Solvent for reducing resist consumption and method using solvent for reducing resist consumption
    6.
    发明授权
    Solvent for reducing resist consumption and method using solvent for reducing resist consumption 有权
    降低抗蚀剂消耗的溶剂和使用溶剂降低抗蚀剂消耗的方法

    公开(公告)号:US09482957B1

    公开(公告)日:2016-11-01

    申请号:US14738946

    申请日:2015-06-15

    申请人: I-Shan Ke

    发明人: Yu-Hsun Lin

    摘要: The present disclosure provides a solvent for reducing resist consumption, which includes a first solvent selected from the group consisting of alkylene glycol alkyl ether acetate, alkylene glycol alkyl ether and a combination thereof, and a second solvent having a hydrogen bonding Hansen parameter lower than 5.34 and an evaporation rate (n-BuAc=1) lower than 0.6. A volume ratio of the first solvent to the second solvent is in a range of 0/100 to 90/10. A resist dispense volume for a 300 mm wafer is less than 0.6 cc, or a resist dispense volume for a 450 mm wafer is less than 1.1 cc.

    摘要翻译: 本公开内容提供了用于降低抗蚀剂消耗的溶剂,其包括选自亚烷基二醇烷基醚乙酸酯,亚烷基二醇烷基醚及其组合的第一溶剂和具有低于5.34的氢键Hansen参数的第二溶剂 和蒸发速率(n-BuAc = 1)低于0.6。 第一溶剂与第二溶剂的体积比在0/100〜90/10的范围内。 用于300mm晶片的抗蚀剂分配体积小于0.6cc,或者450mm晶片的抗蚀剂分配体积小于1.1cc。

    COATING APPARATUS AND COATING METHOD
    10.
    发明申请
    COATING APPARATUS AND COATING METHOD 审中-公开
    涂装和涂装方法

    公开(公告)号:US20130078378A1

    公开(公告)日:2013-03-28

    申请号:US13609893

    申请日:2012-09-11

    IPC分类号: B05D3/04 B05C9/12 B05C9/10

    摘要: According to one embodiment, a coating apparatus includes, a stage which supports an object of coating, and a coating head integrally includes a material discharge unit, which is movable relative to the stage and configured to discharge a coating material to the object of coating on the stage, and a gas injection unit, which, along with the material discharge unit, is movable relative to the stage and configured to inject a gas to the object of coating on the stage.

    摘要翻译: 根据一个实施例,涂覆装置包括:支撑涂覆物体的台,以及整体地包括材料排出单元的涂覆头,该材料排出单元可相对于载物台移动并且构造成将涂层材料排放到涂层物体上 所述台架和气体注入单元,其与所述材料排出单元一起可相对于所述台架移动并且被配置为向所述台架上的涂层物体注入气体。