08-09

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Gregory Scott Glaesemann ,  James Joseph Price

IPC: H01L51/00 ,  C03C4/00 ,  C03C17/34

CPC classification number: H01L51/0097 ,  C03C4/00 ,  C03C17/34 ,  H01L31/03926 ,  H01L2251/5338 ,  Y02E10/549

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

Abstract translation: 公开了一种柔性基底，其包括无定形无机组合物，其中所述基底具有小于约250μm的厚度，并且具有以下至少一种：a）脆性比小于约9.5（μm）-1/2，或b） 断裂韧性至少约为0.75MPa·（m）1/2。 还公开了包括这种柔性装置的电子设备。 还公开了一种制造柔性基材的方法，包括选择能够形成厚度小于约250μm的基材的无定形无机材料，并具有以下中的至少一种：a）小于约9.5（μm）的脆性比， -1/2，或b）断裂韧性为至少约0.75MPa·（m）1/2; 然后从所选择的无机材料形成衬底。

公开(公告)号：US20190259969A1

公开(公告)日：2019-08-22

申请号：US16405224

申请日：2019-05-07

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Gregory Scott Glaesemann ,  James Joseph Price

IPC: H01L51/00 ,  C03C17/34 ,  H01L31/0392 ,  C03C4/00

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

公开(公告)号：US10312462B2

公开(公告)日：2019-06-04

申请号：US15840888

申请日：2017-12-13

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Gregory Scott Glaesemann ,  James Joseph Price

IPC: C03C17/34 ,  H01L51/00 ,  C03C4/00 ,  H01L31/0392

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.

公开(公告)号：US20180102490A1

公开(公告)日：2018-04-12

申请号：US15840888

申请日：2017-12-13

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Gregory Scott Glaesemann ,  James Joseph Price

IPC: H01L51/00 ,  H01L31/0392 ,  C03C4/00 ,  C03C17/34

CPC classification number: H01L51/0097 ,  C03C4/00 ,  C03C17/34 ,  H01L31/03926 ,  H01L2251/5338 ,  Y02E10/549

Abstract: A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa.(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa.(m)1/2; and then forming a substrate from the selected inorganic material.

公开(公告)号：US20140342897A1

公开(公告)日：2014-11-20

申请号：US14448143

申请日：2014-07-31

Applicant: Corning Incorporated

Inventor： Jaymin Amin ,  Adam James Ellison ,  Gregory Scott Glaesemann ,  Timothy Michael Gross

IPC: C03C3/091

CPC classification number: C03C3/091 ,  C03C3/093 ,  G06F3/044 ,  G06F2203/04103

Abstract: The present disclosure relates to glass articles for use as a touchscreen substrate for use in a portable electronic device, particularly comprising an alkali-free aluminosilicate glass exhibiting a high damage threshold of at least 1000 gf, as measured by the lack of the presence of median/radial cracks when a load is applied to the glass using a Vickers indenter, a scratch resistance of at least 900 gf, as measured by the lack of the presence of lateral cracks when a load is applied by a moving Knoop indenter and a linear coefficient of thermal expansion (CTE) over the temperature range 0-300° C. which satisfies the relationship: 25×10-7/° C.≦CTE≦40×10-7/° C.

Abstract translation: 本公开涉及用作便携式电子设备中使用的触摸屏基板的玻璃制品，特别是包含不含中等值的中等含量的不含碱金属的硅铝酸盐玻璃，其表现出高至少1000gf的高损伤阈值 /使用维氏压头施加到玻璃上的负载时的径向裂纹，当通过运动的Knoop压头施加负载并且线性系数施加负载时，通过不存在横向裂纹测量的至少900gf的耐刮擦性 的热膨胀（CTE）在0-300℃的温度范围内，满足关系：25×10-7 /℃和nlE; CTE＆nlE; 40×10-7 /℃

公开(公告)号：US11425826B2

公开(公告)日：2022-08-23

申请号：US16630206

申请日：2018-07-05

Applicant: CORNING INCORPORATED

Inventor： Douglas Edward Brackley ,  Alexander Lee Cuno ,  Scott Winfield Deming ,  Sean Matthew Garner ,  Gregory Scott Glaesemann ,  Garrett Andrew Piech

IPC: H05K5/00 ,  G02F1/1333 ,  H01L23/544 ,  H01L25/075

Abstract: A tiled display having pixels arranged in rows and columns, and including first and second tiles. The tiles comprise a substrate carrying a matrix of pixels arranged at a pixel pitch. The substrates comprise an edge extending between opposing faces in a depth direction. The substrate edges have a complementary shape, and face one another to establish a seam. The pixel pitch is maintained across the seam. Pixels of the second tile are not interposed between pixels of the first tile. The complementary shape includes a segment of the seam being oblique to the pixel rows, or the substrate edge of the first tile profiled in the depth direction whereby at least a section of the edge is non-perpendicular to the faces. The tiled display can maintain the pixel pitch at the seams at high resolutions (e.g., pixel pitch less than 0.5 mm).

公开(公告)号：US20200163233A1

公开(公告)日：2020-05-21

申请号：US16630206

申请日：2018-07-05

Applicant: CORNING INCORPORATED

Inventor： Douglas Edward Brackley ,  Alexander Lee Cuno ,  Scott Winfield Deming ,  Sean Matthew Garner ,  Gregory Scott Glaesemann ,  Garrett Andrew Piech

IPC: H05K5/00 ,  H01L25/075 ,  H01L23/544 ,  G02F1/1333

Abstract: A tiled display having pixels arranged in rows and columns, and including first and second tiles. The tiles comprise a substrate carrying a matrix of pixels arranged at a pixel pitch. The substrates comprise an edge extending between opposing faces in a depth direction. The substrate edges have a complementary shape, and face one another to establish a seam. The pixel pitch is maintained across the seam. Pixels of the second tile are not interposed between pixels of the first tile. The complementary shape includes a segment of the seam being oblique to the pixel rows, or the substrate edge of the first tile profiled in the depth direction whereby at least a section of the edge is non-perpendicular to the faces. The tiled display can maintain the pixel pitch at the seams at high resolutions (e.g., pixel pitch less than 0.5 mm).