公开(公告)号：US20240393527A1

公开(公告)日：2024-11-28

申请号：US18662275

申请日：2024-05-13

Applicant: CORNING INCORPORATED

Inventor： Donald Arthur Clark ,  Matthew Ryan Drake ,  Yunfeng Gu ,  Ming-Jun Li ,  Joseph Edward McCarthy ,  Weijun Niu

IPC: G02B6/02

Abstract: An optical fiber includes a glass core, a glass cladding surrounding and in direct contact with the glass core, and a coating surrounding and in direct contact with the glass cladding. The coating includes three layers, a first high-modulus coating layer having a Young's modulus greater than 500 MPa, a second high-modulus coating layer having a Young's modulus greater than 500 MPa, and a low-modulus coating layer having a Young's modulus between about 0.20 MPa and 5 MPa. The coating may have the first high-modulus coating layer as the inner layer, the low-modulus coating layer as the intermediate layer, and the second high-modulus coating layer as the outer layer. Alternatively, the coating may have the low-modulus coating layer as the inner layer, first high-modulus coating layer as the intermediate layer, and the second high-modulus coating layer as the outer layer.

公开(公告)号：US20200017407A1

公开(公告)日：2020-01-16

申请号：US16446944

申请日：2019-06-20

Applicant: CORNING INCORPORATED

Inventor： Oladapo Olalekan Bello ,  Donald Arthur Clark ,  Gregory Scott Glaesemann ,  Pascale Oram ,  Charles Donahue Rizzolo

IPC: C03C21/00 ,  H01L21/683 ,  H01L21/56

Abstract: Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm2. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 μm to about 150 μm. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/m2 providing for a flat fragmentation factor of less than or equal to 5.

公开(公告)号：US20160190185A1

公开(公告)日：2016-06-30

申请号：US15061635

申请日：2016-03-04

Applicant: Corning Incorporated

Inventor： Jeanne Spadinger Cavuoti ,  Donald Arthur Clark ,  Sean Matthew Garner ,  Gregory Scott Glaesemann ,  Jun Hou ,  Jum Sik Kim ,  Toshihiko Ono ,  Daniel Arthur Sternquist

IPC: H01L27/12 ,  C03C15/02 ,  H01L21/02

CPC classification number: C03C15/02 ,  G02F1/1333 ,  H01L21/02019 ,  H01L27/1262 ,  H01L33/58 ,  Y10T428/1095

Abstract: Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na2O, K2O and Li2O.

公开(公告)号：US10829412B2

公开(公告)日：2020-11-10

申请号：US16446944

申请日：2019-06-20

Applicant: CORNING INCORPORATED

Inventor： Oladapo Olalekan Bello ,  Donald Arthur Clark ,  Gregory Scott Glaesemann ,  Pascale Oram ,  Charles Donahue Rizzolo

IPC: B32B7/02 ,  C03C21/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00

Abstract: Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm2. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 μm to about 150 μm. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/m2 providing for a flat fragmentation factor of less than or equal to 5.

公开(公告)号：US09488857B2

公开(公告)日：2016-11-08

申请号：US14591456

申请日：2015-01-07

Applicant: Corning Incorporated

Inventor： Kody Luce Bornstein ,  Donald Arthur Clark ,  Gregory Scott Glaesemann ,  Gregory William Keyes ,  Jennifer Lynn Lyon ,  Richard Curwood Peterson ,  Shyamala Shanmugam ,  Christopher Clark Thompson ,  Krishna Hemanth Vepakomma ,  Kathleen Ann Wexell

IPC: G02F1/1333 ,  C03C15/00 ,  C03C17/32 ,  C03C27/10

CPC classification number: G02F1/133308 ,  C03C15/00 ,  C03C17/32 ,  C03C27/10 ,  C03C2218/118 ,  C03C2218/34 ,  G02F1/1333 ,  G02F2001/133302 ,  G02F2001/133325 ,  G02F2001/133331

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Abstract translation: 公开了一种加强玻璃基板的边缘表面，特别是包含在显示面板内的玻璃基板的方法。 这些方法包括将显示面板的边缘暴露于酸溶液一段时间，并且有效地从边缘表面除去不超过约20微米的玻璃的温度，从边缘冲洗酸溶液并施加经冲洗的聚合物保护涂层 边缘以保持边缘表面的后蚀刻强度。 可能暴露于酸溶液的显示面板上的电子元件在蚀刻之前用终端掩模掩蔽。 边缘蚀刻可以与显示面板/覆盖玻璃基板的表面的蚀刻结合。

公开(公告)号：US20150198838A1

公开(公告)日：2015-07-16

申请号：US14591456

申请日：2015-01-07

Applicant: Corning Incorporated

Inventor： Kody Luce Bornstein ,  Donald Arthur Clark ,  Gregory Scott Glaesemann ,  Gregory William Keyes ,  Jennifer Lynn Lyon ,  Richard Curwood Peterson ,  Shyamala Shanmugam ,  Christopher Clark Thompson ,  Krishna Hemanth Vepakomma ,  Kathleen Ann Wexell

IPC: G02F1/1333 ,  C03C27/10 ,  C03C17/32 ,  C03C15/00

CPC classification number: G02F1/133308 ,  C03C15/00 ,  C03C17/32 ,  C03C27/10 ,  C03C2218/118 ,  C03C2218/34 ,  G02F1/1333 ,  G02F2001/133302 ,  G02F2001/133325 ,  G02F2001/133331

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Abstract translation: 公开了一种加强玻璃基板的边缘表面，特别是包含在显示面板内的玻璃基板的方法。 这些方法包括将显示面板的边缘暴露于酸溶液一段时间，并且有效地从边缘表面除去不超过约20微米的玻璃的温度，从边缘冲洗酸溶液并施加经冲洗的聚合物保护涂层 边缘以保持边缘表面的后蚀刻强度。 可能暴露于酸溶液的显示面板上的电子元件在蚀刻之前用终端掩模掩蔽。 边缘蚀刻可以与显示面板/覆盖玻璃基板的表面的蚀刻结合。

公开(公告)号：US20150110990A1

公开(公告)日：2015-04-23

申请号：US14516685

申请日：2014-10-17

Applicant: CORNING INCORPORATED

Inventor： Hsin-Chieh Chou ,  Donald Arthur Clark ,  Sinue Gomez ,  Kimberly Michelle Keegan ,  Arthur Winston Martin ,  James Robert Matthews ,  Prakash Chandra Panda ,  Paul John Shustack ,  Lu Zhang

IPC: C03C17/00 ,  B05D3/10 ,  B05D3/06

CPC classification number: C03C17/007 ,  B05D3/067 ,  B05D3/104 ,  C03C17/009 ,  C03C2217/445 ,  C03C2217/465 ,  C03C2217/478 ,  C03C2217/70 ,  C03C2217/78 ,  Y10T428/23 ,  Y10T428/239 ,  Y10T428/24777 ,  Y10T428/259 ,  Y10T428/264 ,  Y10T428/31525 ,  Y10T428/31601

Abstract: Methods and apparatus are provide for: a glass substrate having first and second opposing surfaces, and a plurality of edge surfaces extending transversely between the first and second opposing surfaces; a layer disposed on, and adhered to, at least one of the first, second, and edge surfaces of the substrate, where the layer includes: (i) one of an oligomer and resin; (ii) a monomer; and (iii) nanometer-sized silica particles of at least about 2-50 weight percent.

Abstract translation: 提供的方法和装置包括：具有第一和第二相对表面的玻璃基板和在第一和第二相对表面之间横向延伸的多个边缘表面; 该层设置在该衬底的至少一个第一，第二和第二表面和边缘表面上并附着于其上，该层包括：（i）低聚物和树脂之一; （ii）单体; 和（iii）至少约2-50重量％的纳米尺寸二氧化硅颗粒。