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363 条记录 (耗时 0.023 秒)

    Apparatus and method for bonding substrates
    43.
    发明授权
    Apparatus and method for bonding substrates 有权

    公开(公告)号：US09613840B2

    公开(公告)日：2017-04-04

    申请号：US14238091

    申请日：2011-08-22

    申请人： Thomas Wagenleitner

    发明人： Thomas Wagenleitner

    IPC分类号： H01L21/673 ,  H01L21/683 ,  H01L21/67

    CPC分类号： H01L21/673 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T156/10

    摘要： This invention relates to a method and a device for temporary bonding of a first substrate with a second substrate. The device is comprised of a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface. The mounting apparatus has an outer ring section for controllable fixing of the first substrate. Deformation means are provided for controllable deformation of the first substrate. The deformation means act within the outer ring section. Bonding means are provided for bonding of the first substrate with the second substrate.

    Device for alignment of two substrates
    44.
    发明授权
    Device for alignment of two substrates 有权
    用于对准两个基板的装置

    公开(公告)号：US09576825B2

    公开(公告)日：2017-02-21

    申请号：US13497602

    申请日：2010-08-26

    申请人： Daniel Figura

    发明人： Daniel Figura

    IPC分类号： B65G1/133 ,  H01L21/67 ,  H01L21/68

    CPC分类号： H01L21/67092 ,  H01L21/67259 ,  H01L21/681

    摘要： Device and method for alignment of a first contact surface of a first substrate with a second contact surface of a second substrate which can be held on a second platform. The device includes first X-Y positions of first alignment keys located along the first contact surface, and second X-Y positions of second alignment keys which correspond to the first alignment keys and which are located along the second contact surface, wherein the first contact surface can be aligned based on the first X-Y positions in the first alignment position and the second contact surface can be aligned based on the second X-Y positions in the second alignment position.

    摘要翻译： 用于将第一基板的第一接触表面与可以保持在第二平台上的第二基板的第二接触表面对准的装置和方法。 该装置包括沿着第一接触表面定位的第一对准键的第一XY位置和对应于第一对准键并且沿着第二接触表面定位的第二对准键的第二XY位置，其中第一接触表面可以对齐 基于第一对准位置中的第一XY位置，并且第二接触表面可以基于第二对准位置中的第二XY位置对准。

    METHOD FOR COATING CAVITIES OF SEMICONDUCTOR SUBSTRATES
    45.
    发明申请
    METHOD FOR COATING CAVITIES OF SEMICONDUCTOR SUBSTRATES 有权
    用于涂覆半导体衬底的方法

    公开(公告)号：US20160365241A1

    公开(公告)日：2016-12-15

    申请号：US15118914

    申请日：2015-01-09

    申请人： EV GROUP E. THALLNER GMBH

    发明人： Andreas FEHKUHRER

    IPC分类号： H01L21/02 ,  B08B5/00 ,  B08B3/08 ,  B08B3/12 ,  H01L21/768 ,  B08B7/00

    CPC分类号： H01L21/02057 ,  B08B3/08 ,  B08B3/12 ,  B08B5/00 ,  B08B7/0014 ,  B08B7/0035 ,  H01L21/76898

    摘要： A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.

    摘要翻译： 一种用于在处理用于处理半导体衬底的至少一个表面的步骤的处理步骤之前，至少部分地穿过半导体衬底并提供用于永久涂覆和/或装备临时涂覆的涂层材料的空腔的方法。 此外，一种用于去除半导体衬底的空腔的临时涂层的方法，由此根据前述方法施加涂层，并且由此特别是紧接着之后进行空腔的永久性涂布和/或装备 。

    DEVICE FOR ALIGNMENT OF TWO SUBSTRATES
    47.
    发明申请
    DEVICE FOR ALIGNMENT OF TWO SUBSTRATES 审中-公开
    两个基板对准的装置

    公开(公告)号：US20160322249A1

    公开(公告)日：2016-11-03

    申请号：US15194652

    申请日：2016-06-28

    申请人： EV GROUP E. THALLNER GMBH

    发明人： Daniel Figura

    IPC分类号： H01L21/68 ,  H01L21/67

    CPC分类号： H01L21/67092 ,  H01L21/67259 ,  H01L21/681

    摘要： Device and method for alignment of a first contact surface of a first substrate with a second contact surface of a second substrate which can be held on a second platform. The device includes first X-Y positions of first alignment keys located along the first contact surface, and second X-Y positions of second alignment keys which correspond to the first alignment keys and which are located along the second contact surface, wherein the first contact surface can be aligned based on the first X-Y positions in the first alignment position and the second contact surface can be aligned based on the second X-Y positions in the second alignment position.

    摘要翻译： 用于将第一基板的第一接触表面与可以保持在第二平台上的第二基板的第二接触表面对准的装置和方法。 该装置包括沿着第一接触表面定位的第一对准键的第一XY位置和对应于第一对准键并且沿着第二接触表面定位的第二对准键的第二XY位置，其中第一接触表面可以对准 基于第一对准位置中的第一XY位置，并且第二接触表面可以基于第二对准位置中的第二XY位置对准。

    Method for the temporary connection of a product substrate to a carrier substrate
    49.
    发明授权
    Method for the temporary connection of a product substrate to a carrier substrate 有权
    用于将产品基板临时连接到载体基板的方法

    公开(公告)号：US09390956B2

    公开(公告)日：2016-07-12

    申请号：US14376460

    申请日：2013-01-17

    申请人： EV GROUP E. THALLNER GMBH

    发明人： Jurgen Burggraf ,  Gerald Mittendorfer

    IPC分类号： H05K1/02 ,  H01L21/683

    CPC分类号： H01L21/6835 ,  H01L2221/68309 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68381 ,  H05K1/0213

    摘要： A method for temporary connection of a product substrate to a carrier substrate comprised of the steps of: applying an interconnect layer to a product substrate receiving side of the carrier substrate in an interconnect surface section of the product substrate receiving side, applying an antiadhesion layer with low adhesion force to one interconnect side of the product substrate in an antiadhesion surface section of the interconnect side, the antiadhesion surface section corresponding to the interconnect surface section, in terms of area, wherein a receiving space is formed which is bordered by the interconnect layer and the carrier substrate as well as the product substrate and the antiadhesion layer accommodating structures which are provided on the interconnect side of the product substrate and which project from the interconnect side, aligning the product substrate relative to the carrier substrate and bonding of the interconnect layer to the antiadhesion layer on one contact surface.

    摘要翻译： 一种用于将产品基板临时连接到载体基板的方法，包括以下步骤：在产品基板接收侧的互连表面部分中将互连层施加到载体基板的产品基板接收侧，施加抗粘附层， 在互连面的抗粘接面部分中的产品基板的一个互连侧的低粘合力，对应于互连表面部分的抗粘附表面部分的面积方面，其中形成有接合空间，其被互连层 以及载体基板以及产品基板和抗粘合层容纳结构，其设置在产品基板的互连侧并且从互连侧突出，使产品基板相对于载体基板对准并且互连层 到一个接触surfa上的抗粘附层 ce。